Process for metallizing substrate surfaces

• US 5,200,272 A
• Filed: 07/30/1992
• Issued: 04/06/1993
• Est. Priority Date: 04/29/1988
• Status: Expired due to Fees

• Current Assignee: Bayer AG, Miles, Inc. (Bayer AG)
• Original Assignee: Bayer AG, Miles, Inc. (Bayer AG)
• Inventors: Williams, John L., Sirinyan, Kirkor, Dederichs, Reinhold, Wolf, Gerhard-Dieter, Merten, Rudolf, von Gizycki, Ulrich
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): DANG, VI
• Application Number:
  US07/922,592
• Time in Patent Office: 250 Days
• Field of Search: 427/304, 427/306, 427/404, 428/458
• US Class Current: 428/458
• CPC Class Codes: C23C 18/208 with use of metal first
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/387 for electroless plating H05K3/4661 takes precedence
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.

The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.

Claims

1. A process for depositing a strongly adhering metallic coating on a substrate surface which comprises

a) applying to said surface a primer composition comprising a film-forming organic polymer and a polymeric organic additive having a surface tension of 45 to 70 mM/m, wherein said additive comprises a member selected from the group consisting of polyesters, polyamides and polyoxazolines,

b) wetting the primed surface prepared in a) with a solution of an organometallic compound based on an element from Group 1 or 8 of the periodic table,

c) reducing the organometallic compound to the pure metal either during or prior to step d) and

d) non-electrically metallizing the activated primed surface prepared in

b) either in conjunction with or following step c) by the wet chemical method.

2. The process of claim 1 wherein said film-forming organic polymer comprises a polyurethane.

3. The process of claim 1 wherein said organometallic compound is based on an element comprising Cu, Au, Ag, Pt, Pd or Ru.

4. The process of claim 1 which comprises conducting step c) in an ultrasound bath.

5. The process of claim 1 wherein said primer composition additionally contains a filler.

6. The process of claim 5 wherein said filler comprises a member selected from the group consisting of silicates and conductive carbon blacks.

7. A substrate having a strongly adhering metallic coating which is prepared by a process which comprises

a) applying to the surface of said substrate a primer composition comprising a film-forming organic polymer and a polymeric organic additive having a surface tension of 45 to 70 mN/m, wherein said additive comprises a member selected from the group consisting of polyesters, polyamides and polyoxazolines,

b) wetting the primed surface prepared in a) with a solution of an organometallic compound based on an element from Group 1 or 8 of the periodic table,

c) reducing the organometallic compound to the pure metal either during or prior to step d) and

d) non-electrically metallizing the activated primed surface prepared in

b) either in conjunction with or following step c) by the wet chemical method.

8. The substrate of claim 7 wherein said film-forming organic polymer comprises a polyurethane.

9. The substrate of claim 7 wherein said organometallic compound is based on an element comprising Cu, Au, Ag, Pt, Pd or Ru.

10. The substrate of claim 7 which comprises conducting step c) in an ultrasound bath.

11. The substrate of claim 7 wherein said primer composition additionally contains a filler.

12. The substrate of claim 11 wherein said filler comprises a member selected from the group consisting of silicates and conductive carbon blacks.