Soldering device for electronic elements
First Claim
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1. A device for soldering an electronic element to a substrate, comprising:
- a supporting device having a holder and a support head mounted on the holder for supporting the substrate;
a pusher having a push head provided above the support head, a lower end of said push head having an area to be abutted on a central portion of said electronic element, said push head for pushing the electronic element to the substrate;
first driving means for vertically moving the holder; and
second driving means for vertically moving the push head wherein said electronic element and said substrate are gripped by said support head and said push head which is abutted on said central portion of said electronic element.
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Abstract
A device for soldering an electronic element to a substrate has a support head for supporting the substrate, and a pusher having a push head provided above the support head for pushing the electronic element to the substrate. The holder is upwardly moved to push the element to the substrate.
8 Citations
4 Claims
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1. A device for soldering an electronic element to a substrate, comprising:
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a supporting device having a holder and a support head mounted on the holder for supporting the substrate; a pusher having a push head provided above the support head, a lower end of said push head having an area to be abutted on a central portion of said electronic element, said push head for pushing the electronic element to the substrate; first driving means for vertically moving the holder; and second driving means for vertically moving the push head wherein said electronic element and said substrate are gripped by said support head and said push head which is abutted on said central portion of said electronic element. - View Dependent Claims (2, 3, 4)
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Specification
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Current AssigneePioneer Electronics (USA) Incorporated (Pioneer Corporation)
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Original AssigneePioneer Electronics (USA) Incorporated (Pioneer Corporation)
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InventorsKita, Yuji, Konno, Masahiko
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Primary Examiner(s)Heinrich, Samuel M.
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Application NumberUS07/829,636Time in Patent Office344 DaysField of Search228/6.2, 228/44.7, 228/212, 228/213, 228/180.2, 269/903US Class Current228/44.7CPC Class CodesB23K 3/087 Soldering or brazing jigs, ...H05K 13/0465 by soldering H05K13/0469 ta...Y10S 269/903 Work holder for electrical ...
