Methods and apparatus for soldering without using flux

• US 5,193,738 A
• Filed: 09/18/1992
• Issued: 03/16/1993
• Est. Priority Date: 09/18/1992
• Status: Expired due to Term

• Current Assignee: Microfab Technologies, Inc.
• Original Assignee: Microfab Technologies, Inc.
• Inventors: Hayes, Donald J.
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/946,665
• Time in Patent Office: 179 Days
• Field of Search: 228/205, 228/242, 228/254, 228/240, 228/180.2, 228/6.2, 228/33, 219/121.6, 219/121.85
• US Class Current: 228/180.22
• CPC Class Codes: B08B 7/0042 by laser
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 3/06 Solder feeding devices; Solder melting pans
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/3489 Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.

Claims

1. The method of joining metallic surfaces comprising the steps of:

(a) positioning and maintaining a first metallic surface and a second metallic surface in a relatively inert environment;

(b) cleaning said first and said second surfaces with laser energy;

(c) forming a deposit of solder on one of said first and second surfaces;

(d) moving said first and second surfaces with respect to each other to position said deposit of solder in contact with the other of said first and second surfaces; and

(e) heating said deposit of solder until it reflows and forms a solder bond between said first metallic surface and said second metallic surface.

2. The method of preparing first and second surfaces to be joined with solder comprising the steps of:

(a) maintaining a first surface and a second surface in an atmosphere of relatively inert gas;

(b) providing a laser device producing laser energy in a predetermined band of wavelengths for cleaning said first surface and said second surface;

(c) providing an ejection device for ejecting drops of liquid solder;

(d) aligning said laser device to deliver laser energy to one of said first surface and said second surface;

(e) aligning said ejection device to deliver drops of liquid solder to said one of said first surface and said second surface;

(f) activating said laser device at a predetermined time, causing laser energy to be emitted and delivered to said one of said first surface and said second surface, to clean said one of said first surface and said second surface; and

(g) activating said ejection device at a different predetermined time, causing a predetermined number of drops of liquid solder to be emitted and delivered through said atmosphere of relatively inert gas to said one of said first surface and said second surface where said predetermined number of drops form a solid solder deposit.

3. The method of claim 2 further including the steps of:

(a) aligning said laser device so that the laser energy therefrom will be delivered to the other one of said first surface and said second surface; and

(b) activating said laser device, causing laser energy to be emitted and delivered to said other one of said first surface and said second surface, to clean said other one of said first surface and said second surface.

4. The method of claim 2 wherein said different predetermined time of activating said ejection device occurs after said predetermined time of activating said laser device.

5. The method of claim 2 wherein said predetermined number of drops of liquid solder comprises one drop.

6. The method of claim 2 wherein said predetermined number of drops of liquid solder comprises more than one drop.

7. The method of claim 2 wherein said first surface comprises multiple wettable metal pads on a microelectronic device.

8. The method of claim 7 wherein said microelectronic device comprises a surface mount package.

9. The method of claim 7 wherein said microelectronic device comprises an integrated circuit chip.

10. The method of claim 3 further including the steps of:

(a) causing relative movement between said first surface and said second surface to place said deposit located on said one of said first surface and said second surface in contact with said other one of said first surface and said second surface; and

(b) heating said first surface, said second surface and said solder deposit to reflow the solder and join said first and second surfaces.

11. Apparatus for preparing a first surface and a second surface to be joined with solder comprising:

(a) means for maintaining a first surface and a second surface in an atmosphere of relatively inert gas;

(b) a laser device adapted to clean said first surface and said second surface; and

(c) an ejection device adapted to receive liquid solder and eject a predetermined number of drops of liquid solder onto one of either said first surface or said second surface after such surface has been cleaned by said laser device.

12. Apparatus as defined in claim 11 further including:

(a) means for moving one of said first surface and said second surface with respect to the other surface and place the solder located on said one of either said first surface or said second surface in contact with said other one of said first surface and said second surface; and

means for heating said first surface, said second surface and said solder to reflow the solder and join said first and second surfaces.

13. Apparatus as defined in claim 11 wherein said laser device is a pulsed laser.

14. Apparatus as defined in claim 11 wherein said laser device is a continuous wave laser.

15. Apparatus as defined in claim 11 wherein said predetermined number of drops of liquid solder is one drop.

16. Apparatus as defined in claim 11 wherein said predetermined number of drops of liquid solder is more than one drop.

17. Apparatus as defined in claim 11 wherein said first surface comprises multiple wettable metal pads on a microelectronic device.

18. Apparatus as defined in claim 17 wherein said microelectronic device is a surface mount package.

19. Apparatus of as defined in claim 17 wherein said microelectronic device is an integrated circuit chip.

20. Apparatus as defined in claim 11 wherein said second surface comprises multiple wettable connect pads on a substrate.