Method and apparatus for testing electrical connectors

• US 5,177,555 A
• Filed: 03/28/1991
• Issued: 01/05/1993
• Est. Priority Date: 03/28/1991
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Digital Equipment Corporation (HP Inc.)
• Inventors: Stratton, Mark D., Laird, Terri G.
• Primary Examiner(s): Turner, Samuel A.
• Application Number:
  US07/676,794
• Time in Patent Office: 649 Days
• Field of Search: 356/355, 356/35.5, 356/33, 356/345, 356/351, 250/227.19, 250/227.27, 73/705, 73/657, 73/800
• US Class Current: 356/35.5
• CPC Class Codes: G01L 5/0057 measuring forces due to spring-shaped elements
• CPC Class Codes: G01R 31/68 Testing of releasable connections, e.g. of terminals mounted on a printed circuit board

Abstract

A method and apparatus for optically determining the distribution of normal force present at the mating surfaces of an electrical surface connector uses the birefringent properties of a photoelastic material. Photoelastic members are distributed between the two planar surfaces, and plane-polarized, narrow-band wave-length light is coupled into each member with an optical fiber. The light is directed to propagate along a principle strain axis of the photoelastic member. The temporarily birefringent photoelastic material provides a relative propagation delay between vector components of the light in each member which are perpendicular to the propagation direction. The light exiting each member is input to a plane polarizer, the output of which is measured with an intensity meter. The relative delay between the vector components creates a detectable change in intensity at the intensity meter. Correlation of the measurements for all the photoelastic members give a distribution of the forces across the planar surfaces.

Claims

1. A method of determining the relative quality of electrical contact across closed opposing planar surfaces of a separable two member electronic interconnect where one of the two opposing planar surfaces is resilient and has closely spaced apart electrically conductive contact bumps thereon, the method comprising:

locating a member of photoelastic material having planar exterior surfaces in pressure transfer relationship with each of the electrically conductive contact bumps on the resilient planar surface, each of such members being located to have one of its planar surfaces facing toward such resilient surface;

pressing each of the individual members of photoelastic material and its corresponding electrically conductive bump together to induce increased stress in the photoelastic material of the individual members;

coupling plane-polarized narrow-bandwidth light into the individual members of photoelastic material at 45 degrees with the direction of force orthogonal to the direction of light propagation; and

detecting in the plane-polarized light exiting the individual members of photoelastic material the relative phase delay created by the birefringence produced in such individual members as a result of the increased force of pressing.

2. A method according to claim 1 wherein coupling light into the photoelastic member comprises transporting light from a narrow band light source with an optical fiber.

3. A method according to claim 1 further comprising coupling light received exiting the photoelastic member into an optical fiber.

4. A method according to claim 3 wherein coupling the light exiting the photoelastic member into an optical fiber comprises coupling the light into an optical fiber with a graded-index lens.

5. A method according to claim 1 further comprising providing a pad of material more rigid than the photoelastic material between each of the members of photoelastic material and its corresponding electrically conductive bump.

6. A method according to claim 5 wherein said pad is made of a conductive material.

7. A method according to claim 1 wherein providing a member of photoelastic material comprises providing a member of temporarily birefringent photoelastic material.

8. The method of claim 1 wherein the step of locating a member of photoelastic material having planar exterior surfaces in pressure transfer relationship with each of the electrically conductive contact bumps on the resilient planar surface comprises locating a cube in pressure transfer relationship with each of such bumps.

9. The method of claim 8 wherein pressing is accomplished by urging each of the individual members of photoelastic material toward its corresponding electrically conductive bump.

10. The method of claim 9 wherein each of the individual members of photoelastic material is urged toward its corresponding electrically conductive bump with a test board.

11. Apparatus for determining the relative quality of electrical contact across closed opposing planar surfaces of a separable two member interconnect where one of the two opposing planar surfaces is resilient and has closely spaced apart electrically conductive contact bumps thereon, the apparatus comprising:

means or providing a member of photoelastic material in pressure transfer relationship with each of the electrically conductive contact bumps on the resilient planar surface;

means for coupling plane-polarized narrow-bandwidth light into the individual member of photoelastic material at 45 degrees with the direction of force orthogonal to the direction of light propagation; and

means for detecting in the plane-polarized light exiting the individual members of photoelastic material the relative phase delay created by the birefringence produced in such individual members as a result of the increased pressing force.

12. An apparatus according to claim 11 further comprising an optical fibre transporting light to individuals members of photoelastic material.

13. An apparatus according to claim 11 further comprising pad of material more rigid than the photoelastic material positioned between individual photoelastic members and the electrically conductive bumps on the resilient surface.