Transient energy release microdevices and methods

• US 5,186,001 A
• Filed: 11/08/1991
• Issued: 02/16/1993
• Est. Priority Date: 11/08/1991
• Status: Expired due to Fees

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Kunc, Joseph A., Erwin, Daniel A., Muntz, Eric P., Shiflett, Geoffrey R.
• Primary Examiner(s): Ostrager, Allen M.
• Application Number:
  US07/790,595
• Time in Patent Office: 466 Days
• Field of Search: 60/508, 60/509, 60/512, 60/513, 60/515
• US Class Current: 60/515
• CPC Class Codes: F01B 29/00 Machines or engines with pertinent characteristics other than those provided for in preceding main groups
• CPC Class Codes: F02G 1/04 of closed-cycle type
• CPC Class Codes: F02G 2258/10 ceramic
• CPC Class Codes: F04B 17/00 Pumps characterised by combination with, or adaptation to, specific driving engines or motors
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F15C 1/04 Means for controlling fluid streams to fluid devices, e.g. by electric signals or other signals, no mixing taking place between the signal and the flow to be controlled fluid information or pulse transducers F15B5/00; electric regulation with electro-fluid amplifiers G05B7/02; fluid operating means for indicating or recording members in measuring instruments G01D5/42; distribution or supply devices for servomotors with electrically-controlled pilot valves F15B13/043
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0094 Micropumps
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0034 Operating means specially adapted for microvalves
• CPC Class Codes: F16K 99/0057 the fluid being the circulating fluid itself, e.g. check valves
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0042 Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
• CPC Class Codes: H01H 2061/006 Micromechanical thermal relay
• CPC Class Codes: H01H 61/00 Electrothermal relays thermal switches not operated by electrical input, thermal switches with anticipating electrical input H01H37/00; thermally-sensitive members H01H37/32
• CPC Class Codes: H01H 67/22 Switches without multi-position wipers

Abstract

A microdevice in the form of a microactuator or micropump. A microdevice for providing reciprocating motion at a high repetition rate, including a cell having an output wall with at least a portion movable, such as a diaphragm or inlet and outlet valves. A charge of gas in the cell and a source for cyclicly and directly heating the gas to increase the gas pressure in the cell and move the diaphragm or control the valves, the source for heating including a pulsed source for generating transient gas pressure increases in the cell at cycle times of not more than about 50 microseconds, with the cell including an arrangement for cooling the gas for reducing the gas pressure in the cell. In one embodiment, the source for heating includes a source of photons and an arrangement for directing the photons into the cell to the gas or to the cell inner surface. In another embodiment, the source for heating includes a thin film of resistance heating material on an inner surface of the cell, and an arrangement for connecting a pulsed electric power source to the film. Another embodiment includes an arrangement for producing electrical discharge pulses within the cell for heating the gas.

Claims

1. A microdevice for providing motion at a high repetition rate, including in combination:

a cell having an output wall with at least a portion movable in response to change in pressure in said cell;

a charge of gas in said cell; and

means for cyclicly and directly heating said gas to increase the gas pressure in said cell and move said output wall portion,

said means for heating including pulse means for generating transient gas pressure increases in said cell at cycle times of not more than about 50 microseconds;

said cell including means for cooling said gas for reducing the gas pressure in said cell.

2. A microdevice as defined in claim 1 wherein said transient gas pressure increases are generated at cycle times of not more than about 5 microseconds.

3. A microdevice as defined in claim 1 wherein said means for cooling includes a thin cell wall of a material of high thermal conductivity.

4. A microdevice as defined in claim 1 wherein said means for cooling includes a cell wall of thermal conductivity not less than about one watt per centimeter per degree Kelvin.

5. A microdevice as defined in claim 1 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of low thermal conductivity and a second layer over said first layer of a material of high thermal conductivity.

6. A microdevice as defined in claim 5 including a heat sink over said second layer of said wall.

7. A microdevice as defined in claim 1 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of thermal conductivity not more than about 0.01 watts per centimeter per degree Kelvin and a thickness in the range of about one to ten micrometers, and a second layer over said first inner layer of a material of thermal conductivity not less than about 1.0 watt per centimeter per degree Kelvin.

8. A microdevice as defined in claim 7 including a heat sink over said second layer of said wall.

9. A microdevice as defined in claim 1 wherein said means for heating includes a source of photons and means for directing said photons into said cell.

10. A microdevice as defined in claim 9 wherein said cell has a wall with a photon transparent window, and

said source of photons includes a laser with a pulsed output and a fiber optic for directing said laser pulsed output to said cell transparent window.

11. A microdevice as defined in claim 9 wherein said cell includes a photon transparent window, and

said source of photons includes a laser with a pulsed output and positioned at said window.

12. A microdevice as defined in claim 9 wherein said photons are directed onto the inner wall of said cell.

13. A microdevice as defined in claim 12 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of low thermal conductivity and a second layer over said first layer of a material of high thermal conductivity.

