Method of producing micromachined differential pressure transducers
First Claim
1. A method of making a micromachined differential pressure transducer comprising the steps of:
- (a) forming a deformable polysilicon membrane over a cavity between the membrane and a substrate, the membrane being sealed to the top side of the substrate at peripheral portions of the membrane to seal off the top surface of the membrane from the cavity;
(b) forming at least one channel in the substrate extending from a position remote to the cavity into communication with the cavity;
(c) forming a spacer release layer of hardenable material over the membrane and adjacent to the surface of the membrane which can be dissolved in a liquid which does not affect the membrane or the substrate;
(d) applying a plating base over the spacer release layer and adjacent substrate, the plating base being formed of a metal;
(e) forming a layer of casting material over the plating base to at least the desired thickness of an overpressure stop bridge which is to span over the deformable membrane, the deposited casting material being susceptible to X-rays such that the material exposed to X-rays can be dissolved in a selected solvent;
(f) exposing the casting material to X-rays in a desired pattern around and including the area of the deformable membrane;
(g) removing the casting material with the solvent in those areas which have been exposed to X-rays while leaving the remaining casting material to define a mold area over the membrane and surrounding areas;
(h) depositing a solid metal into the mold area;
(i) removing the remaining casting material;
(j) removing the spacer release layer material to leave the deposited metal as a bridge extending across the space above the deformable membrane.
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Accused Products
Abstract
Microminiature pressure transducers are formed on semiconductor substrates such as silicon and include a membrane which spans a cavity over the substrate, with the membrane being mounted to and sealed to the substrate at the peripheral edges of the membrane. The bottom of the cavity forms an overpressure stop to prevent over deflections of the membrane toward the substrate. An overpressure stop formed as a bridge of a material such as nickel extends above the membrane and is spaced therefrom to allow the membrane to deflect freely under normal pressure situations but prevent over deflections. The thickness of the polysilicon membrane and the spacing between the membrane and the overpressure stops is preferably in the range of 10 micrometers or less, and typically in the range of one micrometer. The overpressure stop bridge is formed utilizing deep X-ray lithography to form a well-defined bridge structure. The gap between the membrane and the bottom surface of the bridge is established with a sacrificial layer, such as a polyimide film, which dissolves in a solvent. The transducer is formed utilizing processing techniques which do not affect the performance of the membrane as a pressure sensor and which allow the substrate to have further micromechanical or microelectronic devices formed thereon.
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Citations
19 Claims
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1. A method of making a micromachined differential pressure transducer comprising the steps of:
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(a) forming a deformable polysilicon membrane over a cavity between the membrane and a substrate, the membrane being sealed to the top side of the substrate at peripheral portions of the membrane to seal off the top surface of the membrane from the cavity; (b) forming at least one channel in the substrate extending from a position remote to the cavity into communication with the cavity; (c) forming a spacer release layer of hardenable material over the membrane and adjacent to the surface of the membrane which can be dissolved in a liquid which does not affect the membrane or the substrate; (d) applying a plating base over the spacer release layer and adjacent substrate, the plating base being formed of a metal; (e) forming a layer of casting material over the plating base to at least the desired thickness of an overpressure stop bridge which is to span over the deformable membrane, the deposited casting material being susceptible to X-rays such that the material exposed to X-rays can be dissolved in a selected solvent; (f) exposing the casting material to X-rays in a desired pattern around and including the area of the deformable membrane; (g) removing the casting material with the solvent in those areas which have been exposed to X-rays while leaving the remaining casting material to define a mold area over the membrane and surrounding areas; (h) depositing a solid metal into the mold area; (i) removing the remaining casting material; (j) removing the spacer release layer material to leave the deposited metal as a bridge extending across the space above the deformable membrane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of making a micromachined structure comprising the steps of:
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(a) forming a sacrificial release layer of material on the surface of a substrate, the material of the sacrificial release layer being dissolvable in a liquid which does not affect the substrate; (b) applying a plating base at least over the sacrificial release layer, the plating base being formed of a metal; (c) forming a layer of casting material over the plating base to at least the desired thickness of a structure to be formed, the deposited casting material being susceptible to X-rays such that the casting material exposed to X-rays can be dissolved in a selected developer solvent; (d) exposing the casting material to X-rays in a desired pattern; (e) removing the casting material with the developer solvent in those areas which have been exposed to X-rays while leaving the remaining casting material to define a mold area over the plating base; (f) depositing a solid metal into the mold area onto the plating base by electroplating; (g) removing the remaining casting material; (h) removing the plating base in regions where solid metal has not been deposited to allow access to the sacrificial release layer; (i) removing the sacrificial release layer material to leave the deposited metal on the plating base free of the substrate where the sacrificial release layer has been removed. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification