Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components

• US 5,177,593 A
• Filed: 09/04/1990
• Issued: 01/05/1993
• Est. Priority Date: 09/04/1989
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Abe, Munezo
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US07/576,653
• Time in Patent Office: 854 Days
• Field of Search: 357/16, 357/17, 357/72, 357/74, 357/81, 357/70, 357/72, 357/19
• US Class Current: 257/98
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A display device with LEDs includes an interconnection frame in which an electrical lead interconnection is formed by conductive metal plating on a surface including a main surface of a resin substrate capable of receiving a plating process. LEDs are bonded at the predetermined positions on the main surface of this interconnection frame so that they are connected to the electric lead interconnection. A reflection case having openings with their inner peripheral surfaces serving as reflection surfaces surrounding the LEDs is affixed to the main surface of the interconnection frame at a position corresponding to the LED arrangement. In the openings of the reflection case, the LEDs are covered with light transmissive resin members. Because the interconnection frame for the lead is formed of resin as well as the reflection case and provided with metal plating interconnection, thermal stresses are not produced due to difference of thermal expansion coefficient between the interconnection frame and the reflection case.

Claims

1. A display device comprising:

an interconnection frame including,

a resin substrate having a top surface, opposite side surfaces and a bottom surface opposite said top surface and formed of resin capable of receiving a conductive plating process, and

an electric lead interconnection formed by conductive matel plating on at least said top surface of said resin substrate and defining a main surface of the interconnection frame, said electric lead interconnection being led to either one of a bottom surface of said resin substrate, a side surface of said resin substrate, and both said bottom surface and said side surface of said resin substrate;

an LED located at a predetermined position on said main surface of said interconnection frame and bonded to be connected to said electric led interconnection;

a reflection use formed of resin having an opening and an inner peripheral surface serving as a reflection surface surrounding said LED at a position corresponding to the arrangement of said LED, and affixed to said main surface of said interconnection frame; and

a light transmissive resin member covering said LED in said opening of said reflection case.

2. The display device according to claim 1, wherein said LED is molded with said light transmissive resin member.

3. The display device according to claim 1, wherein said light transmissive resin member comprises a concave portion at a bottom surface and said LD is covered in said concave portion.

4. The display device according to claim 1, wherein said light transmissive resin member comprises said transparent epoxy resin.

5. The display device according to claim 1, wherein said resin substrate comprises a liquid crystal polymer.

6. The display device according to claim 1, wherein said lead the interconnection comprises one metal plating layer selected out of a copper plating layer, a silver plating layer and a gold plating layer.

7. The display device according to claim 1, wherein aid lead interconnection comprises a copper plating layer as a substrate metal and an nickel layer and a gold layer as anti-oxidateive metals above said copper plating layer.

8. The display device according to claim 1, wherein aid lead interconnection comprises at least two metal plating layers selected out of a copper plating layer, a silver plating layer and a gold plating layer.

9. The display device according to claim 1, wherein aid lead interconnection comprises a copper plating layer as a substitute metal layer and either one of a nickel layer and a gold layer as an anti-oxidateive metal above said upper plating layer.

10. The display device according to claim 1, wherein said lead interconnection extends and is located on said side surface and covers a portion of said bottom surface.