Ultraminiature single-crystal sensor with movable member

• US 5,207,103 A
• Filed: 05/18/1992
• Issued: 05/04/1993
• Est. Priority Date: 06/01/1987
• Status: Expired due to Term

• Current Assignee: Hin-Leung Chau, Wise, Kensall D.
• Original Assignee: Hin-Leung Chau, Wise, Kensall D.
• Inventors: Chau, Hin-Leung, Wise, Kensall D.
• Primary Examiner(s): WOODIEL, DONALD
• Application Number:
  US07/885,316
• Time in Patent Office: 351 Days
• Field of Search: 73/718, 73/724, 128/675, 128/758, 29/25.41, 29/25.42, 29/25.35, 361/283, 156/628
• US Class Current: 73/724
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 5/02158 provided with two or more sensor elements
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: Y10T 29/43 Electric condenser making

Abstract

A capacitive pressure sensor suitable for making highly sensitive, low pressure measurements is disclosed. The sensor may be mounted into a 0.5 mm OD catheter suitable for multipoint pressure measurements from within the coronary artery of the heart. The sensor employs a transducer which consists of a rectangular bulk silicon microdiaphragm several hundred microns on a side by two microns thick, surrounded by a supporting bulk silicon rim about 12 microns thick. Both the diaphragm and the rim are defined by a double diffusion etch-stop technique. The transducer fabrication process features a batch wafer-to-glass electrostatic seal followed by a silicon etch, which eliminates handling of individual small diaphragm structures until die separation and final packaging. An addressable read-out interface circuit may be used with the sensor to provide a high-level output signal, and allows the sensor to be compatible for use on a multisite catheter having only two electrical leads.

Claims

1. A solid-state, capacitive transducer having at least one movable member responsive to a physical force applied thereto, the transducer comprising:

an integrally formed structure made from single-crystal silicon semiconductor material and having a movable member which is movable in response to a physical force applied thereto, and a rim portion that extends at least around a part of the periphery of and mechanically supports the movable member, the movable member and the rim portion each being heavily impregnated with at least a first material which alters an etching characteristic thereof in comparison to single-crystal material which is identical to the heavily impregnated material of the movable member and rim portion except for containing substantially less of such first material; and

a capacitor having first and second electrically conductive plates, the first plate being arranged to move with the movable member, thereby allowing the capacitance of the capacitor to be adjusted in response to the physical force applied to the movable member.

2. A transducer as in claim 1, wherein:

the transducer is a pressure transducer, and physical force is applied by fluid pressure;

the movable member constitutes a diaphragm; and

the rim portion extends around substantially the entire periphery of the movable member, and both the movable member and rim portion are electrically conductive.

3. A transducer as in claim 1, wherein the first material is an impurity dopant selected from the group of dopants including n-type materials and p-type materials.

4. A transducer as in claim 1, in which the transducer is part of a force-responsive sensor, further comprising:

a second structure which is substantially rigid and has an insulating surface bonded to at least part of the rim portion of the integrally formed structure, the second structure including a thin electrically conductive pad located on the insulating surface and having a part thereof bonded to at least part of the rim portion, the conductive pad normally being spaced apart from the movable member and forming the second plate of the capacitor of the transducer; and

wherein

the movable member includes as a part thereof electrically conductive material such that the movable member itself forms the first plate of the capacitor, and whereby the first plate is adjustable relative to the stationary second plate by the physical force applied to the movable member.

5. A transducer as in claim 1, further comprising:

a thin composite dielectric layer formed on one side of the movable member; and

an insulating support substrate having an electrically conductive pad formed on a first side thereof, which constitutes the second plate; and

wherein

the rim portion of the integrally formed structure is bonded to the first side of the support substrate in an area adjacent to at least a portion of the perimeter of the second plate.

6. A transducer as in claim 5, wherein the composite dielectric layer is on the side of the movable member facing the second plate, and is formed of at least first and second sublayers, the first sublayer including a thermally grown silicon oxide and the second sublayer including a deposited silicon nitride.

7. A transducer as in claim 1, wherein the movable member of the integrally formed structure has an average thickness which is at least a few times thinner than the average thickness of the rim portion.

8. A transducer as in claim 1, further comprising:

a glass substrate bonded to a generally flat surface of the rim portion, and wherein the movable member is generally parallel to and spaced closely to but remains spaced apart from the glass substrate at least when no external force is applied to the movable member.

