Automated interconnect routing system
First Claim
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1. A method for manufacturing a routing plan for a multiple element electrical circuit interconnect substrate of the type used to interconnect a plurality of circuit element terminals comprising the steps of:
- (a) providing a net list specifying the circuit terminals to be interconnected by the interconnect substrates, said net list comprising a list of terminal connections, each with an associated net number;
(b) generating an ordered FROM-TO list for routing according to connection density;
(c) subdividing the area of the substrate for routing into a set of nested rectangular regions according to density;
(d) providing an optimized routing plan for each subdivided area, proceeding from the area of highest density to lowest density; and
(e) merging the optimized routing plans for each subdivided area to produce a routing plan for the entire interconnect substrate.
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Abstract
A method of manufacturing a multiple element circuit interconnect substrate is provided which provides an optimized routing plan. The routing plan is based upon a multi-dimensional binary data structure having nodes representing each terminal interconnect requirement which is preprocessed to order the required interconnects according to density.
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Citations
6 Claims
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1. A method for manufacturing a routing plan for a multiple element electrical circuit interconnect substrate of the type used to interconnect a plurality of circuit element terminals comprising the steps of:
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(a) providing a net list specifying the circuit terminals to be interconnected by the interconnect substrates, said net list comprising a list of terminal connections, each with an associated net number; (b) generating an ordered FROM-TO list for routing according to connection density; (c) subdividing the area of the substrate for routing into a set of nested rectangular regions according to density; (d) providing an optimized routing plan for each subdivided area, proceeding from the area of highest density to lowest density; and (e) merging the optimized routing plans for each subdivided area to produce a routing plan for the entire interconnect substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification