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Automated interconnect routing system

  • US 5,187,671 A
  • Filed: 08/24/1990
  • Issued: 02/16/1993
  • Est. Priority Date: 08/24/1990
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a routing plan for a multiple element electrical circuit interconnect substrate of the type used to interconnect a plurality of circuit element terminals comprising the steps of:

  • (a) providing a net list specifying the circuit terminals to be interconnected by the interconnect substrates, said net list comprising a list of terminal connections, each with an associated net number;

    (b) generating an ordered FROM-TO list for routing according to connection density;

    (c) subdividing the area of the substrate for routing into a set of nested rectangular regions according to density;

    (d) providing an optimized routing plan for each subdivided area, proceeding from the area of highest density to lowest density; and

    (e) merging the optimized routing plans for each subdivided area to produce a routing plan for the entire interconnect substrate.

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