Wet micro-channel wafer chuck and cooling method

• US 5,203,401 A
• Filed: 05/22/1992
• Issued: 04/20/1993
• Est. Priority Date: 06/29/1990
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Digital Equipment Corporation (HP Inc.)
• Inventors: Fitch, John S., Hamburgen, William R.
• Primary Examiner(s): DAVIS JR, ALBERT
• Application Number:
  US07/888,040
• Time in Patent Office: 333 Days
• Field of Search: 165/104.32, 165/917, 165/80.1, 165/80.2, 165/80.4, 165/80.5, 361/385, 324/158 F
• US Class Current: 165/80.4
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: Y10S 165/917 Pressurization and/or degassification

Abstract

A wet micro-channel wafer chuck (10) holds a semiconductor wafer 12 having a plurality of high powered chips (14) held in place with vacuum provided in the chuck (10). The chuck (10) has a plurality of micro-channels (16), which extend along cooling fins (18), on which the semiconductor wafer (12) rests when it is held in place on the chuck. A water supply manifold (20) extends perpendicular to the micro-channels (16) across the chuck (10). Water supply slot (22) extends upward from the water supply manifold into the micro-channels (16). Similarly, water exit slots (24) extend upward from water exit manifolds (26) into the micro-channels (16). Water (28) is delivered from pump (30) of an external recirculator/chiller (32) to the supply manifold (20) and into the many micro-channels (16) that pass under the wafer (12) under test. The water (28) leaves the micro-channels (16), enters the exit slots (24) and then the exit manifolds (26), from which it is returned to the recirculator/chiller (32). Reservoir or tank (34) of the recirculator/chiller (32) is connected to a regulated vacuum source (36). By applying a vacuum, the pressure in the cooling loop is lowered below atmospheric, and the wafer (12) under test is held against surface (38) of the chuck (10).

Claims

1. A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of cooling fins, a liquid coolant circulation system including at least one liquid coolant supply manifold positioned in said body to supply liquid coolant to said plurality of micro-channels and at least one liquid coolant exit manifold positioned in said body to remove liquid coolant from said plurality of micro-channels, and a source of a vacuum connected to said liquid coolant circulation system.

2. The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold is connected to said plurality of micro-channels by at least one liquid supply slot and said at least one liquid coolant exit manifold is connected to said plurality of micro-channels by at least one liquid exit slot.

3. The chuck for cooling a planar electronic substrate of claim 2 in which said at least one liquid supply slot and said at least one liquid exit slot extend from a bottom surface of said body into said body to said plurality of micro-channels.

4. The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold and said at least one liquid coolant exit manifold are directly connected to said plurality of micro-channels.

5. The chuck for cooling a planar electronic substrate of claim 1 in which said chuck is configured to hold a semiconductor wafer as the planar electronic substrate.

6. The chuck for cooling a planar electronic substrate of claim 1 in which said at least one liquid coolant supply manifold is connected to a source of water as the liquid coolant.

7. A method for cooling a planar electronic substrate, which comprises positioning the planar electronic substrate on a cooling chuck having a body and a planar upper surface with a plurality of micro-channels extending from the planar upper surface into the body, circulating liquid coolant in the micro-channels, and applying a vacuum to the liquid coolant in the micro-channels to apply force for holding the planar electronic substrate on the cooling chuck.

8. The method for cooling a planar electronic substrate of claim 7 in which the plurality of micro-channels are connected to a source of water as the liquid coolant.

9. The method for cooling a planar electronic substrate of claim 7 additionally comprising the step of applying continuous operating power to the planar electronic substrate while the liquid coolant is circulated in the micro-channels.