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Method for monitoring the dimensions and other aspects linewidth thickness and discoloration of specular patterns

  • US 5,172,420 A
  • Filed: 05/11/1992
  • Issued: 12/15/1992
  • Est. Priority Date: 05/28/1991
  • Status: Expired due to Term
First Claim
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1. A method for inspecting a specular pattern on a substrate to monitor both the lateral dimensions and at least one other aspect of interest of the features in the pattern thereof, comprising the steps of:

  • (a) capturing the actual image of the pattern;

    (b) comparing the captured image to a first model, representing an image of a comparison pattern with the value of said aspect of interest in said model dilated to a maximum allowable value and the lateral dimensions of its features eroded to a minimum allowable value;

    (c) comparing the captured image to a second model, representing an image of a comparison pattern with the value of said aspect of interest in said model eroded to a minimum allowable value and the lateral dimensions of its features dilated to a maximum allowable value;

    (d) logically combining the results obtained by comparing the captured image to each of the first and second models; and

    (e) establishing whether the lateral dimensions and said aspect of interest of the pattern are within prescribed tolerance values in accordance with the results of the comparison.

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