Plural-wavelength infrared detector devices

• US 5,185,648 A
• Filed: 09/10/1991
• Issued: 02/09/1993
• Est. Priority Date: 09/12/1990
• Status: Expired due to Fees

• Current Assignee: GEC Marconi Limited (Gooding Consumer Electronics Ltd.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Baker, Ian M., Dunn, William A. E.
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US07/757,380
• Time in Patent Office: 518 Days
• Field of Search: 357/30 B, 357/30 P, 357/30 H, 357/30 E, 357/32, 357/16, 357/68, 357/55
• US Class Current: 257/189
• CPC Class Codes: H01L 27/14669 Infrared imagers

Abstract

An infrared detector device for at least two wavelengths, i.e. 3 to 5 microns and 8 to 14 microns, comprises detector elements (10 and 20) formed in two or more infrared-sensitive materials with different badgaps, e.g. in cadmium mercury telluride. These materials may be provided side-by-side in a single level on a substrate (3) or preferably as different levels (1 and 2) on the substrate (3). Each detector element (10 and 20) comprises a p-n junction (11 and 21) between opposite conductivity type regions (12,13 and 22,23). Electrical connections (15,25,24) extend from these regions to the substrate (3). Freedom in design and fabrication is obtained by a connection structure in which one connection (25) of the longer-wavelength response element (20) contacts both the semiconductor material (2) of that element (20) and the larger-bandgap material (1) of the shorter-wavelength response element (10), at a side-wall (42) of both materials. The larger-bandgap material (1) comprises a further region (18) which adjoins the side-wall (42) and which forms a further p-n junction (19) electrically in parallel with the p-n junction (21) of the longer-wavelength detector element (20).

Claims

1. A plural wavelength infrared detector device including first and second detector elements comprising respective first and second infrared sensitive semiconductor materials, and a substrate carrying the detector elements, the first semiconductor material having a smaller bandgap than the second semiconductor material so as to provide each first detector element with a response to a longer infrared wavelength, each detector element comprising a pn junction between opposite conductivity-type regions of the respective semiconductor materials, and electrical connections from the detector-element regions to the substrate, wherein the improvement comprises that the electrical connection between the substrate and one region of the longer wavelength response detector element extends on a side wall of both the first and second semiconductor materials, and in that the larger bandgap second material comprises a further region which adjoins the side wall and which forms a further pn junction electrically in parallel with the pn junction of the first detector element, the further pn junction having a higher impedance than the pn junction of the first detector element in the smaller bandgap first material.

2. An infrared detector device as claimed in claim 1, further characterised in that the first and second semiconductor materials are provided as different levels on the substrate, a lower level of semiconductor material is located between an upper level and the substrate, in that at least one detector element is formed in each level, in that a first of the upper and lower levels has the smaller bandgap material, in that the electrical connection between the substrate and the one region of the longer wavelength response detector element extends on a side wall in both the upper and lower levels, in that the larger bandgap material of the second level comprises the further region, and in that the further p-n junction is formed detector element p-n junction in the first level.

3. An infrared detector device as claimed in claim 2, further characterised in that the smaller bandgap material is present in the lower level, and so at least one of the electrical connections of the longer wavelength response detector element in the lower level extends downward from the upper level on the side wall of said further region which is present in the upper level.

4. An infrared detector device as claimed in claim 2, further characterised in that the electrical connection on the side wall comprises metallization on a side wall of an aperture passing locally through the thickness of the upper and lower levels and surrounded by the one region of the longer wavelength detector element in the first level and by the further region in the second level.

5. An infrared detector device as claimed in claim 2, further characterised in that the other region of the longer wavelength response detector element has an electrical connection which extends on another side wall of the semiconductor materials of both the upper and lower levels and contacts one of the regions of the shorter wavelength response detector element so as to provide a common connection for both detector elements.

6. An infrared detector device as claimed in claim 5, further characterised in that a separate part of the smaller bandgap material in the lower level is separated from the longer wavelength response detector element by a gap, in that the gap is bridged by the upper level material, and in that another connection of the upper level shorter wavelength response detector element extends to the substrate via the separate part of the smaller bandgap material.

7. An infrared detector device as claimed in claim 1, and further characterised by comprising a group of both first and second detector elements, and in that the first detector elements are located between the second detector elements, as seen in plan view at the surface of the substrate.