Modular socket apparatus

• US 5,176,525 A
• Filed: 04/17/1991
• Issued: 01/05/1993
• Est. Priority Date: 04/17/1991
• Status: Expired due to Fees

• Current Assignee: Leannoux Properties AG LLC (Intellectual Ventures LLC)
• Original Assignee: Data I/O Corporation
• Inventors: Nierescher, David S., Moore, Loyd C., Gray, Alan W.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US07/686,545
• Time in Patent Office: 629 Days
• Field of Search: 439/55, 439/68-73, 439/525, 439/526, 439/66, 439/330, 439/331, 324/158 F
• US Class Current: 439/68
• CPC Class Codes: G01R 1/0433 Sockets for IC's or transistors
• CPC Class Codes: H05K 7/1007 with means for increasing contact pressure at the end of engagement of coupling parts

Abstract

Modular socket technology is disclosed, which includes a contact board mounted to an electronic device for receiving voltage and current signals to be transmitted from the electronic device to a semiconductor circuit. A compression coupler is provided for receiving the semiconductor circuit. The compression coupler includes a printed circuit board having a plurality of conductors mounted to a first side thereof, and extending to a second side thereof for providing electrical contact between the leads of the semiconductor circuit and the contact board. The contact board further includes a resilient conductor adapted to mechanically and electrically engage the plurality of conductors of the compression coupler, thereby to couple voltage and current signals from the electronic device to the semiconductor circuit. The modular socket apparatus may further include a semiconductor carrier for receiving the semiconductor circuit. The compression coupler includes an elastic conductor for conducting voltage and current signals from the plurality of conductors to the leads of the semiconductor circuit. The semiconductor carrier includes a compression pad for engaging the semiconductor circuit to compress the leads of the semiconductor circuit to the elastic conductor, thereby to make mechanical and electrical contact between the leads of the semiconductor circuit and the elastic conductor so that voltage and current signals may be transmitted from the leads of the semiconductor circuit to the electronic device.

Claims

1. An electronic device constructed for selective coupling to a plurality of semiconductor circuits wherein each of the plurality of semiconductor circuits has a unique package construction, and wherein each of the plurality of semiconductor circuits includes a plurality of leads, said electronic device comprising:

a housing;

a relay board having first and second sides and being secured interior of said housing, said relay board including a plurality of relays mounted on said first side thereof, each having first and second leads and being responsive to a control signal for coupling said first lead to said second lead, a first portion of said plurality of relays having said first lead coupled to a source of voltage and a second portion of said plurality of relays having said first lead coupled to a reference potential, said relay board further including a plurality of compliant pin contacts each being substantially electrically conducting, each of said plurality of compliant pin contacts having first and second opposing ends, said plurality of compliant pin contacts being positioned to extend through said relay board from said first side to said second side so that said first ends of said plurality of compliant pin contacts are positioned on said first side of said relay board and so that said second ends of said plurality of compliant pin contacts are positioned on said second side of said relay board, a relay portion of said plurality of compliant pin contacts having said first end electrically coupled to respective ones of said second leads of said plurality of relays;

a generally rectangular compliant pin assembly having first and second surfaces, said compliant pin assembly including a plurality of through holes extending therethrough, each of said plurality of through holes comprising a substantially cylindrical chamber having first and second rims positioned respectively at said first and second surfaces of said compliant pin assembly, each of said first and second rims projecting inwardly of said through holes substantially parallel to said first and second surfaces, thereby to define a plurality of compliant pin chambers, said compliant pin assembly further including first and second guide channels positioned at opposite sides of said compliant pin assembly;

a plurality of compliant pins each being substantially electrically conductive, said plurality of compliant pins each being seated within a respective one of said plurality of compliant pin chambers, each said compliant pin including first and second generally cylindrical ends and an intermediate portion, each of said first and second ends of said plurality of compliant pins being sized to extend outward from said compliant pin assembly beyond said first and second rims of said plurality of through holes, said intermediate portion of said plurality of compliant pins being sized to retain said plurality of compliant pins within said plurality of compliant pin chambers, each of said plurality of compliant pins further including spring means for biasing said first end away from said second end, said compliant pin assembly being secured to said relay board so that said first surface of said compliant pin assembly faces outwardly of said housing and so that a preselected portion of said plurality of compliant pins are in electrical contact with a preselected portion of said plurality of compliant pin contacts;

a generally rectangular compression handle having first and second opposing sides, a forward end and a rearward end, that define a generally rectangular compression chamber, said compression handle including first and second guide rails projecting inwardly of said first and second opposing sides, said first and second guide rails being slidably coupled to said first and second guide channels thereby to slidably couple said compression handle to said compliant pin assembly, a first hand grip being positioned at said forward end of said compression handle for enabling a user to slide said compression handle along said compliant pin assembly, said compression handle further including first and second compression flanges projecting inwardly of said first and second sides thereof and adapted to be spaced from said first surface of said compliant pin assembly, each said first and second compression flange having a first tapered end portion positioned proximate said rearward end of said compression handle;

