Molded IC card

• US 5,173,840 A
• Filed: 04/25/1991
• Issued: 12/22/1992
• Est. Priority Date: 05/07/1990
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Murakami, Osamu, Ochi, Katsunori, Kodai, Shojiro
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): WHANG, YOUNG
• Application Number:
  US07/691,304
• Time in Patent Office: 607 Days
• Field of Search: 361/380, 361/392, 361/394, 361/395, 361/397, 361/399, 361/402, 361/424, 361/401, 174/52.2, 357/72, 357/80, 364/708, 364/900, 235/492, 235/488, 235/487, 235/489
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.

Claims

1. An IC card comprising:

a surface plate forming one surface of said IC card,

a circuit board attached to an internal surface of said surface plate and incorporating a semiconductor element,

a frame formed to extend along a peripheral edge of said surface plate and to surround said surface plate and said circuit board, and

a filler which fills a space defined by said frame and said surface plate and forms a rear surface of said IC card; and

wherein a portion of an inner peripheral surface of said frame projects into said filler.

2. An IC card according to claim 1, wherein said inward projection is formed continuously along an outer peripheral edge of said circuit substrate.

3. The IC card according to claim 2, wherein said inward projection has a through hole extending from a front side of said IC card to a rear side thereof.

4. The IC card according to claim 1, wherein said inward projection is partially formed along an outer peripheral edge of said circuit board.

5. The IC card according to claim 4, wherein said inward projection has a through hole extending from a front side of said IC card to a rear side thereof.

6. The IC card according to claim 1, wherein said circuit board has a connection terminal penetrating said surface plate and externally exposed.

7. The IC card according to claim 1, wherein said portion of said inner peripheral surface of said frame projecting into said filler is dumbbell-shaped.

8. The IC card comprising:

a circuit board incorporating a semiconductor element,

a frame formed to extend along a peripheral edge of said circuit board and to surround said circuit board, and

a filler which fills a space defined by said frame and forms a surface of said IC card,

wherein a portion of an inner peripheral surface of said frame projects into said filler to prevent separation of the filler and the frame from each other.

9. The IC card according to claim 8, wherein, said portion of said inner peripheral surface of said frame contacts said circuit board.