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Method and apparatus for cooling wafers

  • US 5,199,483 A
  • Filed: 05/15/1991
  • Issued: 04/06/1993
  • Est. Priority Date: 05/15/1991
  • Status: Expired due to Term
First Claim
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1. A wafer cooling apparatus, comprising:

  • a chamber;

    a pedestal comprising a support body having a substantially planar wafer support surface exposed to said chamber, said wafer support surface being provided with a groove which is so configured and located as to form an open channel when said wafer is supported on said surface to permit the escape of gas trapped between said wafer and said surface as the wafer is lowered onto the surface to prevent skating; and

    a mechanism for lowering a wafer disposed within said chamber towards said wafer support surface of said support body, whereby said support body is adapted to remove heat from said wafer.

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