a generally rectangular compression ring sized to be removably positioned in said compression chamber, said compression ring having first and second opposing sides, a forward end, a rearward end, a semiconductor side and a compliant pin assembly side, a printed circuit board having first and second sides being mounted on said compliant pin assembly side of said compression ring with said first side of said printed circuit board facing outward of said compression ring, said printed circuit board including a plurality of substantially electrically conducting board contacts positioned on said first side thereof and adapted to mate with a selected portion of said compliant pins, said compression ring further including first and second engaging flanges positioned at said first and second sides of said compression ring each having a tapered end portion proximate said forward end portion of said compression ring for engaging said first and second compression flanges of said compression handle thereby to compress said compression ring to said compliant pin assembly and electrically couple said board contacts with said selected portion of said compliant pins, said compression ring further including a second hand grip positioned at said forward end of said compression ring for enabling a user to grip said first and second hand grips to slide said compression handle along said compliant pin assembly, thereby to compress said compression ring to said compliant pin assembly, said compression ring further including connector means for receiving a semiconductor circuit, said connector means having a plurality of electrical conductors constructed for electrical contact with the leads of the semiconductor circuit, said plurality of electrical conductors being electrically coupled to said plurality of board contacts, said printed circuit board including a plurality of registration through holes extending from said first side to said second side thereof;

a plurality of registration pins mounted to said compliant pin assembly for engaging said registration through holes of said compression ring to align said compression ring with said compliant pin assembly to ensure alignment of said board contacts with said selected plurality of said compliant pins;

a plurality of pin driver means coupled for providing electrical voltages and currents to a third portion of said compliant pin contacts mounted to said relay board wherein the electrical voltages and currents are provided for programming the semiconductor circuit mounted in said connector means of said compression ring; and

data processing means for providing said control signals to said first and second portion of said plurality of relays to couple selected ones of said compliant pin contacts to said source of voltage and selected ones of said compliant pin contacts to said reference potential, said data processing means being further constructed for providing structure and program data and signals to said plurality of pin driver means for controlling said pin driver means for programming of the semiconductor circuit mounted in said connector means of said compression ring.

2. The electronic device as recited in claim 1 wherein said connector means comprises a dual in-line package (DIP) socket for receiving semiconductor circuits having a standard dual in-line package construction.

3. The electronic device as recited in claim 1 wherein said connector means comprises:

a lead pattern etched upon said second side of said printed circuit board, said lead pattern including four sides wherein each one of said four sides includes a plurality of substantially parallel leads, said four sides being etched in a generally rectangular configuration with said substantially parallel leads of adjacent sides having a generally orthogonal relationship, each one of said four sides further including first and second ends and an intermediate portion wherein said substantially parallel leads etched on said intermediate portion of each of said four sides extend inwardly of said lead pattern farther than said substantially parallel leads at said first and second ends, said substantially parallel leads of said lead pattern being electrically coupled to said board contacts;

an elastomeric pad having first and second sides, said elastomeric pad being mounted to said printed circuit board with said first side thereof proximate said lead pattern, said elastomeric pad including a plurality of wires extending from said first side to said second side for conducting electricity from said second side to said lead pattern;

a registration through hole extending from said semiconductor side of said compression ring to said compliant pin assembly side thereof, a recess in said semiconductor side of said compression being constructed about the periphery of said registration through hole;

a receving collar positioned on said semiconductor side of said compression ring intermediate said rearward end and said recess about the periphery of said registration through hole, said receiving collar having a receiving chamber positioned with a receiving chamber opening facing said forward end of said compression ring; and

a securing clip mounted to said semiconductor side of said compression ring intermediate said recess about the periphery of said registration through hole and said forward end of said compression ring, said securing clip including an engagement end positioned proximate said registration through hole and a gripping end positioned remote of said registration through hole, said securing clip being mounted to pivot about an axis extending from said first side to said second side of said compression ring and including a spring biasing said engagement end proximate said semiconductor side of said compression ring and biasing said gripping end remote from said semiconductor side.

