Electrical connecting member and electric circuit member

• US 5,174,766 A
• Filed: 12/19/1991
• Issued: 12/29/1992
• Est. Priority Date: 05/11/1990
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Yoshizawa, Tetsuo, Kadokura, Susumu
• Primary Examiner(s): MCGLYNN, JOSEPH
• Application Number:
  US07/810,444
• Time in Patent Office: 376 Days
• Field of Search: 439/86-91
• US Class Current: 439/91
• CPC Class Codes: H01L 2224/81101 as prepeg comprising a bump connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/09945 Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2203/135 Electrophoretic deposition of insulating material
• CPC Class Codes: H05K 3/321 by conductive adhesives

Abstract

An electrical connecting member comprising a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in the holder and having ends exposed from the holder, and wherein a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on the end of each conductive member exposed from one surface of the holder. A conductive adhesive layers and the other ends of the conductive members exposed from the other surface of the holder are flush with or protruded from the surfaces of the holder.

Claims

1. An electrical connecting member comprising:

a holder made of electrically insulative material; and

a plurality of conductive members electrically insulated from each other and embedded in said holder and having ends exposed from said holder; and

wherein

a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on the end of each conductive member exposed from one surface of said holder, and said conductive adhesive layers and the other ends of said conductive members exposed from the other surface of said holder are flush with or protruded from the surfaces of said holder.

2. An electrical connecting member according to claim 1, wherein a wiring is provided in and/or on the surface of said holder so that a predetermined number of said conductive members among said plurality of conductive members are electrically communicated with each other.

3. An electrical connecting member according to claim 1, wherein an average diameter of particles in said pulverized metal powder included in said conductive adhesive layer is 0.01-2 μ

m and an average diameter of particles in said metalized ceramic powder is 0.1-5 μ

m, and the content of one or both of said pulverized metal powder and metalized ceramic powder included in said conductive adhesive layer is 30-80 wt%.

4. An electric circuit member comprising:

an electrical connecting member including a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in said holder and having ends exposed from said holder, and wherein a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on one end of each conductive member exposed from one surface of said holder, and said conductive adhesive layers and the other ends of said conductive members exposed from the other surface of said holder are flush with or protruded from the surfaces of said holder;

a first electric circuit part including connecting portions which are electrically connected to said conductive adhesive layers exposed from the one surface of said holder of said electrical connecting member; and

a second electric circuit part including connecting portions which are electrically connected to the other ends of said conductive members exposed from the other surface of said holder of said electrical connecting member.

5. An electric circuit member according to claim 4, wherein a wiring is provided in and/or on the surface of said holder so that a predetermined number of said conductive members among said plurality of conductive members are electrically communicated with each other.

6. An electric circuit member according to claim 4, wherein the conductive adhesive layers eutectoidally formed from the adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on said connecting portions of said electric circuit parts.

7. An electric circuit member according to claim 4, wherein the conductive adhesive layers eutectoidally formed from the adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on a surface of said electric circuit part opposite to a surface thereof on which said connecting portions are arranged.

8. An electric circuit member according to claim 4, wherein an average diameter of particles in said pulverized metal powder included in said conductive adhesive layer is 0.01-2 μ

m and an average diameter of particles in said metalized ceramic powder is 0.1-5 μ

m, and the content of one or both of said pulverized metal powder and metalized ceramic powder included in said conductive adhesive layer is 30-80 wt%.

9. An electric circuit member according to claim 4, wherein said electric circuit parts comprise either a casing, a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame or a semi-conductor element.

10. An electrical connecting member comprising:

a holder made of electrically insulative material; and

a plurality of conductive members electrically insulated from each other and embedded in said holder and having ends exposed from said holder; and

wherein

conductive adhesive layers eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on both ends of each conductive member exposed from both surfaces of said holder, and said conductive adhesive layers are flush with or protruded from the surfaces of said holder.

11. An electrical connecting member according to claim 10, wherein a wiring is provided in and/or on the surface of said holder so that a predetermined number of said conductive members among said plurality of conductive members are electrically communicated with each other.

12. An electrical connecting member according to claim 10, wherein an average diameter of particles in said pulverized metal powder included in said conductive adhesive layer is 0.01-2 μ

m and an average diameter of particles in said metalized ceramic powder is 0.1-5 μ

m, and the content of one or both of said pulverized metal powder and metalized ceramic powder included in said conductive adhesive layer is 30-80 wt%.

13. An electric circuit member comprising:

an electrical connecting member including a holder made of electrically insulative material and a plurality of conductive member electrically insulated from each other and embedded in said holder and having ends exposed from said holder, and wherein conductive adhesive layers eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on both ends of each conductive member exposed from both surfaces of said-holder, and said conductive adhesive layers are flush with or protruded from the surfaces of said holder;

a first electric circuit part including connecting portions which are electrically connected to said conductive adhesive layers exposed from the one surface of said holder of said electrical connecting member; and

a second electric circuit part including connecting portions which are electrically connected to said conductive adhesive layers members exposed from the other surface of said holder of said electrical connecting member.

14. An electric circuit member according to claim 13, wherein a wiring is provided in and/or on the surface of said holder so that a predetermined number of said conductive members among said plurality of conductive members are electrically communicated with each other.

15. An electric circuit member according to claim 13, wherein the conductive adhesive layers eutectoidally formed from the adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on said connecting portions of said electric circuit parts.

16. An electric circuit member according to claim 13, wherein the conductive adhesive layers eutectoidally formed from the adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on a surface of said electric circuit part opposite to a surface thereof on which said connecting portions are arranged.

17. An electric circuit member according to claim 13, wherein an average diameter of particles in said pulverized metal powder included in said conductive adhesive layer is 0.01-2 μ

m and an average diameter of particles in said metalized ceramic powder is 0.1-5 μ

m, and the content of one or both of said pulverized metal powder and metalized ceramic powder included in said conductive adhesive layer is 30-80 wt%.

18. An electric circuit member according to claim 13, wherein said electric circuit parts comprise either a casing, a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame or a semi-conductor element.

19. An electric circuit member comprising:

an electrical connecting member including a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in said holder and having ends exposed from said holder, and wherein both ends of each conductive member are flush with or protruded from the surfaces of said holder;

a substrate including connecting portions wherein conductive adhesive layers eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on metal electrodes of a wiring pattern arranged on said electrically insulative material and which are electrically connected to the ends of said conductive members exposed from one surface of said holder of said electrical connecting member; and

an electric circuit part including connecting portions which are electrically connected to the ends of said conductive members exposed from the other surface of said holder of said electrical connecting member.

20. An electric circuit member according to claim 19, wherein a wiring is provided in and/or on the surface of said holder so that a predetermined number of said conductive members among said plurality of conductive members are electrically communicated with each other.

21. An electric circuit member according to claim 19, wherein the conductive adhesive layers eutectoidally formed from the adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method are disposed on a metal surface of said substrate opposite to a surface thereof on which said conductive adhesive layers are arranged.

22. An electric circuit member according to claim 19, wherein an average diameter of particles in said pulverized metal powder included in said conductive adhesive layer is 0.01-2 μ

m and an average diameter of particles in said metalized ceramic powder is 0.1-5 μ

m, and the content of one or both of said pulverized metal powder and metalized ceramic powder included in said conductive adhesive layer is 30-80 wt%.

23. An electric circuit member according to claim 19, wherein said electric circuit part comprises either a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame or a semi-conductor element.

24. An electric circuit member according to claim 19, wherein said substrate comprises either a casing, a circuit board or a lead frame.