Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
First Claim
1. A process for improving the adherency of metal coatings deposited without current on plastic surfaces by treating the latter with printing paste formulations which contain, as essential components,a) between about 0.03 to 4.00% by weight of an organometallic noble metal compound as activator,b) between about 10 to 30% by weight of an unreactive polyurethane elastomer as binder,c) between about 5 to 25% by weight of a filler, andd) between about 40 to 90% by weight of a halogen-free solvent having a flashpoint >
- 21°
C. and a boiling point >
100°
C.,the sum of the percents by weights of components a), b), c) and d) being less than or equal to 100% by weight.
2 Assignments
0 Petitions
Accused Products
Abstract
Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.
The metal coatings produced are distinguished by good adhesion.
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Citations
6 Claims
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1. A process for improving the adherency of metal coatings deposited without current on plastic surfaces by treating the latter with printing paste formulations which contain, as essential components,
a) between about 0.03 to 4.00% by weight of an organometallic noble metal compound as activator, b) between about 10 to 30% by weight of an unreactive polyurethane elastomer as binder, c) between about 5 to 25% by weight of a filler, and d) between about 40 to 90% by weight of a halogen-free solvent having a flashpoint > - 21°
C. and a boiling point >
100°
C.,the sum of the percents by weights of components a), b), c) and d) being less than or equal to 100% by weight. - View Dependent Claims (2, 3, 4, 5)
- 21°
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6. A printing paste formulation useful for the production of printed circuits, foil keyboards, pressure-sensitive mats and sensors comprising, as essential components,
a) between about 0.03 to 4.00% by weight of an organometallic noble metal compound as activator, b) between about 10 to 30% by weight of an unreactive polyurethane elastomer as binder, c) between about 5 to 25% by weight of a filler, and d) between about 40 to 90% by weight of a halogen-free solvent having a flashpoint > - 21°
C. and a boiling point >
100°
C., the sum of the percents by weights of components a), b), c) and d) being less than or equal to 100% by weight.
- 21°
Specification
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- Resources
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Current AssigneeI & T Innovation Technology Entwicklungs-Und Holding AG
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Original AssigneeBayer AG
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InventorsGiesecke, Henning, Wienkenhover, Martin, Muller, Hanns P., Wolf, Gerhard D., von Gizycki, Ulrich
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Primary Examiner(s)Beck, Shrive
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Assistant Examiner(s)DANG, VI
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Application NumberUS07/673,172Time in Patent Office680 DaysField of Search427/98, 427/304, 427/305, 427/306, 427/443.1, 106/1.21, 106/1.28US Class Current427/98.4CPC Class CodesC23C 18/28 Sensitising or activatingH05K 3/181 by electroless plating adhe...H05K 3/387 for electroless plating H05...
