Vacuum chuck

• US 5,191,218 A
• Filed: 06/28/1991
• Issued: 03/02/1993
• Est. Priority Date: 06/29/1990
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Mori, Tetsuzo, Kasumi, Kazuyuki, Marumo, Mitsuji, Iwamoto, Kazunori, Chiba, Yuji
• Primary Examiner(s): Berman, Jack I.
• Application Number:
  US07/723,336
• Time in Patent Office: 613 Days
• Field of Search: 250/453.1, 279/3, 269/21, 340/605, 340/611, 73/40
• US Class Current: 250/453.11
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: Y10S 294/907 Sensor controlled device
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

A vacuum-attraction holding device includes a holding base having an attracting surface, for holding a substrate thereon; a suction passageway formed in the base, for supplying a vacuum to the holding base to attract the substrate to the attracting surface; and a pressure sensor provided in the base and being communicated with the suction passageway.

Claims

1. A vacuum-attraction holding device, comprising:

a holding base having an attracting surface, for holding a substrate thereon;

a suction passageway formed in said base, for supplying a vacuum to said holding base to attract the substrate to said attracting surface; and

a pressure sensor provided in said base and being communicated with said suction passageway.

2. A device according to claim 1, further comprising an introduction passageway extending into said base, for introducing an ambience gas of said base, wherein said pressure sensor detects a difference between the pressure in said suction passageway and the pressure of the ambience gas.

3. A device according to claim 1, further comprising a timer for measuring a time in which vacuum is applied to said suction passageway, wherein, on the basis of the measured time and a differential pressure outputted by said pressure sensor, any abnormal operation is discriminated.

4. A vacuum-attraction holding device, comprising:

a holding base having an attracting surface, for holding a substrate thereon;

a suction passageway formed in said base, for supplying a vacuum to said holding base to attract the substrate to said attracting surface;

a gauging passageway formed in said base separately from said suction passageway, said gauging passageway being opened to said attracting surface; and

a pressure sensor communicated with said gauging passageway.

5. A device according to claim 4, wherein said pressure sensor detects a difference between the pressure in said gauging passageway and the pressure of an ambience gas of said base.

6. A device according to claim 4, further comprising a timer for measuring a time in which vacuum is applied to said suction passageway, wherein, on the basis of the measured time and a differential pressure outputted by said pressure sensor, any abnormal operation is discriminated.

7. An exposure apparatus, comprising:

a holding base having an attracting surface, for holding a substrate thereon;

a suction passageway formed in said base, for supplying a vacuum to said holding base to attract the substrate to said attracting surface;

a gauging passageway formed in said base separately from said suction passageway, said gauging passageway being opened to said attracting surface;

a pressure sensor communicated with said gauging passageway;

exposure means for exposing the substrate held on said base; and

control means for controlling at least one of the holding operation to the substrate through said base and the exposure operation to the substrate through said exposure means, on the basis of an output of said pressure sensor.

8. An apparatus according to claim 7, wherein said control means controls said at least one of the holding operation and the exposure operation, so that a a pressure of a predetermined level is attained between the substrate and said attracting surface.

9. An apparatus according to claim 7, further comprising a communication passageway for communicating said suction passageway and said gauging passageway, and a valve for openably closing said communication passageway.

10. An apparatus according to claim 9, wherein said valve is once opened upon a start of application of a vacuum to said suction passageway and then is closed.

11. An apparatus according to claim 7, wherein said pressure sensor detects a differential pressure with respect to a pressure surrounding said base.

12. An apparatus according to claim 7, wherein said pressure sensor detects a suction pressure produced between the substrate and said attracting surface.

13. A semiconductor wafer processing method for manufacture of semiconductor devices, said method comprising the steps of:

placing a semiconductor wafer on a holding base having an attracting surface;

supplying a vacuum to the base so that the wafer is attracted to the attracting surface through vacuum attraction;

detecting, within the base, a pressure related to the vacuum attraction; and

exposing the wafer held by said base;

wherein at least one of the holding operation to the wafer through the base and the exposure operation to the wafer is controlled on the basis of the detection of the pressure.

14. A method according to claim 13, wherein said pressure related to the vacuum attraction is controlled on the basis of the detection thereof so that said pressure has a predetermined level.

15. A method according to claim 13, wherein, in response to attainment of said pressure at said predetermined level, a subsequent operation for exposure of the wafer is started.

16. A semiconductor wafer processing method for manufacture of semiconductor devices, said method comprising the steps of:

providing a wafer holding base with a wafer attracting surface and having a suction passageway and a gauging passageway formed therein, wherein the gauging passageway is separate from the suction passageway and is opened to the attracting surface;

placing a semiconductor wafer on the base;

supplying a vacuum to the base through the suction passageway so that the wafer is attracted to the attracting surface through vacuum attraction;

detecting, through the gauging passageway, a pressure related to the vacuum attraction; and

exposing the wafer held by said base;

wherein at least one of the holding operation to the wafer through the base and the exposure operation to the wafer is controlled on the basis of the detection of the pressure.