×

Integrated circuit package with molded cell

  • US 5,196,374 A
  • Filed: 12/03/1991
  • Issued: 03/23/1993
  • Est. Priority Date: 01/26/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for packaging an electronic circuit device of the type having positive and negative power nodes and a battery for providing electrical power to the electronic circuit device comprising the steps:

  • arranging the conductive finger leads of a coplanar finger lead assembly in spaced relation about an interconnect region with one of the conductive finger leads defining a first polarity power lead and having a base plate disposed within said interconnect region, and one of the conductive finger leads defining a second polarity power lead;

    mounting said electronic circuit device on the base plate on one side of the coplanar finger lead assembly;

    connecting the positive and negative power leads of a battery to the first and second polarity power finger leads on one side of the coplanar finger lead assembly;

    connecting the positive and negative power nodes of said electronic circuit device to the first and second power finger leads by first and second wire conductors, respectively; and

    ,encapsulating the electronic circuit device, battery, battery power leads, finger leads and wire conductors within a body of non-conductive material.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×