Pressure sensor

• US 5,189,916 A
• Filed: 08/12/1991
• Issued: 03/02/1993
• Est. Priority Date: 08/24/1990
• Status: Expired due to Fees

• Current Assignee: NGK Spark PLUG Company Limited
• Original Assignee: NGK Spark PLUG Company Limited
• Inventors: Mizumoto, Katsuyoshi, Kitsukawa, Kanehisa, Yasuda, Toshikatsu, Kojima, Takao
• Primary Examiner(s): Woodiel, Donald O.
• Application Number:
  US07/743,781
• Time in Patent Office: 568 Days
• Field of Search: 73/718, 73/719, 73/720, 73/721, 73/722, 73/723, 73/724, 73/725, 73/726, 73/727, 73/728, 73/729, 73/708, 73/706, 92/103 M, 92/103 R, 338/4, 338/42, 361/283, 336/30
• US Class Current: 73/724
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass

Abstract

A pressure sensor having a ceramic substrate formed from a first unsintered ceramic material, and a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering smaller than that of the first material. The diaphragm is fixed to the periphery of a surface of the ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials.

Claims

1. A pressure sensor, comprising:

a ceramic substrate formed from a first unsintered ceramic material;

a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering small than that of the first material, wherein said diaphragm is fixed to the periphery of a surface of said ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials; and

pressure sensing means for sensing pressure variations based on the deformation of said diaphragm.

2. A pressure sensor, comprising:

a ceramic substrate formed from a first unsintered ceramic material;

a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering smaller than that of the first material, wherein said diaphragm is fixed to the periphery of a surface of said ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials;

a first electrode formed on a surface of said ceramic substrate which faces said diaphragm; and

a second electrode formed on said diaphragm in opposition to said first electrode.

3. The pressure sensor of claim 2, wherein said second electrode is formed on an inside surface of said diaphragm which faces said ceramic substrate.

4. The pressure sensor of claim 2, wherein said second electrode is formed on an outside surface of said diaphragm.

5. The pressure sensor of claim 4, further comprising a protective layer formed over said second electrode and the outer surface of said diaphragm.

6. A pressure sensor, comprising:

a ceramic substrate formed from a first unsintered ceramic material;

a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering smaller than that of the first material, wherein said diaphragm is fixed to the periphery of a surface of said ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials; and

a resistor formed on an outer surface of said diaphragm, wherein the resistance of said resistor varies upon being distorted.

7. The pressure sensor of claim 6, further comprising a protective layer formed over said resistor and the outer surface of said diaphragm.

8. A pressure sensor, comprising:

a ceramic substrate formed from a first unsintered ceramic material;

a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering smaller than that of the first material, wherein said diaphragm is fixed to the periphery of a surface of said ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials;

pressure sensing means, formed on an outer surface of said diaphragm, for sensing pressure variations based on the deformation of said diaphragm; and

a protective layer formed over said pressure sensing means and the outer surface of said diaphragm.

9. A pressure sensor, comprising:

a ceramic substrate formed from a first unsintered ceramic material;

a diaphragm capable of deformation under pressure, and formed of a second unsintered ceramic material having a factor of shrinkage upon sintering smaller than that of the first material, wherein said diaphragm is fixed to the periphery of a surface of said ceramic substrate to form an integral assembly having a hollow space formed therebetween upon sintering due to the difference in the factor of shrinkage of the first and second materials;

pressure sensing means for sensing pressure variations based on the deformation of said diaphragm; and

compensating means, formed between said ceramic substrate and said diaphragm, for adjusting the difference in the factor of shrinkage between said diaphragm and said ceramic substrate.

10. The pressure sensor of claim 9, wherein said compensating means comprises a layer formed from a third unsintered ceramic material.

11. The pressure sensor of claim 10, wherein the third unsintered ceramic material has a factor of shrinkage upon sintering that is in between the factors of shrinkage of the first and second materials.

12. The pressure sensor of claim 9, wherein said pressure sensing means comprises:

a first electrode formed on a surface of said ceramic substrate which faces said diaphragm; and

a second electrode formed on said diaphragm in opposition to said first electrode.

13. The pressure sensor of claim 12, wherein said second electrode is formed on an inside surface of said diaphragm which faces said ceramic substrate.

14. The pressure sensor of claim 13, wherein said second electrode is formed on said compensating means.

15. The pressure sensor of claim 12, wherein said second electrode is formed on an outside surface of said diaphragm.

16. The pressure sensor of claim 15, further comprising a protective layer formed over said second electrode and the outer surface of said diaphragm.

17. The pressure sensor of claim 15, wherein said compensating means is formed on an inside surface of said diaphragm which faces said ceramic substrate.

18. The pressure sensor of claim 17, further comprising a protective layer formed over said second electrode and the outer surface of said diaphragm.

19. The pressure sensor of claim 12, wherein said compensating means is formed on an inside surface of said diaphragm which faces said ceramic substrate.

20. The pressure sensor of claim 19, wherein said second electrode is formed on said compensating means.

21. The pressure sensor of claim 12, wherein said compensating means is formed over said first electrode and an inside surface of said ceramic substrate.

22. The pressure sensor of claim 21, wherein said second electrode is formed on an inside surface of said diaphragm which faces said ceramic substrate.

23. The pressure sensor of claim 9, wherein said pressure sensing means comprises a resistor formed on the outer surface of said diaphragm, wherein the resistance of said resistor varies upon being distorted.

24. The pressure sensor of claim 23, further comprising a protective layer formed over said resistor and the outer surface of said diaphragm.

25. The pressure sensor of claim 9, further comprising warping preventing means, formed on a surface of said ceramic substrate, for preventing the pressure sensor from warping.