IC card and manufacturing method therefor
First Claim
Patent Images
1. An IC card having a thickness comprising:
- a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card;
a circuit board unitary with and integrally molded with said circumferential frame, disposed within the periphery intermediate the first and second surfaces of said frame, including opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card;
electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion disposed on one of said circuit board and said periphery for supplying information to and receiving information from external equipment; and
a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape.
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Accused Products
Abstract
An IC card including a circuit, electronic parts, and an I/O portion mounted on a circuit board integrally formed on a frame at its periphery. The circuit board, the circuit, and the electronic parts are hermetically sealed, except for a portion of the I/O portion, and the frame is filled with synthetic resin to a thickness no greater than that of the frame.
32 Citations
27 Claims
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1. An IC card having a thickness comprising:
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a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card; a circuit board unitary with and integrally molded with said circumferential frame, disposed within the periphery intermediate the first and second surfaces of said frame, including opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card; electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion disposed on one of said circuit board and said periphery for supplying information to and receiving information from external equipment; and a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 25, 26, 27)
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13. An IC card having a thickness comprising:
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a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card and a circuit board supporting portion unitary with and integrally molded with said circumferential frame at and within said periphery and disposed intermediate the first and second surfaces of said frame; a circuit board supported by said circuit board supporting portion, having opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card; electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion for supplying information to and receiving information from external equipment; and a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification