Semiconductor chip cooling apparatus

• US 5,210,440 A
• Filed: 06/03/1991
• Issued: 05/11/1993
• Est. Priority Date: 06/03/1991
• Status: Expired due to Fees

• Current Assignee: VLSI Technology, Inc. (Koninklijke Philips N.V.)
• Original Assignee: VLSI Technology, Inc. (Koninklijke Philips N.V.)
• Inventors: Long, Jon M.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US07/710,740
• Time in Patent Office: 708 Days
• Field of Search: 357/81, 357/82, 357/74, 357/70, 357/80, 361/388, 361/385, 361/382, 361/389
• US Class Current: 257/675
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A novel semiconductor chip cooling apparatus includes at least one semiconductor die packaged according to a TAB design. A support structure supports the die, and a dike is connected to the support structure and the TAB tape to form a cavity impervious to liquid and air. Input and output means are connected to the cavity. Fluid means circulate throughout the cavity and utilize the input and output means to directly cool the die during operation of the semiconductor die. Heat spreading means may be positioned below the die to increase the amount of surface area which contacts the fluid means, thereby cooling the die more efficiently.

Claims

1. An integrated-circuit cooling apparatus, said apparatus comprising:

a semiconductor die having bond pads fabricated thereon, said semiconductor die being connected to a tape having leads fabricated thereon, said tape being positioned next to said semiconductor die to permit electrical connections between said leads and said bond pads on said semiconductor die;

a support structure having a surface for supporting said semiconductor die;

a dike connected to said surface and said tape, said dike forming a cavity with said tape, said surface, and a portion of said semiconductor die;

input means and output means connected to said cavity; and

means for cooling said semiconductor die, said cooling means including a cooling fluid and means for circulating said cooling fluid throughout said cavity and utilizing said input means and said output means to reduce the temperature of said semiconductor die and said support structure during operation of said semiconductor die by causing said cooling fluid to directly contact said portion of said semiconductor die, at least a portion of said leads on said tape, and at least a portion of said surface for supporting said semiconductor die.

2. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said input means and said output means are respectively an input port and an output port.

3. The integrated-circuit cooling apparatus as claimed in claim 2 wherein said input port and said output port are fabricated through said surface, said ports being in communication with said cavity.

4. The integrated-circuit cooling apparatus as claimed in claim 1 and further including heat spreading means for distributing heat emitted from said die, said heat spreading means being connected to said semiconductor die to permit heat transfer between said heat spreading means and said die.

5. The integrated-circuit cooling apparatus as claimed in claim 4 wherein said heat spreading means is composed of a heat conducting material.

6. The integrated-circuit cooling apparatus as claimed in claim 4 wherein said heat spreading means further comprises a plate having a surface area which is larger than the surface area of said semiconductor die.

7. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said support structure comprises a printed circuit board.

8. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said cooling fluid includes water.

9. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said dike is composed of a heat insulating material.

10. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said dike is connected to said tape by means of a flexible thermoplastic glue.

11. The integrated-circuit cooling apparatus as claimed in claim 7 wherein said printed circuit board comprises a flexible printed circuit board.

12. The integrated-circuit cooling apparatus as claimed in claim 1, said apparatus further comprising a plurality of semiconductor dies supported by said surface and connected to said tape, such that said dike forms a cavity with said tape, said surface, and portions of said plurality of semiconductor dies to permit cooling of said plurality of semiconductor dies.

13. The integrated-circuit cooling apparatus as claimed in claim 1 wherein said cooling fluid includes freon and other fluoroinerts.

14. The integrated circuit cooling apparatus as recited in claim 1, said tape having an opening adjacent to said semiconductor die, further comprising an encapsulant placed over said opening such that said encapsulant covers and seals said opening.

15. The integrated circuit cooling apparatus as recited in claim 2 wherein said input port is fabricated through said dike, said input port being in communication with said cavity.

16. The integrated circuit cooling apparatus as recited in claim 2 wherein said output port is fabricated through said dike, said output port being in communication with said cavity.