Method of drying electronic components

• US 5,172,488 A
• Filed: 08/29/1991
• Issued: 12/22/1992
• Est. Priority Date: 09/05/1990
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Mae, Masataka, Okane, Masaaki
• Primary Examiner(s): Bennett, Henry A.
• Assistant Examiner(s): Gromada, Denise L. F.
• Application Number:
  US07/751,552
• Time in Patent Office: 481 Days
• Field of Search: 34/15, 34/17, 34/92, 34/5, 34/11
• US Class Current: 34/412
• CPC Class Codes: F26B 11/0445 having conductive heating arrangements, e.g. heated drum wall
• CPC Class Codes: F26B 11/049 with provisions for working under increased or reduced pressure, with or without heating
• CPC Class Codes: F26B 5/04 by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum F26B11/049 and F26B17/128 take precedence

Abstract

A method of drying plurality of electronic components, which have been washed with water. The components are introduced into a drum-type container, and the container is decompressed and rotated about a horizontally directed central axis so as to stir the plurality of electronic components. The container may be at least partially dipped in a heated liquid bath, so that the container is heated by the liquid.

Claims

1. A method of drying electronic components that have been exposed to water and are of a material that is not substantially damaged by stirring in a rotating container, comprising the steps of:

providing a container which is capable of storing a plurality of said electronic components;

introducing a plurality of said electronic components to be dried into said container; and

rotating said container so as to stir said plurality of electronic components, while decompressing said container in which said plurality of electronic components are contained.

2. A method of drying electronic components in accordance with claim 1, wherein said step of rotating said container includes the step of heating said container.

3. A method of drying electronic components in accordance with claim 2, wherein said electronic components are provided with electrodes on the surfaces thereof, and said heating step is carried out at a limited temperature so as to prevent said electrodes from oxidizing.

4. A method of drying electronic components in accordance with claim 3, wherein said temperature is limited to a range of substantially 70°

to 100°

C.

5. A method of drying electronic components in accordance with claim 2, wherein said heating step includes the step of at least partially dipping said container in a heated liquid bath.

6. A method of drying electronic components in accordance with claim 1, wherein said container is in the form of a drum.

7. A method of drying electronic components in accordance with claim 6, wherein said container is rotated about a central axis and said central axis is substantially horizontal in said step of rotating said container.

8. A method of drying electronic components in accordance with claim 1, wherein said container comprises baffles for improving said stirring of said electronic components.

9. A method of drying electronic components in accordance with claim 6, wherein said container comprises baffles for improving said stirring of said electronic components.