Arcuate profiled heatsink apparatus and method

• US 5,172,755 A
• Filed: 04/01/1992
• Issued: 12/22/1992
• Est. Priority Date: 04/01/1992
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Digital Equipment Corporation (HP Inc.)
• Inventors: Samarov, Victor M.
• Primary Examiner(s): Flanigan, Allen J.
• Application Number:
  US07/861,724
• Time in Patent Office: 265 Days
• Field of Search: 165/80.1-80.4, 165/185, 165/1, 118/724, 118/725, 118/728, 361/386
• US Class Current: 165/80.3
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

An arcuate profiled heatsink is disclosed, over which is flexed and attached a substrate on which are mounted heat producing, temperature sensitive electronic devices. Flexing the substrate to conform with the arcuate surface of the heatsink minimizes air pockets between the two, which would ordinarily result due to warpage resulting from the fabrication of the substrate. The interface between heatsink and substrate, therefore, has lower thermal resistance, thus, increasing thermal conductivity between heatsink and substrate, and increasing the amount of heat dissipated by the heatsink. Because no hard joining of the two parts is required, they may be separated for repair, and stress resulting from thermal expansion mismatch will not be transferred to the substrate.

Claims

1. A cooling apparatus for a heat generating device comprising:

a substrate, on which is mounted said heat generating device;

a heatsink including a convex arcuate surface, said arcuate surface curved along a single axis, the profile of said convex arcuate surface defined by the following equation;

space="preserve" listing-type="equation">Y=P * C * (X/L-(2 * (X.sup.3 /L.sup.3))+X.sup.4 /L.sup.4)

where;

P=a uniformly distributed load along the length L of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate;

L=the length of said convex arcuate surface of said heatsink;

X and Y=coordinates defining the curve with respect to a two-dimensional Cartesian coordinate system having an origin on said convex arcuate surface; and

means for maintaining said substrate in close contact with said arcuate surface of said heatsink.

2. The cooling apparatus according to claim 1 wherein the value for said uniformly distributed load (P) is selected such that the maximum Y value is:

equal to or greater than an initial warpage of said substrate; and

limited such that the flexure in said substrate following attachment to said heatsink does not introduce stress in said substrate that exceeds a small percentage of the flexural strength of said substrate.

3. The cooling apparatus according to claim 1 wherein said heatsink comprises a thermally conductive material.

4. The cooling apparatus according to claim 3 wherein said thermally conductive material is aluminum.

5. The cooling apparatus according to claim 1 further comprising a thermally conductive agent between said substrate and said heatsink.

6. The cooling apparatus according to claim 5 wherein said thermally conductive agent is polyphenyl ether.

7. The cooling apparatus according to claim 1 wherein said heatsink further comprises heat dissipating fins or pins.

8. The cooling apparatus according to claim 1 wherein said substrate is rectangular.

9. The cooling apparatus according to claim 8 wherein said means for maintaining comprises notched retainer strips and screws.

10. The cooling apparatus according to claim 1 wherein said substrate comprises a thermally conductive dielectric material.

11. The cooling apparatus according to claim 10 wherein said thermally conductive dielectric material is aluminum oxide.

12. A cooling apparatus for a heat generating device comprising:

a substrate, on which is mounted said heat generating device;

a heatsink including a convex arcuate surface, said convex arcuate surface being curved along a width of said heatsink and along a length of said heatsink, the profile of said convex arcuate surface along said width of said heatsink is defined by the following equation;

space="preserve" listing-type="equation">Y=P * C * (X/a-(2 * (X.sup.3 /a.sup.3))+X.sup.4 /a.sup.4)

where;

P=a uniformly distributed load along said width of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate.

a=the width of said convex arcuate surface of said heatsink;

X and Y=coordinates defining the curve with respect to a three-dimensional Cartesian coordinate system having an origin on said convex arcuate surface, with an X axis extending along said width of said heatsink, and a Y axis perpendicular to said X axis; and

means for maintaining said substrate in close contact with said arcuate surface of said heatsink.

13. The cooling apparatus of claim 12, wherein the profile of said convex arcuate surface along said length of said heatsink is defined by the following equation:

space="preserve" listing-type="equation">Y=P * C * (Z/b-(2 * (Z.sup.3 /b.sup.3))+Z.sup.4 /b.sup.4)

where;

P=a uniformly distributed load along said length of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate.

b=the length of said convex arcuate surface of said heatsink;

Z and Y=coordinates defining the curve with respect to a three-dimensional Cartesian coordinate system having an origin on said convex arcuate surface, with a Z axis extending along said length of said heatsink and said Y axis perpendicular to said Z axis.

