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Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film

DC
  • US 5,200,362 A
  • Filed: 09/09/1991
  • Issued: 04/06/1993
  • Est. Priority Date: 09/06/1989
  • Status: Expired due to Term
First Claim
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1. A process for fabricating a semiconductor device comprising the steps of:

  • providing a transfer film;

    providing a pattern of conductive traces on said transfer film;

    providing a semiconductor device die;

    forming electrical interconnections between said pattern of conductive traces and said semiconductor device die;

    providing a resin material on one side of said transfer film to encapsulate said semiconductor device die, said electrical interconnections, and a portion of said pattern of conductive traces; and

    removing said transfer film to expose one side of said pattern of conductive traces.

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