Process for metallizing substrate surfaces
First Claim
1. A process for depositing a strongly adhering metallic coating on a substrate surface which comprisesa) applying to said surface a primer composition comprising a film-forming organic polymer and a polymeric organic additive having a surface tension of 45 to 70 mM/m, wherein said additive comprises a member selected from the group consisting of polyesters, polyamides and polyoxazolines,b) wetting the primed surface prepared in a) with a solution of an organometallic compound based on an element from Group 1 or 8 of the periodic table,c) reducing the organometallic compound to the pure metal either during or prior to step d) andd) non-electrically metallizing the activated primed surface prepared inb) either in conjunction with or following step c) by the wet chemical method.
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Abstract
An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.
The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.
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Citations
12 Claims
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1. A process for depositing a strongly adhering metallic coating on a substrate surface which comprises
a) applying to said surface a primer composition comprising a film-forming organic polymer and a polymeric organic additive having a surface tension of 45 to 70 mM/m, wherein said additive comprises a member selected from the group consisting of polyesters, polyamides and polyoxazolines, b) wetting the primed surface prepared in a) with a solution of an organometallic compound based on an element from Group 1 or 8 of the periodic table, c) reducing the organometallic compound to the pure metal either during or prior to step d) and d) non-electrically metallizing the activated primed surface prepared in b) either in conjunction with or following step c) by the wet chemical method.
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7. A substrate having a strongly adhering metallic coating which is prepared by a process which comprises
a) applying to the surface of said substrate a primer composition comprising a film-forming organic polymer and a polymeric organic additive having a surface tension of 45 to 70 mN/m, wherein said additive comprises a member selected from the group consisting of polyesters, polyamides and polyoxazolines, b) wetting the primed surface prepared in a) with a solution of an organometallic compound based on an element from Group 1 or 8 of the periodic table, c) reducing the organometallic compound to the pure metal either during or prior to step d) and d) non-electrically metallizing the activated primed surface prepared in b) either in conjunction with or following step c) by the wet chemical method.
Specification