Prober apparatus

• US 5,172,053 A
• Filed: 07/01/1991
• Issued: 12/15/1992
• Est. Priority Date: 02/24/1989
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Itoyama, Taketoshi
• Primary Examiner(s): Karlsen, Ernest F.
• Assistant Examiner(s): BURNS, WILLIAM
• Application Number:
  US07/726,725
• Time in Patent Office: 533 Days
• Field of Search: 324/72.5, 324/158 P, 324/158 F
• US Class Current: 324/750.19
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735

Abstract

A proper apparatus includes a test head for generating a test signal. A probe card is fixed removably on the test head. The probe card supplies the test signal to a test piece when the probe card electrically contacts the test piece, and tests electric characteristics of the test piece.

Claims

1. A prober apparatus for testing high-frequency characteristics of chips, a number of which are formed on a semiconductor wafer, one-by-one sequentially, said apparatus comprising:

a probe card having probes which are brought into electrical contact with terminals densely formed on the chips, to test the high-frequency characteristics of the chips;

a test head for generating a test signal in accordance with an instruction from a tester, and supplying the test signal to the chips through the probe card;

a support means, comprising a hinge for movably connecting said test head to the prober apparatus so as to allow the test head to be moved between a test position and a retreat position by movement of the test head;

a performance board forming a fixed surface of a housing of said test head facing said probe card, said performance board and said probe card being fixed relative to an external reference point;

a fixed immovable connecting means for detachably connecting the probe card directly to the stationary performance board;

a fixed immovable electrically coupling means for electrically connecting the probe card to the performance board;

a mounting table on which said semiconductor wafer to be tested is mounted;

an automatic alignment mechanism coupled to said mounting table, for performing alignment of reference points of said probe card and said mounting table, said automatic alignment mechanism moving only said mounting table in the directions of X, Y, Z and θ

, said test head and said probe card being maintained stationary;

means for operating said automatic alignment mechanism in accordance with a prestored data; and

a microscope inserted in a hole formed in said test head to enable observation of contact between the probes of said probe card and the terminals of one of said chips.

2. The apparatus according to claim 1, wherein said connecting means comprises screws.

3. The apparatus according to claim 1, wherein said electrically coupling means comprises pogo-pins.

4. The apparatus according to claim 1, wherein said electrically coupling means comprises contact pads.