Bonding using a difunctional liquid crystalline monomer adhesive under an applied force field

• US 5,178,710 A
• Filed: 03/25/1992
• Issued: 01/12/1993
• Est. Priority Date: 11/02/1988
• Status: Expired due to Term

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Gossink, Robert G., Hikmet, Rifat A. M., Broer, Dirk J.
• Primary Examiner(s): Simmons, David A.
• Assistant Examiner(s): Barry, Chester T.
• Application Number:
  US07/857,711
• Time in Patent Office: 293 Days
• Field of Search: 156/99, 156/272.2, 156/273.1, 156/275.5, 156/275.7, 156/332, 156/273.5
• US Class Current: 156/272.2
• CPC Class Codes: G02B 7/00 Mountings, adjusting means, or light-tight connections, for optical elements
• CPC Class Codes: G02B 7/025 using glue

Abstract

By using an adhesive layer (9) between a mount (3) and an optical component (5), which adhesive layer comprises liquid crystalline monomers, the polymerization shrinkage can be minimized in the desired directions X and Y if the monomers are oriented in the Z-direction by an external field before they are polymerized.

Claims

1. A method of bonding two bodies in which adhesive is applied on both of said bodies, after which the bodies are positioned relative to one another so that the adhesive contacts both bodies and the adhesive is made to cure subsequently, characterized in that the adhesive comprises difunctional liquid crystalline groups having two polymerizable functional groups and that said monomers are oriented parallel to the surface to be bonded by the application of an external field of force and said field is maintained during curing.

2. A method as claimed in claim 1, characterized in that a di-(meth)acrylate is used as the liquid crystalline monomer.

3. A method as claimed in claim 2 wherein the curing is carried out by means of exposure to UV light.

4. A method as claimed in claim 1, characterized in that curing is carried out by means of exposure to UV light.