Printed circuit-board and fabric therefor

• US 5,206,078 A
• Filed: 12/14/1989
• Issued: 04/27/1993
• Est. Priority Date: 12/15/1988
• Status: Expired due to Term

• Current Assignee: Nitto Boseki Company Limited
• Original Assignee: Nitto Boseki Company Limited
• Inventors: Kato, Keiichi, Watanabe, Shoichi, Kasai, Shin, Fujii, Mikiya, Inoguchi, Hirokazu
• Primary Examiner(s): Bell, James J.
• Application Number:
  US07/450,864
• Time in Patent Office: 1,230 Days
• Field of Search: 428/228, 428/268, 428/273, 428/417, 428/225, 428/257, 428/901, 428/288, 428/258, 428/259, 139/420 R, 139/420 C, 139/420 A
• US Class Current: 442/187
• CPC Class Codes: D03D 1/0082 Fabrics for printed circuit boards
• CPC Class Codes: D03D 15/267 Glass
• CPC Class Codes: D03D 15/283 synthetic polymer-based, e.g. polyamide or polyester fibres cellulose-based artificial fibres D03D15/225
• CPC Class Codes: D03D 15/573 Tensile strength
• CPC Class Codes: D10B 2331/061 polyetherketones, polyetheretherketones, e.g. PEEK
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0145 Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 442/3049 Including strand precoated with other than free metal or alloy
• CPC Class Codes: Y10T 442/3252 Including synthetic polymeric strand material

Abstract

A fabric for a printed circuit-board characterized by that it is composed of one or more fiber(s) selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber, and glass fiber, and a printed circuit-board employing the fabric as its base material.

Claims

1. A fabric for a printed circuit-board which comprises a joint weave of glass fiber and at least one fiber selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber.

2. A fabric for a printed circuit-board according to claim 1, wherein the glass fiber is any one of E-glass fiber, S-glass fiber and D-glass fiber.

3. A fabric for a printed circuit-board according to claim 1, wherein for the glass fiber is treated with a sizing agent prepared by mixing essential components and other lubricating components, of which the essential components consist of a film-forming agent which is composed of at least one resin selected from the group consisting of epoxy resin, amine-modified epoxy resin, ethylene oxide-modified epoxy resin, urethane resin and urethane-modified polyester resin and a mixture thereof, silane coupling agent and cationic surfactant.

4. A fabric as in claim 1, wherein said weave has a theoretical dielectric constant of approximately 3.5 or lower.