4. The electronic device as recited in claim 3, further comprising a semiconductor carrier for mounting a semiconductor circuit to said compression ring, said semiconductor carrier comprising:

a bottom portion having first and second sides and a semiconductor through hole extending from said first side to said second side, said semiconductor carrier being adapted to be coupled to said compression ring with said first side proximate said compression ring, said first side including a boss about said semiconductor through hole adapted to mate with said recess of said compression ring thereby to register said semiconductor carrier with said compression ring, a first hinge portion being mounted to said bottom portion; and

a top portion having first and second sides, a second hinge portion adapted to mate with said first hinge portion and being rotatably mounted thereto by a hinge pin thereby rotatably mounting said top portion to said bottom portion with said first side of said top portion proximate said second side of said bottom portion, said top portion having a compression pad mounted to said first side thereof and positioned to be proximate said semiconductor through hole for compressing a semiconductor circuit positioned therein against said elastomeric pad of said compression ring thereby to make electrical contact between the leads of the semiconductor circuit and said plurality of wires of said elastomeric pad, said top portion further including a retention groove on said first side opposite said second hinge portion and constructed to mate with said engagement end of said securing clip, said first and second hinge portions being constructed to mate with said receiving chamber of said compressing ring so that said semiconductor carrier may be rotated into engagement with said compression ring and secured therein by said securing clip.

5. An electronic device constructed for selective coupling to a plurality of semiconductor circuits wherein each of the plurality of semi conductor circuits has a unique circuit package construction and wherein each of the plurality of semiconductor circuits includes a plurality of leads, said electronic device comprising:

a housing;

electronic circuit means for generating voltage and current signals to be provided to the semiconductor circuit;

compression coupling means for receiving the semiconductor circuit, said compression coupling means including printed circuit board means having first and second sides and constructed for removably mounting the semiconductor circuit on a first side of said printed circuit board means, said printed circuit board means including a first plurality of conductor means for coupling to the leads of the semiconductor circuit, said first plurality of conductor means including a plurality of contacts positioned on said second side of said printed circuit board means opposite said first side; and

contact board means for removably receiving said compression coupling means, said contact board means being fixed to said housing and including a second plurality of conductor means for transmitting voltages and currents between said electronic circuit means and a selective portion of said plurality of contact of said compression coupling means, said contact board means further including first and second guide channels positioned at opposite sides thereof, said compression means comprising handle means for compressing said compression coupling mean to said contact board means, said handle means including first and second guide rail slideably coupled to said first and second guide channels thereby to slideably couple said handle means to said contact board means, said handle means also including flange means for engaging said compression coupling means for compression said compression coupling means to said contact board means, and first hand grip means mounted to said handle means for enabling a user to slide said handle means along said contact board means.

6. The electronic device as recited in claim 5, further comprising elastic coupling means mounted to said printed circuit board proximate said lead pattern for springable and electrical engagement with the leads of the semiconductor circuit thereby to conduct voltage and current signals between said lead pattern and the leads of the semiconductor circuit.

7. The electronic device as recited in claim 6, further comprising compressing means for compressing the semiconductor circuit to said elastic coupling means of said compression coupling means, said elastic coupling means providing compensation for any lack of coplanarity in said lead pattern and the leads of the semiconductor circuit.

8. The electronic device as recited in claim 7 wherein said compressing means comprises semiconductor carrier means for receiving the semiconductor circuit, said semiconductor carrier means including a compression pad adapted to engage the semiconductor circuit for compressing the leads of the semiconductor circuit to said elastic coupling means, said compression coupling means including means for receiving said semiconductor carrier means and for compressing said semiconductor carrier means to said printed circuit board so that said compression pad engages the semiconductor circuit and compresses the leads of the semiconductor circuit to said elastic coupling means.

9. The electronic device as recited in claim 8, further comprising registration means for positioning said semiconductor carrier means with respect to said compression coupling means so that the leads thereof are in registration with the leads of said lead pattern.

10. The electronic device as recited in claim 9, further comprising a plurality of semiconductor carrier means each being constructed to carry semiconductor circuits having a unique package configuration wherein each of said plurality of semiconductor carrier means is compressibly engagable with said compression coupling means.

11. The electronic device as recited in claim 5, wherein said compression coupling means comprises a dual in-line package (DIP) socket mounted to said first side of said printed circuit board means for receiving semiconductor circuits having a standard dual in-line package construction.

12. The electronic device as recited in claim 5 wherein said contact board means includes a compression surface and wherein said second plurality of conductor means comprises resilient coupling means positioned proximate said compression surface for springable and electrical engagement with said plurality of contacts of said compression coupling means thereby to conduct voltage and current signals between said compression coupling means and said contact board means.

13. The electronic device as recited in claim 12 wherein said contact board means includes a control surface opposite said compression surface and wherein said resilient coupling means further comprises means for conducting voltage and current signals through said contact board means in a direction substantially normal to said compression and control surfaces.

14. The electronic device as recited in claim 13 wherein said resilient coupling means comprises compliant pin means for engaging said plurality of contacts of said compression coupling means and making electrical contact therebetween, said plurality of compliant pin means being slidably mounted to said contact board means for reciprocal motion in a direction normal to said compression surface, said plurality of compliant pin means being biased outward from said compression surface.

15. The electronic device as recited in claim 12, further comprising compression means for engaging said compression coupling means and for compressing said compression coupling means to said compression surface of said contact board means so that said resilient coupling means mechanically and electrically engage said plurality of contacts of said compression coupling means.

