MOCVD method and apparatus

• US 5,186,756 A
• Filed: 12/09/1991
• Issued: 02/16/1993
• Est. Priority Date: 01/29/1990
• Status: Expired due to Term

• Current Assignee: AT&T, Inc.
• Original Assignee: AT&T, Inc.
• Inventors: Viriyayuthakorn, Montri, Levkoff, Jerome, Sutryn, Daniel C., Benko, John W.
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US07/803,938
• Time in Patent Office: 435 Days
• Field of Search: 118/715, 118/725, 118/730
• US Class Current: 118/730
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45563 Gas nozzles
• CPC Class Codes: C30B 25/14 Feed and outlet means for the gases; Modifying the flow of the reactive gases

Abstract

In an MOCVD reactor, gases are channeled around the periphery of a baffle plate (15) so as to flow radially inwardly along a slotted injection plate (16). The slots (22) in the injection plate extend radially and are of non-uniform width so as to compensate for a non-uniform rate of deposition. The resultant flow over a rotating heated substrate (17) gives a more uniform deposit of epitaxially grown material.

Claims

1. A metalorganic chemical vapor deposition reactor comprising:

an enclosure having a central axis;

a substrate holder within the enclosure;

means for rotating the substrate holder;

an inlet tube for transmitting gases into one end of the enclosure in an axial direction;

a baffle plate arranged transverse to said axis;

an injection plate parallel to the baffle plate and located on the side of the baffle plate opposite the inlet tube, the center of the injection plate being substantially coincident with the central axis of the enclosure;

means for guiding gases including metalorganic gases from the inlet tube around the periphery of the baffle plate so as to flow radially inwardly along one surface of the injection plate;

the substrate holder being arranged parallel to the injection plate and opposite the baffle plate;

and means comprising a plurality of slots in the injection plate for permitting said gases to be transmitted through the injection plate toward the substrate holder, the slots being arranged radially with respect to the center of the injection plate with each slot being narrower at the end nearest the center of the injection plate than at the end nearest the periphery of the injection plate, whereby the rate of transmission through the injection plate is non-uniform with respect to radial distance along said one surface of said injection plate.

2. The reactor of claim 1 wherein:

the substrate holder is adapted to hold a semiconductor substrate upon which it is desired to epitaxially deposit a semiconductor layer;

and the gases comprise a metalorganic compound and a second compound which are adapted to react so as to make an epitaxial deposit on the substrate.

3. The reactor of claim 2 wherein:

the injection plate contains two slots arranged 180 degrees apart with respect to the injection plate center.

4. The reactor of claim 2 wherein:

the injection plate contains four slots arranged ninety degrees apart with respect to the injection plate center.

5. The reactor of claim 2 wherein:

the slots are each made by directing at the injection plate a laser beam of sufficient power to melt locally through the injection plate, and causing relative movement of the plate with respect to the laser beam such that the point of impingement of the laser beam on the injection plate described a path corresponding to the periphery of the slot.