Plastic molded type electronic device
First Claim
1. A plastic molded type electronic device, wherein the device is sealed with a phenolic resin molding composition comprising a resin component consisting of a resol-type phenol resin and at least one epoxy resin in a weight ratio of from 75:
- 25 to 95;
5, the resin component having been purified until it gives, when extracted by heating with 10 times the amount of hot water at 120°
C. for 100 hours or more, an extract having an electric conductivity of 100 μ
S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less.
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Accused Products
Abstract
The phenol resin molding composition used in the present invention is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120° C. for 100 hours or more, the extract has an electric conductivity of 100 μS/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising a resin component consisting of said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance.
19 Citations
9 Claims
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1. A plastic molded type electronic device, wherein the device is sealed with a phenolic resin molding composition comprising a resin component consisting of a resol-type phenol resin and at least one epoxy resin in a weight ratio of from 75:
- 25 to 95;
5, the resin component having been purified until it gives, when extracted by heating with 10 times the amount of hot water at 120°
C. for 100 hours or more, an extract having an electric conductivity of 100 μ
S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less. - View Dependent Claims (2, 3, 5, 9)
- 25 to 95;
-
4. A plastic molded type electronic device, wherein the device is transfer-molded with a phenolic resin molding composition comprising a resin component consisting of a resol-type phenol resin and a modifier in a weight ratio of from 75:
- 25 to 95;
5, the resin component having been purified until it gives, when extracted by heating with 10 times the amount of hot water at 120°
C. for 100 hours or more, an extract having an electric conductivity of 100 μ
S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less. - View Dependent Claims (6, 7, 8)
- 25 to 95;
Specification