14. The cooling apparatus according to claim 13 wherein the value for said uniformly distributed load (P) is selected such that the maximum Y value is:

equal to or greater than an initial warpage of said substrate; and

limited such that the flexure in said substrate following attachment to said heatsink does not introduce stress in said substrate that exceeds a small percentage of the flexural strength of said substrate.

15. The cooling apparatus according to claim 14 wherein said small percentage of the flexural strength of said substrate is less than 15%.

16. The cooling apparatus according to claim 15 wherein said heatsink comprises a thermally conductive material.

17. The cooling apparatus according to claim 16 wherein said thermally conductive material is aluminum.

18. The cooling apparatus according to claim 17 wherein said heatsink further comprises heat dissipating fins or pins.

19. A method of producing a cooling apparatus for a heat generating device mounted on a substrate, comprising the steps of:

measuring the initial warpage of said substrate;

if the initial warpage of said substrate is not less than a predetermined value, discarding said substrate;

if the initial warpage of said substrate is less than said predetermined value, flexing said substrate over a convex arcuate surface of a heatsink and attaching said substrate to said heatsink using an attachment means such that said substrate and said heatsink are in close thermal contact.

20. The method as defined in claim 19, wherein said convex arcuate surface of said heatsink is curved along a single axis, and wherein the profile of said convex arcuate surface is defined by the following equation:

space="preserve" listing-type="equation">Y=P * C * (X/L-(2 * (X.sup.3 /L.sup.3))+X.sup.4 /L.sup.4)

where;

P=a uniformly distributed load along the length L of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate;

Y=the length of said convex arcuate surface of said heatsink; and

X and Y=coordinates defining the curve with respect to a two-dimensional Cartesian coordinate system having an origin on said convex arcuate surface. ,;

21. The method as defined in claim 19, wherein said convex arcuate attachment surface of said heatsink is curved along a width of said heatsink and along a length of said heatsink, wherein the profile of said convex arcuate surface along said width of said heatsink is defined by the following equation:

space="preserve" listing-type="equation">Y=P * C * (X/a-(2 * (X.sup.3 /a.sup.3))+X.sup.4 /a.sup.4)

where;

P=a uniformly distributed load along said width of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate.

a=the width of said convex arcuate surface of said heatsink;

X and Y=coordinates defining the curve with respect to a three-dimensional Cartesian coordinate system having an origin on said convex arcuate surface, with an X axis extending along said width of said heatsink, and a Y axis perpendicular to said X axis, and wherein the profile of said convex arcuate surface along said length of said heatsink is defined by the following equation;

space="preserve" listing-type="equation">Y=P * C * (Z/b-(2 * (Z.sup.3 /b.sup.3))+Z.sup.4 /b.sup.4)

where;

P=a uniformly distributed load along said length of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate.

b=the length of said convex arcuate surface of said heatsink;

Z and Y=coordinates defining the curve with respect to a three-dimensional Cartesian coordinate system having an origin on said convex arcuate surface, with a Z axis extending along said length of said heatsink, and said Y axis perpendicular to said Z axis.

22. A method of producing a cooling apparatus for a heat generating device mounted on a substrate, comprising the steps of:

determining relevant characteristics of said substrate, said relevant characteristics of said substrate including the length of said substrate, the Young'"'"'s modulus of the material of said substrate, the moment of inertia of said substrate, the initial warpage of said substrate, and the flexural strength of said substrate;

designing and producing a heatsink with a convex arcuate surface based on said characteristics of said substrate; and

flexing said substrate over said convex arcuate surface of said heatsink and attaching said substrate to said heatsink using an attachment means such that said substrate and said heatsink are in close thermal contact.

23. The method as defined in claim 22, wherein said designing and producing said heatsink comprises calculating a curve that defines said convex arcuate surface of said heatsink by selecting a value for P in the equation:

space="preserve" listing-type="equation">Y=P * C * (X/L-(2 * (X.sup.3 /L.sup.3))+X.sup.4 /L.sup.4)

where;

P=a uniformly distributed load along the length L of said convex arcuate surface of said heatsink;

C=the flexural stiffness constant of said substrate;

L=the length of said convex arcuate surface of said heatsink; and

X and Y=coordinates defining the curve with respect to a two-dimensional Cartesian coordinate system having an origin on said convex arcuate surface.

24. The method as defined in claim 23, wherein said value for P is selected such that the equation defining said convex arcuate surface of said heatsink has a maximum Y value that exceeds the initial warpage of said substrate, and wherein said value for P is selected such that the maximum Y value in said curve does not cause stress in said substrate following attachment to said heatsink exceeding 15% of the flexural strength of said substrate.