Laminar polymeric sheet

• US 5,194,316 A
• Filed: 02/26/1991
• Issued: 03/16/1993
• Est. Priority Date: 02/05/1988
• Status: Expired due to Term

• Current Assignee: Tyco Electronics UK Limited (TE Connectivity Limited)
• Original Assignee: Raychem Limited (TE Connectivity Limited)
• Inventors: Horner, Patrick J., Nyholm, Peter, Smith, Nicholas J. G., Ludden, Michael J., Penneck, Richard J.
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): KRYNSKI, WILLIAM A
• Application Number:
  US07/548,961
• Time in Patent Office: 749 Days
• Field of Search: 428/137, 428/209, 428/411.1, 428/473.5, 428/474.4, 428/901
• US Class Current: 428/195.1
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 31/02 relating to soldering or welding dip or wave soldering in the manufacture of printed circuits H05K3/34
• CPC Class Codes: G03F 7/039 Macromolecular compounds which are photodegradable, e.g. positive electron resists G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0326 containing O
• CPC Class Codes: H05K 1/0333 containing S
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 3/0032 : of organic insulating material
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24322 : Composite web or sheet
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/31504 : Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31721 : Of polyimide
• CPC Class Codes: Y10T 428/31725 : Of polyamide

Abstract

A sheet laminate of polyimide and amorphous polyamide especially suitable for making anisotropically electrically conductive articles by laser abiation drilling followed by metal plating. Preferred polyimides include those derived from polymerization of 4,4'"'"'biphenyldianhydride and 4,4'"'"'-diaminobiphenylether or p-phenylenediamine. Preferred amorphous polyamides include those derived from condensation of terephthalic acid with isomers of trimethylhexamethylenediamine.

Claims

1. A laminar sheet comprising a layer of polyimide material laminated in direct contact with a layer of amorphous polyamide material.

2. A sheet according to claim 1 wherein the polyamide material comprises amorphous aromatic polyamide material.

3. A sheet according to claim 1, wherein each of the two main surfaces of the layer of polyimide material is laminated in direct contact with a layer of the polyamide material.

4. A sheet according to claim 1, wherein the polyimide layer is substantially co-extensive with the polyamide layer(s).

5. A sheet according to claim 1, which has been cross-linked by exposure to UV light.

6. A sheet according to claim 5 which has been selectively cross-linked to form a resist pattern.

7. A sheet according to claim 1, in which through-holes have been produced by exposure of selected areas of the sheet to U.V. laser light.

8. A sheet according to claim 1, having through-holes containing electrically conductive material which provides an electrically conductive path between the main surfaces of the sheet.

9. A sheet according to claim 8, wherein the electrically conductive material providing each conductive path comprises metal plated on the interior surface of the through-holes.

10. A sheet according to claim 8, wherein each such conductive path is electrically separate from substantially all the other such paths.

11. A sheet produced by removal of at least part of the polyamide layer(s) from the surface(s) of the polyimide layer of a sheet according to claim 8, so as to leave the electrically conductive material in the through-holes projecting beyond the resulting main surface(s) of the sheet.

12. A sheet according to claim 11 following substantially complete removal of the polyamide layer(s).

13. A sheet according to any of claim 1, in the form of an electrically insulating covering of an electrical wire.

14. A sheet according to claim 1, wherein the polyamide is derived from

(A) the condensation of terephthalic acid with at least one isomer of trimethylhexamethylene diamine (preferably containing a mixture of 2,2,4-and 2,4,4-trimethylhexamethylene diamine isomers), or

(B) the condensation of one or more bisaminomethylnorbornane isomers with one or more aliphatic, cycloaliphatic or aromatic dicarboxylic acids and optionally includes one or more amino acid or lactam e.g. epsilon-caprolactam comonomers, or

(C) laurinlactam, isophthalic acid and bis-(4-amino-3-methylcyclohexyl) methane,

(D) the condensation of 2,2-bis-(p-aminocyclohexyl) propane with adipic and azeleic acids, or the condensation of trans cyclohexane-1,4-dicarboxylic acid with the trimethylhexamethylene diamine isomers mentioned in (A) above, or

(E) polyamides based on units derived from m-xylylenediamine and adipic acid.

15. A sheet according to claim 1, wherein the polyimide is derived from 4,4'"'"'biphenyldianhydride and (4,4'"'"'-diaminobiphenyl, or 4,4'"'"'-diaminobiphenylether, or phenylenediamine).

16. A sheet according to claim 1, comprising at least one further layer of polymeric material overlying at least one layer of the polyaminde material.

17. A sheet according to claim 1 comprising at least one metallic layer overlying at least one layer of polyamide material.

18. A sheet according to claim 17 comprising the layer of polyimide material having a layer of the polyamide material on one or both of its main surfaces, and a metallic layer on the, or one, or both of the said further layers.

19. A sheet according to claim 1, wherein the polyimide material is capable of retaining at least 50%, preferably at least 75%, more preferably at least 85% of its original elongation after immersion in water of pH10 at 100°

C. for 4 days according to ASTM D882.

20. A sheet according to claim 1, wherein the polyimide material is derived from polymerisation of 4,4'"'"'-biphenyl dianhydride and p-phenylenediamine.

24. A sheet or article according to claim 1 having through-holes laser-drilled therein with a hole taper (relative to the hole axis) less than 10°

, preferably less than 8°

, more preferably less than 6°

, and especially less than 4°

.

21. An anisotropically electrically conductive article comprising porous electrically insulating polyimide sheet material at least a selected portion of which has at least 25 substantially non-interconnected pores per square millimeter of its surface, at least a significant proportion of which pores individually contain electrically conductive material which provides an electrically conductive path between, and projects beyond at least one of, the main surfaces of the sheet material, each such conductive path being electrically separate from substantially all the other such conductive paths, and the polyimide being derived from polymerisation of 4,4'"'"'-biphenyl dianhydride and (4,4'"'"'-diaminobiphenyl, or 4,4'"'"'-diaminobiphenylether, or phenylenediamine) and/or being capable of retaining at least 50%, preferably at least 75%, more preferably at least 85% of its original elongation after immersion in water of pH10 at 100°

C. for 4 days according to ASTM D882.

22. An anisotropically electrically conductive article comprising porous electrically insulating polyimide sheet material at least a selected portion of which has at least 25 substantially non-interconnected pores per square millimeter of its surface, at least a significant proportion of which pores are internally plated with electrically conductive material, and the electrically conductive material provides an electrically conductive path between the main surfaces of the sheet material and each such path is electrically separate from substantially all the other such paths, and the polyimide being derived from polymerisation of 4,4'"'"'-biphenyl dianhydride and (4,4'"'"'-diaminobiphenyl, or 4,4'"'"'-diaminobiphenylether, or phenylenediamine) and/or being capable of retaining at least 50%, preferably at least 75%, more preferably at least 85% of its original elongation after immersion in water of pH10 to 100°

C. for 4 days according to ASTM D882.

23. An anisotropically electrically conductive article comprising porous electrically insulating polyimide sheet material at least a selected portion of which has a plurality of substantially non-interconnected pores at least a significant proportion of which pores individually contain a tubular first portion of electrically conductive material, which tubular material projects beyond at least one of the main surfaces of the sheet material, and the polyimide being derived from polymerisation of 4,4'"'"'-biphenyl dianhydride and (4,4'"'"'-diaminobiphenyl, or 4,4'"'"'-diaminobiphenylether, or phenylenediamine) and/or being capable of retaining at least 50%, preferably at least 75%, more preferably at least 85% of its original elongation after immersion in water of pH10 at 100°

C. for 4 days according to ASTM D882.