Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
First Claim
1. A structure for removing heat at a surface comprising:
- a plurality of fin assemblies;
each of said plurality of fin assemblies have at least a part thereof being disposed adjacent at least a part of another of said plurality of fin assemblies so that said adjacent parts of said fin assemblies are slidably engaged with respect to each other;
said base of each of said plurality of fin assemblies is adapted for being disposed in thermal contact with said surface;
a bias means for biasing each of said plurality of fin assemblies towards said surface;
a housing enclosing said fin assemblies and permitting channelling of a fluid between said fins;
said housing is formed form folded sheet metal and has a top portion and two side portions, said housing has engagement means for holding said bias means in attachment with said housing.
1 Assignment
0 Petitions
Accused Products
Abstract
Heat dissipation structures formed from folded sheet metal are described. The structure permits close thermal contact to a heat generating surface by permitting independent movement of fins or fin assemblies. The fin assemblies are spring biased towards the heat generating surface by a spring means which is disposed between the tops of the fin assemblies and a cover which forms a duct surrounding the fin assemblies for holding the fin assemblies together and for permitting a fluid, such as air, to be channeled over the fin assemblies. The cover has grips for gripping onto the side portions of the heat generating surface. Furthermore, the cover has means for gripping onto the spring bias means for fixedly attaching it thereto. Furthermore, the fin assemblies have means for engaging with the bias means for holding the fin assemblies in fixed special relation with the spring bias means. The fin assemblies, spring bias means and cover form a unitary structure which can be detachably mounted or snap fit onto a heat generating surface, such as a semiconductor chip module.
84 Citations
20 Claims
-
1. A structure for removing heat at a surface comprising:
-
a plurality of fin assemblies; each of said plurality of fin assemblies have at least a part thereof being disposed adjacent at least a part of another of said plurality of fin assemblies so that said adjacent parts of said fin assemblies are slidably engaged with respect to each other; said base of each of said plurality of fin assemblies is adapted for being disposed in thermal contact with said surface; a bias means for biasing each of said plurality of fin assemblies towards said surface; a housing enclosing said fin assemblies and permitting channelling of a fluid between said fins; said housing is formed form folded sheet metal and has a top portion and two side portions, said housing has engagement means for holding said bias means in attachment with said housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification