Fully clad electric PTC heater with a finned protective casing
First Claim
1. A PTC semiconductor heating means comprising:
- an elongated thermally and electrically conductive casing made as a hollow column having upper, lower and side portions, a first socket formed in a first end portion of said casing, a second socket formed in a second end portion of said casing opposite to said first socket, and at least a corrugated groove longitudinally recessed in a side portion of said casing;
an electrically insulating plate overlain on a lower portion of said casing within said casing;
an electrically conductive plate overlain on said electrical insulating plate;
a plurality of positive-temperature-coefficient semiconductor heating elements positioned in said casing, each said semiconductor heating element having a lower conducting surface contacting said electrically conducting plate and having an upper conducting surface contacting an upper portion of said casing;
a first pole connector connectable to a first pole of a power source sealing said first socket of said casing and electrically connected to said electrically conductive plate;
a second pole connector connectable to a second pole of the power source sealing said second socket of said casing and electrically connected to the upper portion of said casing; and
a plurality of heat-exchange plates longitudinally juxtapositionally mounted on said casing, thereby forming a PTC semiconductor heating means with all of said heating elements, said conductive plate and said insulating plate fully clad in said casing which is sealed by said first and second pole connectors, and whereby upon a powering of said first and second pole connectors, each said semiconductor heating element is powered to produce heat which is transferred outwardly through said casing and said heat-exchange plates.
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Accused Products
Abstract
A plurality of positive-temperature-coefficient (PTC) semiconductors are longitudinally positioned in an elongated, finned, thermally and electrically conductive hollow casing having a socket at each end. A first plug connector of a power source seals one of the sockets and is electrically connected to the lower conducting surface of each PTC semiconductor through an electrically conductive plate electrically insulated from the casing by an electrically insulative plate. A second plug connector of the source electrically seals the other socket and is electrically the connected to the upper conducting surface of each PTC semiconductor through an upper portion of the electrically conductive casing, thereby providing an electric heater with the PTC semiconductors and plates fully clad by the casing for enhanced safety, increased efficiency, and more stable construction. An electrically conductive plate may be inserted between the upper surface of each PTC semiconductor and an electrically insulative plate in the upper portion of the casing for connecting the second pole connector of the power source.
37 Citations
10 Claims
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1. A PTC semiconductor heating means comprising:
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an elongated thermally and electrically conductive casing made as a hollow column having upper, lower and side portions, a first socket formed in a first end portion of said casing, a second socket formed in a second end portion of said casing opposite to said first socket, and at least a corrugated groove longitudinally recessed in a side portion of said casing; an electrically insulating plate overlain on a lower portion of said casing within said casing; an electrically conductive plate overlain on said electrical insulating plate; a plurality of positive-temperature-coefficient semiconductor heating elements positioned in said casing, each said semiconductor heating element having a lower conducting surface contacting said electrically conducting plate and having an upper conducting surface contacting an upper portion of said casing; a first pole connector connectable to a first pole of a power source sealing said first socket of said casing and electrically connected to said electrically conductive plate; a second pole connector connectable to a second pole of the power source sealing said second socket of said casing and electrically connected to the upper portion of said casing; and a plurality of heat-exchange plates longitudinally juxtapositionally mounted on said casing, thereby forming a PTC semiconductor heating means with all of said heating elements, said conductive plate and said insulating plate fully clad in said casing which is sealed by said first and second pole connectors, and whereby upon a powering of said first and second pole connectors, each said semiconductor heating element is powered to produce heat which is transferred outwardly through said casing and said heat-exchange plates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A PTC semiconductor heating means comprising:
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an elongated thermally and electrically conductive casing made as a hollow column having a first socket formed in a first end portion of said casing, and a second socket formed in a second end portion of said casing opposite to said first socket; an upper and a lower electrical insulating plate respectively formed in said casing;
on an upper portion and a lower portion of said casing;an upper and a lower electrically conductive plate respectively retained on said two electrical insulating plates; a plurality of positive-temperature-coefficient semiconductor heating elements positioned in said casing and retained between said two electrically conductive plates, each said semiconductor heating element having a lower electrically conducting surface contacting said lower electrically conductive plate and having an upper conducting surface contacting the upper electrically conductive plate; a first pole connector connectable to a first pole of a power source sealing said first socket of said casing and electrically connected to said lower electrically conducting plate; a second pole connector connectable to a second pole of the power source sealing said second socket of said casing and electrically connected to said upper electrically conductive plate; and a plurality of heat-exchange plates longitudinally juxtapositionally mounted on said casing, whereby upon a powering of said first and second pole connectors, each said semiconductor heating element is powered to produce heat transferred outwardly through said casing and said heat-exchange plates.
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Specification