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Semiconductor chip cooling apparatus

  • US 5,210,440 A
  • Filed: 06/03/1991
  • Issued: 05/11/1993
  • Est. Priority Date: 06/03/1991
  • Status: Expired due to Fees
First Claim
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1. An integrated-circuit cooling apparatus, said apparatus comprising:

  • a semiconductor die having bond pads fabricated thereon, said semiconductor die being connected to a tape having leads fabricated thereon, said tape being positioned next to said semiconductor die to permit electrical connections between said leads and said bond pads on said semiconductor die;

    a support structure having a surface for supporting said semiconductor die;

    a dike connected to said surface and said tape, said dike forming a cavity with said tape, said surface, and a portion of said semiconductor die;

    input means and output means connected to said cavity; and

    means for cooling said semiconductor die, said cooling means including a cooling fluid and means for circulating said cooling fluid throughout said cavity and utilizing said input means and said output means to reduce the temperature of said semiconductor die and said support structure during operation of said semiconductor die by causing said cooling fluid to directly contact said portion of said semiconductor die, at least a portion of said leads on said tape, and at least a portion of said surface for supporting said semiconductor die.

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