Electric circuit device having an electric connecting member and electric circuit components

• US 5,197,892 A
• Filed: 03/27/1991
• Issued: 03/30/1993
• Est. Priority Date: 05/31/1988
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Tarayama, Yoshimi, Kondo, Hiroshi, Haga, Shunichi, Konishi, Masaki, Yoshizawa, Tetsuo, Sakaki, Takashi, Ichida, Yasuteru
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US07/677,379
• Time in Patent Office: 734 Days
• Field of Search: 439/65, 439/66, 439/70, 439/71, 439/74, 439/75, 439/91, 439/586, 439/591, 228/180.2, 228/193, 228/194, 29/830, 29/840, 29/876, 29/825, 29/852, 29/884, 174/52.4, 174/84 R, 174/88 R
• US Class Current: 439/91
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 3/321 : by conductive adhesives

Abstract

An electric circuit device comprises an electric connecting member comprising a support member made of an electrically insulating material and a plurality of electrically conductive members buried in the support member and being isolated from one another. The ends of one side of the electrically conductive members are exposed at one surface of the support member, and the ends on the other side of the electrically conductive members are exposed at another surface of the support member. A first electric circuit component has connecting regions connected to the one set of ends of the electrically conductive members, and a second electric circuit component has connecting regions connected to the other set of ends of the electrically conductive members. Some of the electrically conductive members can be arranged in a zigzag pattern, and the pattern of the exposed ends of at least one electrically conductive member is wave-like or S-like.

Claims

1. An electric circuit device comprising:

an electric connecting member having a support member made of an electrically insulating material and a plurality of electrically conductive members, having first and second ends, buried in said support member and being isolated from one another, with said first ends of said electrically conductive members being exposed at a first surface of said support member, and said second ends of said electrically conductive members being exposed at a second surface of said support member;

a first electric circuit component having connecting regions connected to said first ends of said electrically conductive members; and

a second electric circuit component having connecting regions connecting to said second ends of said electrically conductive members, wherein

the first and second exposed ends of at least one electrically conductive member is wave-like or S-like in shape along a surface substantially parallel to said first surface of said support member, and said ends of said electrically conductive members are diffused so as to exchange atoms with said connecting regions of said electric circuit components.

2. An electric circuit device according to claim 1, wherein said electrically conductive members are made of gold.

3. An electric circuit device according to claim 1, wherein said electrically conductive members are made of an alloy.

4. An electric circuit device according to claim 1, wherein all of said electric circuit components are connected by metallization.

5. An electric circuit device according to claim 1, wherein some of said electric circuit components are connected by metallization.

6. An electric circuit device according to claim 1, further comprising a cap sealer for sealing said first and second electric circuit components.

7. An electric circuit device according to claim 1, where at least a part of said exposed electrically conductive members are arranged in adjacent rows that are in a zigzag form. a