14. A microdevice as defined in claim 12 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of thermal conductivity not more than about 0.01 watts per centimeter per degree Kelvin and a thickness in the range of about one to ten micrometers, and a second layer over said first inner layer of a material of thermal conductivity not less than about 1.0 watt per centimeter per degree Kelvin.

15. A microdevice as defined in claim 9 wherein said photons are directed into said gas in said cell.

16. A microdevice as defined in claim 15 with said photons are of a wavelength corresponding to a photon absorption band of said gas.

17. A microdevice as defined in claim 15 wherein said gas is a gas selected from the group consisting of NO, CO₂, NO₂, NH₃ and I₂.

18. A microdevice as defined in claim 15 wherein said means for cooling includes a thin cell wall of a material of high thermal conductivity.

19. A microdevice as defined in claim 15 wherein said means for cooling includes a cell wall of thermal conductivity not less than about 1 watt per centimeter per degree Kelvin.

20. A microdevice as defined in claim 1 wherein said means for heating includes:

a thin film of resistance heating material on an inner surface of said cell; and

means for connecting a pulsed electric power source to said film.

21. A microdevice as defined in claim 20 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of low thermal conductivity and a second layer over said first layer of a material of high thermal conductivity, with said thin film on said first inner layer.

22. A microdevice as defined in claim 20 wherein said means for cooling includes a multilayer cell wall with a first inner layer of a material of thermal conductivity not more than about 0.01 watts per centimeter per degree Kelvin and a thickness in the range of about one to ten micrometers, and a second layer over said first inner layer of a material of thermal conductivity not less than about 1.0 watt per centimeter per degree Kelvin.

23. A microdevice as defined in claim 1 wherein said means for heating includes means for producing an electrical discharge in said gas in said cell.

24. A microdevice as defined in claim 23 wherein said means for heating includes spaced electrodes positioned within said cell, and an electrical pulse source connected to said electrodes.

25. A microdevice as defined in claim 1 wherein said microdevice is a microactuator with said cell being closed and with said movable wall position providing a reciprocating actuating force.

26. A microdevice as defined in claim 1 wherein said microdevice is a micropump with said movable wall portion including an inlet valve and an outlet valve, with said inlet valve closing and said outlet valve remaining open when the pressure in said cell increases.

27. A method for providing reciprocating motion at a high repetition rate with a microdevice having a cell with an output wall having at least a portion movable in response to change in pressure in the cell, and a charge of gas in the cell,

including the steps of:

cyclicly and directly heating the gas to increase the gas pressure in the cell and move the output wall portion by generating transient gas pressure increases in the cell at cycle times of not more than about 50 microseconds; and

providing cooling of the gas for reducing the gas pressure in the cell.

28. A method as defined in claim 27 including generating the transient gas pressure increases at cycle times of not more than about 5 microseconds.

29. A method as defined in claim 27 including cooling by providing a thin cell wall of a material of high thermal conductivity.

30. A method as defined in claim 27 including cooling by providing a cell wall of thermal conductivity not less than about one watt per centimeter per degree Kelvin.

31. A method as defined in claim 27 including cooling by providing a multilayer cell wall with a first inner layer of a material of low thermal conductivity and a second layer over said first layer of a material of high thermal conductivity.

32. A method as defined in claim 27 including cooling by providing a multilayer cell wall with a first inner layer of a material of thermal conductivity not more than about 0.01 watts per centimeter per degree Kelvin and a thickness in the range of about one to ten micrometers, and a second layer over said first inner layer of a material of thermal conductivity not less than about 1.0 watt per centimeter per degree Kelvin.

33. A method as defined in claim 27 including heating by directing photons from a photon source into the cell.

34. A method as defined in claim 27 including using a laser as the source of the photons.

35. A method as defined in claim 33 including directing the photons into the gas.

36. A method as defined in claim 35 using photons of a wavelength corresponding to a photon absorption band of the gas.

37. A method as defined in claim 35 using a gas selected from the group consisting of NO, CO₂, NO₂, NH₃ and I₂.

38. A method as defined in claim 35 including cooling by providing a thin cell wall of a material of high thermal conductivity.

39. A method as defined in claim 33 including directing the photons onto the inner wall of the cell.

40. A method as defined in claim 27 including heating by connecting a pulsed electric power source to a thin film of resistance heating material on an inner surface of the cell.

41. A method as defined in claim 40 including cooling by providing a multilayer cell wall with a first inner layer of a material of low thermal conductivity and a second layer over said first layer of a material of high thermal conductivity.

42. A method as defined in claim 27 including heating by periodically producing an electrical discharge within said cell.

43. A method as defined in claim 27 wherein the cell is a closed cell and the microdevice is a microactuator providing a reciprocating actuating force.

44. A method as defined in claim 27 wherein the microdevice is a micropump and the cell includes inlet and outlet valves with the inlet valve normally open and the outlet valve normally closed, with an increase in pressure in the cell closing the inlet valve and expelling gas through the outlet valve.