Method of producing micromachined differential pressure transducers

• US 5,189,777 A
• Filed: 12/07/1990
• Issued: 03/02/1993
• Est. Priority Date: 12/07/1990
• Status: Expired due to Term

• Current Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Original Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Inventors: Christenson, Todd R., Guckel, Henry
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US07/626,581
• Time in Patent Office: 816 Days
• Field of Search: 29/424, 29/621.1, 437/901, 148/DIG. 12, 427/58, 427/123, 156/655, 156/657, 430/312, 430/314, 430/315, 430/319, 430/324, 430/367, 338/4, 361/283, 73/718, 73/720, 73/721, 73/724, 73/726, 73/727
• US Class Current: 29/424
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: Y10S 430/168 X-ray exposure process
• CPC Class Codes: Y10T 29/49103 Strain gauge making
• CPC Class Codes: Y10T 29/49812 Temporary protective coating, impregnation, or cast layer

Abstract

Microminiature pressure transducers are formed on semiconductor substrates such as silicon and include a membrane which spans a cavity over the substrate, with the membrane being mounted to and sealed to the substrate at the peripheral edges of the membrane. The bottom of the cavity forms an overpressure stop to prevent over deflections of the membrane toward the substrate. An overpressure stop formed as a bridge of a material such as nickel extends above the membrane and is spaced therefrom to allow the membrane to deflect freely under normal pressure situations but prevent over deflections. The thickness of the polysilicon membrane and the spacing between the membrane and the overpressure stops is preferably in the range of 10 micrometers or less, and typically in the range of one micrometer. The overpressure stop bridge is formed utilizing deep X-ray lithography to form a well-defined bridge structure. The gap between the membrane and the bottom surface of the bridge is established with a sacrificial layer, such as a polyimide film, which dissolves in a solvent. The transducer is formed utilizing processing techniques which do not affect the performance of the membrane as a pressure sensor and which allow the substrate to have further micromechanical or microelectronic devices formed thereon.

Claims

1. A method of making a micromachined differential pressure transducer comprising the steps of:

(a) forming a deformable polysilicon membrane over a cavity between the membrane and a substrate, the membrane being sealed to the top side of the substrate at peripheral portions of the membrane to seal off the top surface of the membrane from the cavity;

(b) forming at least one channel in the substrate extending from a position remote to the cavity into communication with the cavity;

(c) forming a spacer release layer of hardenable material over the membrane and adjacent to the surface of the membrane which can be dissolved in a liquid which does not affect the membrane or the substrate;

(d) applying a plating base over the spacer release layer and adjacent substrate, the plating base being formed of a metal;

(e) forming a layer of casting material over the plating base to at least the desired thickness of an overpressure stop bridge which is to span over the deformable membrane, the deposited casting material being susceptible to X-rays such that the material exposed to X-rays can be dissolved in a selected solvent;

(f) exposing the casting material to X-rays in a desired pattern around and including the area of the deformable membrane;

(g) removing the casting material with the solvent in those areas which have been exposed to X-rays while leaving the remaining casting material to define a mold area over the membrane and surrounding areas;

(h) depositing a solid metal into the mold area;

(i) removing the remaining casting material;

(j) removing the spacer release layer material to leave the deposited metal as a bridge extending across the space above the deformable membrane.

2. The method of claim 1 wherein the step of forming at least one channel is carried out by etching a channel in the substrate from the back side of the substrate into communication with the cavity.

3. The method of claim 1 wherein the spacer release layer is formed of polyimide.

4. The method of claim 1 wherein the plating base includes a thin layer of titanium and a thin layer of nickel.

5. The method of claim 1 wherein the casting material is cross-linked polymethyl methacrylate.

6. The method of claim 1 wherein the step of depositing a solid material comprises electroplating a metal into the mold area.

7. The method of claim 6 wherein the metal which is plated is nickel.

8. The method of claim 1 wherein the spacing release layer is deposited to a thickness of 10 micrometers or less.

9. The method of claim 8 wherein the spacing release layer is deposited to a thickness of approximately 1 micrometer.

10. The method of claim 1 wherein the step of exposing the casting material to X-rays is carried out by exposing the casting material to synchrotron radiation.

11. A method of making a micromachined structure comprising the steps of:

(a) forming a sacrificial release layer of material on the surface of a substrate, the material of the sacrificial release layer being dissolvable in a liquid which does not affect the substrate;

(b) applying a plating base at least over the sacrificial release layer, the plating base being formed of a metal;

(c) forming a layer of casting material over the plating base to at least the desired thickness of a structure to be formed, the deposited casting material being susceptible to X-rays such that the casting material exposed to X-rays can be dissolved in a selected developer solvent;

(d) exposing the casting material to X-rays in a desired pattern;

(e) removing the casting material with the developer solvent in those areas which have been exposed to X-rays while leaving the remaining casting material to define a mold area over the plating base;

(f) depositing a solid metal into the mold area onto the plating base by electroplating;

(g) removing the remaining casting material;

(h) removing the plating base in regions where solid metal has not been deposited to allow access to the sacrificial release layer;

(i) removing the sacrificial release layer material to leave the deposited metal on the plating base free of the substrate where the sacrificial release layer has been removed.

12. The method of claim 11 wherein the sacrificial release layer is formed of polyimide.

13. The method of claim 11 wherein the plating base includes a thin layer of titanium and a thin layer of nickel.

14. The method of claim 11 wherein the casting material is polymethyl methacrylate.

15. The method of claim 11 wherein the metal which is plated is nickel.

16. The method of claim 11 wherein the sacrificial release layer is deposited to a thickness of 10 micrometers or less.

17. The method of claim 16 wherein the sacrificial release layer is deposited to a thickness of approximately 1 micrometer.

18. The method of claim 11 wherein the step of exposing the casting material to X-rays is carried out by exposing the casting material to synchrotron radiation.

19. The method of claim 11 wherein the plating base is applied at least over a portion of the substrate as well as over the sacrificial release layer such that when the sacrificial release layer is removed, a portion of the deposited metal remains on the plating base attached to the substrate.