Wet micro-channel wafer chuck and cooling method
First Claim
1. A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of cooling fins, a liquid coolant circulation system including at least one liquid coolant supply manifold positioned in said body to supply liquid coolant to said plurality of micro-channels and at least one liquid coolant exit manifold positioned in said body to remove liquid coolant from said plurality of micro-channels, and a source of a vacuum connected to said liquid coolant circulation system.
3 Assignments
0 Petitions
Accused Products
Abstract
A wet micro-channel wafer chuck (10) holds a semiconductor wafer 12 having a plurality of high powered chips (14) held in place with vacuum provided in the chuck (10). The chuck (10) has a plurality of micro-channels (16), which extend along cooling fins (18), on which the semiconductor wafer (12) rests when it is held in place on the chuck. A water supply manifold (20) extends perpendicular to the micro-channels (16) across the chuck (10). Water supply slot (22) extends upward from the water supply manifold into the micro-channels (16). Similarly, water exit slots (24) extend upward from water exit manifolds (26) into the micro-channels (16). Water (28) is delivered from pump (30) of an external recirculator/chiller (32) to the supply manifold (20) and into the many micro-channels (16) that pass under the wafer (12) under test. The water (28) leaves the micro-channels (16), enters the exit slots (24) and then the exit manifolds (26), from which it is returned to the recirculator/chiller (32). Reservoir or tank (34) of the recirculator/chiller (32) is connected to a regulated vacuum source (36). By applying a vacuum, the pressure in the cooling loop is lowered below atmospheric, and the wafer (12) under test is held against surface (38) of the chuck (10).
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Citations
9 Claims
- 1. A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of cooling fins, a liquid coolant circulation system including at least one liquid coolant supply manifold positioned in said body to supply liquid coolant to said plurality of micro-channels and at least one liquid coolant exit manifold positioned in said body to remove liquid coolant from said plurality of micro-channels, and a source of a vacuum connected to said liquid coolant circulation system.
- 7. A method for cooling a planar electronic substrate, which comprises positioning the planar electronic substrate on a cooling chuck having a body and a planar upper surface with a plurality of micro-channels extending from the planar upper surface into the body, circulating liquid coolant in the micro-channels, and applying a vacuum to the liquid coolant in the micro-channels to apply force for holding the planar electronic substrate on the cooling chuck.
Specification