Memory card with flexible conductor between substrate and metal cover

• US 5,208,732 A
• Filed: 05/29/1991
• Issued: 05/04/1993
• Est. Priority Date: 05/29/1991
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Wallace, James, Baudouin, Daniel, Carpenter, Alton
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/707,353
• Time in Patent Office: 706 Days
• Field of Search: 174/51, 174/252, 174/260, 357/81, 165/80.3, 165/185, 235/441, 235/492, 361/382, 361/383, 361/386, 361/389, 361/392, 361/395, 361/396, 361/399, 361/424, 361/387, 361/388
• US Class Current: 361/704
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G11C 5/00 Details of stores covered by group G11C11/00
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms

Abstract

A memory card has a housing including an interior chamber and a top metal cover. A substrate is located in the interior chamber and carries printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads. The packaged semiconductor devices are spaced from the top metal cover and a thermal coupler is located between the top metal cover and the packaged semiconductor devices for coupling heat generated by the packaged semiconductor devices to the top metal cover.

Claims

1. A memory card, comprising:

a housing including an interior chamber and a top metal cover;

a substrate in said chamber, said substrate carrying printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads, said packaged semiconductor devices being spaced from said top metal cover, said substrate including a plated through hole connected to circuit ground and a flexible conductor soldered in said plated through hole and extending through said housing to contact said top metal cover; and

a thermal coupler between said top metal cover and said packaged semiconductor devices for coupling heat generated by said packaged semiconductor devices to said top metal cover.

2. The memory card of claim 1 in which said thermal coupler comprises a thermally conductive glue.

3. The memory card of claim 2 in which said thermally conductive glue is a silicone rubber adhesive.

4. The memory card of claim 1 in which said housing includes a shell having a top part, said top part having a plurality of first apertures, said packaged semiconductor devices extending into said first apertures, said top metal cover attached to said top part to cover said first apertures.

5. The memory card of claim 4 in which said shell has a bottom part having a plurality of second apertures, said top and bottom parts joined at their margins.

6. The memory card of claim 5 in which said housing includes a bottom metal cover attached to said bottom part to cover said second apertures.

7. The memory card of claim 5 in which said top part includes a plurality of ribs which contact said substrate, said substrate carrying electrical components which extend into recessed areas located between said ribs.