Electronic component mounting apparatus and method of mounting electronic component

• US 5,177,864 A
• Filed: 05/30/1991
• Issued: 01/12/1993
• Est. Priority Date: 09/06/1989
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Oyama, Kenshu
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US07/708,062
• Time in Patent Office: 593 Days
• Field of Search: 29/834-836, 29/833, 29/740, 29/741, 29/720, 29/721
• US Class Current: 29/833
• CPC Class Codes: H05K 13/0813 Controlling of single components prior to mounting, e.g. orientation, component geometry H05K13/0812 takes precedence
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/53022 with means to test work or product
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53183 Multilead component

Abstract

A method of mounting an electronic component having a plurality of leads on a printed circuit board. The method includes the steps of roughly observing the position of an electronic component, held by a suction nozzle of a carrier turntable, by a camera constituting part of a recognition unit and determining the rough deviation of the observed position from a desired position, roughly correcting the relative position of the electronic component and the circuit board by relative movement of the circuit board and the suction nozzle in the X and Y directions of the circuit board and the direction Θ around an axis of rotation of the nozzle which extends through the electronic component in response to any rough deviation of the electronic component relative to the desired position thereof on the circuit board, precisely measuring the positional deviation of the electronic component by precisely measuring the deviation of the position of at least one lead of the electronic component from a desired position by means of a laser unit, precisely correcting the relative position of the electronic component and the circuit board by relative movement of the circuit board and the suction nozzle in the X and Y directions of the circuit board and the direction Θ around an axis of rotation which extends through the circuit board in a direction perpendicular to the surfaces of the circuit board in response to any precisely measured positional deviation, and placing the electronic component on the circuit board.

Claims

1. A method of mounting an electronic component having a plurality of leads on a printed circuit board, comprising the steps of:

roughly observing the position of an electronic component held by a suction nozzle by means of a camera and determining the rough deviation of the observed position of the electronic component from a desired position;

roughly correcting for the observed deviation of the electronic component in an X-axis and a Y-axis direction by relatively moving the suction nozzle and a movable table means supporting a circuit board on which the component is to be mounted in an X-axis and Y-axis direction of the circuit board and roughly correcting for the observed deviation of the electronic component in a Θ

direction by relatively rotating the suction nozzle and the circuit board around an axis through the center of the electronic component held thereon;

precisely measuring the position of the electronic component held by the suction nozzle by precisely measuring the deviation of a position of at least one lead of the electronic component from a desired position for determining the precise deviation of the observed position of the electronic component from a desired position on the printed circuit board supported on said movable table means;

precisely correcting for the observed deviation of the electronic component in an X-axis and a Y-axis direction by moving said movable table means in the X-axis and Y-axis direction, and precisely correcting for the observed deviation of the electronic component in the Θ

direction by relatively rotating the printed circuit board and the component around an axis of rotation which extends through the circuit board in a direction perpendicular to the circuit board; and

placing the electronic component on the printed circuit board.

2. A method as claimed in claim 1 in which the step of roughly correcting the relative position of the electronic component and the circuit board comprises moving the circuit board in the X and Y-axis directions and rotating the nozzle in the Θ

direction.

3. A method as claimed in claim 1 in which the step of precisely correcting the relative position of the electronic component and the circuit board comprises moving the circuit board in the X-axis and Y-axis directions and rotating the circuit board around the axis of rotation which extends through the circuit board.

4. A method of mounting an electronic component having a plurality of leads on a printed circuit board, comprising the steps of:

picking up and holding the electronic component by a suction nozzle on a mounting head on a carrier turntable;

moving the electronic component to a field of vision of a camera by rotating the carrier turntable;

roughly observing the position of the electronic component held by the suction nozzle by means of said camera and determining the rough deviation of the observed position of the electronic component from a desired position;

roughly correcting for the observed deviation of the electronic component in an X-axis and a Y-axis direction by moving a movable table means supporting a circuit board on which the component is to be mounted in an X-axis and Y-axis direction of the circuit board and, while moving the electronic component to an area where the movable table means is positioned by rotating of said carrier turntable, roughly correcting for the observed deviation of the electronic component in a Θ

direction by rotating the suction nozzle around an axis through the center of the electronic component held thereon;

precisely measuring the position of the electronic component held by the suction nozzle by a precise measuring means on said movable table means for determining the precise deviation of the observed position of the electronic component from a desired position on the printed circuit board supported on said movable table means;

precisely correcting for the observed deviation of the electronic component in an X-axis and a Y-axis direction by moving said movable table means in the X-axis and Y-axis direction, and precisely correcting for the observed deviation of the electronic component in the Θ

direction by rotating the printed circuit board around an axis of rotation which extends through the circuit board in a direction perpendicular to the circuit board by rotating a circuit board support rotatably mounted on said movable table means around said lastmentioned axis; and

placing the electronic component on the printed circuit board.