9. A miniature transducer, comprising:

an adjustable capacitor including first and second electrically conductive members arranged in predetermined normal, physical relation to one another, with the first conductive member being a generally flat member, and the second conductive member being movable relative to the first conductive member; and

an integrally formed structure made from single-crystal silicon semiconductor material, the structure having a flexible member and a support portion that extends at least around at least a part of the periphery of the flexible member, and mechanically supports the flexible member in a nominal position a predetermined distance from the first electrically conductive member,

the flexible member and support portion being electrically conductive and heavily impregnated with at least a first material which alters an etching characteristic thereof in comparison to single-crystal material which is identical to the heavily impregnated material of the flexible member and the support portion except for containing substantially less of such first material;

the flexible member constituting the second electrically conductive member of the capacitor, and being sufficiently thin in at least one selected region thereof relative to its overall size to allow the flexible member to move in response to a force applied thereto in a range designed to be measured by said transducer, whereby the movement of the movable member changes the capacitance of the capacitor.

10. A transducer as in claim 9, wherein:

the flexible member and support portion are formed from a single wafer of single-crystal material; and

the nominal thickness of the support portion is at least three times smaller than the nominal thickness of the wafer from which it is made.

11. A transducer as in claim 9 wherein the nominal width of the support portion is no more than about 80 microns, and the nominal thickness of the support portion is no more than about 12 microns.

12. A transducer as in claim 9, wherein in the nominal thickness of the single-crystal material of the flexible member in at least one area thereof is no more than about two microns.

13. A transducer as in claim 9, wherein:

the second electrically conductive member is a generally flat member arranged generally parallel to the first electrically conductive member; and

the first and second electrically conductive members assume a nominal predetermined distance from one another, when no external force is applied to them, of less than about five microns.

14. A transducer as in claim 9, further comprising:

a support substrate having at least one substantially flat surface on a first side thereof, with the first electrically conductive member being formed on the first side of the substrate; and

a conductive trace formed on the first side of the substrate adjacent to and electrically isolated from the first conductive member, and wherein

the support portion is in electrical contact with the conductive trace.

15. A transducer as in claim 9, wherein:

the flexible member constitutes a diaphragm generally arranged as a plate substantially parallel to the first conductive member;

the transducer is a pressure transducer; and

the force to which the transducer responds to is provided in the form of changing pressure.

16. A miniature force-sensing device having a capacitance which is adjusted by changes in a force to be sensed, comprising:

a support substrate; and

an integrally formed structure made at least primarily of single-crystal silicon material, the structure including (1) a first selected portion constituting a substantially rigid support structure bonded to the support substrate, the first selected portion being impregnated with a first material in a desired first concentration sufficient to alter an etching characteristic of the first selected portion relative to identical single-crystal silicon material containing substantially less of the first material, and (2) a second selected portion constituting a movable member supported by and capable of movement relative to the support structure, the second selected portion being impregnated with a second material in a desired second concentration sufficient to alter an etching characteristic of the second portion relative to identical single-crystal silicon material containing substantially less of the second material; and

a force-sensitive adjustable capacitor having first and second electrically conductive plates normally spaced apart from one another, the first electrically conductive member including a generally flat conductive plate supported by the support substrate, and the second electrically conductive plate being at least in part supported by and movable with the movable member, whereby the capacitance of the capacitor is adjustable in response to movement of the movable member by a force applied thereto.

17. A force-sensing device as in claim 16, wherein the first and second materials are selected from the group of dopants including p-type dopants and n-type dopants.

18. A force-sensing device as in claim 16, wherein:

the integrally formed single-crystal structure is made from a silicon wafer having a first surface;

the first material is at least a first impurity dopant, diffused in at least the desired first concentration, throughout the first selected portion; and

the second material is at least a second impurity dopant, diffused in at least the desired second concentration to a predetermined second distance beneath the first surface, which second distance corresponds to the overall thickness of the second selected portion.

19. A force-sensing device as in claim 18, wherein:

the first and second impurity dopants are the same;

a desired geometry of the first selected portion is specified during manufacture of the integrally formed structure in part by a masked shallow-diffusion step;

a desired geometry of the second selected portion is specified during manufacture of the integrally formed structure in part by a masked deep-diffusion step.

20. A force-sensing device as in claim 18, wherein:

the overall thickness of the second selected portion is at least a few times thicker than the average thickness of the first selected portion;

the first selected portion includes a diaphragm; and

the second selected portion includes a rim portion; and

the force to be sensed is mechanically applied by fluid pressure.