16. The electronic device as recited in claim 15 wherein said compression means includes means for providing a compression force to said compression coupling means and wherein said compression force is applied in a direction substantially normal to said compression surface of said contact board means.

17. The electronic device as recited in claim 5 wherein said compression coupling means further comprises mating flange means for engaging said flange means of said contact board means thereby to compress said compression coupling means to said contact board means and second hand grip means for enabling a user to grip said first and second hand grip means to slide said handle means along said contact board means.

18. The electronic device as recited in claim 5, further comprising registration means for positioning said compression coupling means with respect to said contact board means so that said plurality of contacts of said compression coupling means make electrical contact with said coupling means of said contact board means.

19. A compression coupler for removably coupling a plurality of semiconductor circuits to an electronic device wherein the electronic device includes a plurality of conductors for transmitting voltage and current signal to and from the electronic device and wherein the plurality of semiconductor circuits are of differing configurations and each include a plurality of leads, said compression coupler comprising:

circuit board means for physically and electrically interfacing the plurality of semiconductor circuits with the electronic device, said circuit board means having first and second sides, said first side including connector means for removably receiving the plurality of semiconductor circuits;

a plurality of contacts mounted to said circuit board means and positioned for making electrical contact with the plurality of conductors of the electronic device; and

a plurality of conductor means for electrically coupling the leads of the semiconductor circuits with said plurality of contacts, said plurality of conductor means including a lead pattern positioned on said first side of said circuit board means, said lead pattern including four sides wherein each one of said four sides includes a plurality of substantially parallel leads, said four sides being positioned in a generally rectangular configuration with said substantially parallel leads of adjacent sides having a generally orthogonal relationship, each of said four sides further including first and second ends and an intermediate portion wherein said substantially parallel leads etched on said intermediate portion of each one of said four sides extends inwardly of said lead pattern farther than said substantially parallel leads at said first and second ends so that said plurality of leads will electrically mate with the plurality of leads of the plurality of semiconductor circuits, said substantially parallel leads of said lead pattern being electrically coupled to said plurality of contacts for electrically coupling the leads of the semiconductor circuits with the electronic device.

20. The compression coupler as recited in claim 19 wherein said connector means comprises a dual in-line package (DIP) socket mounted to said first side of said printed circuit board means for receiving semiconductor circuits having a standard dual in-line package construction.

21. The compression coupler as recited in claim 20, further comprising elastic coupling means mounted for providing springable and electrical engagement between the leads of the semiconductor circuit and said plurality of conductor means thereby to conduct voltage and current signals between the plurality of conductors of the contact board and the leads of the semiconductor circuit.

22. The compression coupler as recited in claim 21, further comprising compressing means for compressing the semiconductor circuit to said elastic coupling means of said compression coupling means.

23. The compression coupler as recited in claim 22 wherein said plurality of coupling means further comprises a lead pattern etched to said first side of said printed circuit board said lead pattern including a plurality of leads configured to electrically mate with the leads of a plurality of semiconductor circuits wherein the plurality of semiconductor circuits have differing package configurations, said elastic coupling means being positioned proximate said lead pattern to conduct voltage and current signals between the leads of the semiconductor circuit and said lead pattern.

24. A modular socket apparatus for removably coupling a plurality of semiconductor circuits to an electronic device wherein the plurality of semiconductor circuits have differing package constructions and wherein each of the plurality of semiconductor circuits includes a plurality of leads, the electronic device for providing at least first and second electrical signals to the plurality of semiconductor circuits, said modular socket apparatus comprising:

circuit board means for interfacing the plurality of semiconductor circuits with the electronic device, said circuit board means having first and second sides, said first side including connector means for removably receiving the plurality of semiconductor circuits, said circuit board means further including a plurality of contacts;

a lead pattern positioned on said first side of said circuit board means, said lead pattern including four sides wherein each one of said four sides includes a plurality of substantially parallel leads, said four sides being positioned in a generally rectangular configuration with said substantially parallel leads of adjacent sides having a generally orthogonal relationship, each of said four sides further including first and second ends and an intermediate portion wherein said substantially parallel leads etched on said intermediate portion of each one of said four sides extends inwardly of said lead pattern farther than said substantially parallel leads at said first and second ends so that said plurality of leads will electrically mate with the plurality of leads of the plurality of semiconductor circuits, said substantially parallel leads of said lead pattern being electrically coupled to said plurality of contacts for electrically coupling the leads of the semiconductor circuits with the plurality of contacts; and

data processing means for the at least first and second electrical signals, said data processing means being responsive to user provided input to selectively couple the at least first and second electrical signals to said plurality of contacts so that different ones of the at least first and second electrical signals can be provided to selective ones of said plurality of contacts.