Method of manufacturing silicon semiconductor acceleration sensor devices
First Claim
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1. A method of manufacturing a semiconductor acceleration sensor comprising:
- oxidizing a silicon wafer to form an oxide film;
removing the oxide film and underlying silicon in a U-shaped pattern at a front surface of the wafer by etching to form a portion that is to become a cantilever;
depositing a thin metal film covering the U-shaped pattern that is to become the cantilever;
etching a recessed portion in the rear surface of the silicon wafer encompassing the U-shaped pattern, thereby forming the cantilever;
dicing the silicon wafer into chips; and
removing at least part of the thin metal film by mechanically deflecting the cantilever, thereby releasing the cantilever.
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Abstract
A method of manufacturing a semiconductor acceleration includes oxidizing a silicon wafer, removing the oxide film and underlying silicon in a U-shaped pattern at a front surface of the wafer by etching to form a portion that is to become a cantilever, depositing a thin metal film covering the U-shaped pattern that is to become the cantilever, etching a recessed portion in the rear surface of the silicon wafer encompassing the U-shaped pattern, thereby forming the cantilever, dicing the silicon wafer into chips, and removing at least part of the thin metal film, thereby releasing the cantilever.
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2 Claims
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1. A method of manufacturing a semiconductor acceleration sensor comprising:
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oxidizing a silicon wafer to form an oxide film; removing the oxide film and underlying silicon in a U-shaped pattern at a front surface of the wafer by etching to form a portion that is to become a cantilever; depositing a thin metal film covering the U-shaped pattern that is to become the cantilever; etching a recessed portion in the rear surface of the silicon wafer encompassing the U-shaped pattern, thereby forming the cantilever; dicing the silicon wafer into chips; and removing at least part of the thin metal film by mechanically deflecting the cantilever, thereby releasing the cantilever. - View Dependent Claims (2)
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Specification