×

High temperature superconductor deposition by sputtering

  • US 5,196,400 A
  • Filed: 08/17/1990
  • Issued: 03/23/1993
  • Est. Priority Date: 08/17/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. A method of employing a direct-current magnetron sputtering device to sputter a first material which has low heat and electrical conductivity at the temperatures encountered in the sputtering operation from a target to a substrate, the method comprising the steps of:

  • employing a second material with high heat and electrical conductivity for the target;

    applying a coating of the first material to a surface of the target which is subject to ion bombardment in the sputtering device, the coating being applied by spraying a powder of the first material onto the surface and having the property that particles of the first material are tightly bound to each other and/or to the surface; and

    operating the sputtering device using the target.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×