Integrated circuit package with molded cell

• US 5,196,374 A
• Filed: 12/03/1991
• Issued: 03/23/1993
• Est. Priority Date: 01/26/1990
• Status: Expired due to Term

• Current Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Original Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Inventors: Hundt, Michael J., Kelappan, Krishnan
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US07/801,254
• Time in Patent Office: 476 Days
• Field of Search: 437/209, 437/214, 437/220, 365/228, 365/229, 429/123, 439/68, 439/69, 439/70, 439/71, 439/72, 439/73, 357/70, 357/72
• US Class Current: 29/827
• CPC Class Codes: G11C 5/141 Battery and back-up supplies
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49593 Battery in combination with a leadframe
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01055 Cesium [Cs]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/20753 larger or equal to 30 microns less than 40 microns
• CPC Class Codes: Y10S 257/924 : with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

Claims

1. A method for packaging an electronic circuit device of the type having positive and negative power nodes and a battery for providing electrical power to the electronic circuit device comprising the steps:

arranging the conductive finger leads of a coplanar finger lead assembly in spaced relation about an interconnect region with one of the conductive finger leads defining a first polarity power lead and having a base plate disposed within said interconnect region, and one of the conductive finger leads defining a second polarity power lead;

mounting said electronic circuit device on the base plate on one side of the coplanar finger lead assembly;

connecting the positive and negative power leads of a battery to the first and second polarity power finger leads on one side of the coplanar finger lead assembly;

connecting the positive and negative power nodes of said electronic circuit device to the first and second power finger leads by first and second wire conductors, respectively; and

,

encapsulating the electronic circuit device, battery, battery power leads, finger leads and wire conductors within a body of non-conductive material.

2. A method for packaging an electronic circuit device and battery as defined in claim 1, wherein the electronic circuit device is an integrated circuit implemented on a semiconductor substrate, said integrated circuit having a plurality of input/output nodes, including the steps of mounting the semiconductor substrate on the base plate, and connecting the input/output nodes to the conductive finger leads by wire conductors.

3. A method for packaging an electronic circuit device of the type having first and second power input nodes and a battery for providing electrical power to said electronic circuit device comprising the steps:

connecting the positive and negative power leads of an axial lead battery to first and second finger leads of a coplanar finger lead assembly with the axial lead battery being supported by its power leads in offset relation to one side of the coplanar finger lead assembly;

mounting the electronic circuit device on one of the finger leads;

connecting the first and second device power input nodes to the first and second finger leads by first and second wire conductors, respectively; and

,

encapsulating the electronic circuit device, battery, finger leads and wire conductors within a body of non-conductive material.