High density circuit board and method of making same
First Claim
1. In a multilayered circuit board assembly including first, second and third layered subassemblies arranged in a serially contiguous manner, each of said subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said subassemblies further including a predetermined wiring density and an electrical current resistance, the improvement wherein said wiring densities and said electrical current resistances of said subassemblies progressively decrease from said first subassembly to said third subassembly.
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Accused Products
Abstract
A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser resistance (and wiring density) than the others. In one example, several (e.g. at least four) such layered subassemblies may be included in the overall assembly such that those layers located along one side of the board may possess substantially greater wiring densities than the layers on the other side of the board while those layers on said other side will in turn possess lesser resistance (and greater current capacities). There are also described at least three methods for making the above multilayered circuit board assembly. Such a structure may be utilized in supercomputer applications.
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Citations
21 Claims
- 1. In a multilayered circuit board assembly including first, second and third layered subassemblies arranged in a serially contiguous manner, each of said subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said subassemblies further including a predetermined wiring density and an electrical current resistance, the improvement wherein said wiring densities and said electrical current resistances of said subassemblies progressively decrease from said first subassembly to said third subassembly.
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16. A method of making a multilayered circuit board assembly including at least three layered subassemblies, each of said layered subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said layered subassemblies including a predetermined wiring density and electrical current resistance, said method comprising the steps of:
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aligning said three layered subassemblies in a serially contiguous manner; providing at least one common through hole through said first, second and third layered subassemblies; providing a layer of conductive material within said common through hole and extending through said first, second and third layered subassemblies; and bonding said three layered subassemblies together to form said multilayered circuit board assembly, said wiring densities and said electrical current resistances of said layered subassemblies progressively decreasing from said first layered subassembly to said third layered subassembly. - View Dependent Claims (17)
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18. A method of making a multilayered circuit board assembly including at least three layered subassemblies, each of said layered subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said layered subassemblies including a predetermined wiring density and electrical current resistance, said method comprising the steps of:
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providing at least one through hole in each of said layered subassemblies; aligning said layered subassemblies having said though holes therein relative to one another such that said layered subassemblies are arranged in a serially contiguous manner and at least some of said through holes are aligned with one another; bonding said aligned layered subassemblies having said aligned through holes to form a multilayered structure; and providing a continuous conductive layer within each of said aligned through holes, said wiring densities and said electrical current resistances of said layered subassemblies progressively decreasing from said first layered subassembly to said third layered subassembly. - View Dependent Claims (19, 20, 21)
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Specification