Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems

• US 5,212,261 A
• Filed: 12/17/1990
• Issued: 05/18/1993
• Est. Priority Date: 12/17/1990
• Status: Expired due to Fees

• Current Assignee: Henkel KGaA (Henkel AG & Co KGaA)
• Original Assignee: Henkel Research Corp (BASF SE)
• Inventors: Stierman, Thomas J.
• Primary Examiner(s): Bleutge, John C.
• Assistant Examiner(s): KRASS, FREDERICK F
• Application Number:
  US07/628,794
• Time in Patent Office: 883 Days
• Field of Search: 528/92, 528/361, 528/409, 528/413, 528/322, 528/95, 528/90, 528/111, 528/117, 525/506, 525/507, 525/508, 525/524, 525/525, 525/526
• US Class Current: 525/506
• CPC Class Codes: C08G 59/44 Amides
• CPC Class Codes: C08G 59/62 Alcohols or phenols
• CPC Class Codes: C08G 59/64 Amino alcohols
• CPC Class Codes: C08G 59/685 Carboxylates

Abstract

Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T_g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Claims

1. A heat-curable epoxy resin composition free of cure-effective amounts of an amine, carboxylic anhydride, or carboxylic acid in the acid form, comprising:

(a) at least one polyepoxide;

(b) from about 0.1 to about 50 parts of a metal carboxylate salt curing agent per hundred parts by weight of total epoxy resin, said metal carboxylate salt being selected from a Group IA or Group IIA metal and being derived from a carboxylic acid containing from 1 to 4 carboxyl groups, wherein said metal carboxylate salt is substantially soluble in said epoxy resin composition at a cure temperature of above about 100°

C.; and

(c) from about 1 to about 100 parts of a cure modifier per hundred parts by weight of total epoxy resin, said cure modifier containing polar functionality, being soluble in said epoxy resin composition at said cure temperature and having sufficient solvating strength as to increase the solubility of said metal carboxylate salt in said epoxy resin to curing effective levels at said cure temperature.

2. A composition as in claim 1 wherein the corresponding carboxylic acid of said metal carboxylate salt has a pKa value of above about 3.

3. A composition as in claim 1 wherein said polyepoxide is a polyglycidyl compound.

4. A composition as in claim 3 wherein said polyepoxide is selected from a polyglycidyl derivative of a polyhydric phenol, polyhydric alcohol, polyhydric aromatic amine, polyhydric aminophenol, or polyhydric carboxylic acid.

5. A composition as in claim 4 wherein said polyepoxide comprises a glycidyl ether of a brominated polyhydric phenol.

6. A composition as in claim 1 wherein said polyepoxide is selected from liquid or solid bisphenol A based epoxy resins, epoxy phenol novolac or epoxy cresol novolac resins, triglycidyl-p-aminophenol, triglycidylisocyanurate, tetraglycidyl-methylenedianiline, tetraglycidyl-tetrakis-(4-hydroxyphenyl)ethane, or diglycidyl-hexahydrophthalic acid.

7. A composition as in claim 1 wherein said metal carboxylate salt is a carboxylate salt of a metal selected from lithium, sodium, or potassium.

8. A composition as in claim 1 wherein said metal carboxylate salt is a carboxylate salt of calcium.

9. A composition as in claim 1 wherein said metal carboxylate salt is derived from a carboxylic acid containing 1 carboxyl group.

10. A composition as in claim 1 wherein said metal carboxylate salt is present in an amount of from about to about 10 parts per hundred parts by weight of total epoxy resin.

11. A composition as in claim 1 wherein said metal carboxylate salt is selected from lithium benzoate, sodium benzoate, potassium benzoate, calcium benzoate, sodium oleate, sodium 4-hydroxybutyrate, sodium formate, sodium acetate, sodium m-nitrobenzoate, sodium p-chlorobenzoate, sodium p-hydroxybenzoate, sodium salicylate, sodium p-methoxybenzoate or disodium t-butylisophthalate.

12. A composition as in claim 1 wherein said cure modifier is sufficiently polar as to increase the polarity of said epoxy resin composition at said cure temperature.

13. A composition as in claim 1 wherein said metal carboxylate salt is substantially insoluble in said epoxy resin composition at room temperature, and is substantially soluble therein at a curing temperature of from about 100°

C. to about 250°

C.

14. A composition as in claim 1 wherein said cure modifier is present in an amount of from about 1 to about 50 parts per hundred parts by weight of total epoxy resin.

16. A composition as in claim 1 wherein said cure modifier contains functionality selected from a lactone, ether, sulfone, sulfoxide, cyanate ester, quaternary ammonium or phosphonium compound.

17. A composition as in claim 1 wherein said cure modifier contains functionality selected from an alcohol, amide, imide, oxime, phenol, or sulfonamide.

18. A composition as in claim 16, wherein said lactone is selected from γ

-butyrolactone or ε

-caprolactone.

19. A composition as in claim 16, wherein said ether is selected from 18-crown-6 ether, dibenzo-18-crown-6 ether, tetraethylene glycol dimethyl ether, and polyethylene glycol ether.

20. A composition as in claim 16 wherein said sulfone is selected from dimethyl sulfone, tetramethylene sulfone, and bis-(phenylsulfonyl) methane.

21. A composition as in claim 16 wherein said sulfoxide comprises dimethyl sulfoxide.

22. A composition as in claim 16 wherein said quaternary compound is selected from (2-hydroxyethyl) trimethylammonium chloride, dimethyldistearylammonium chloride, and tetrabutylphosphonium bromide.

23. A composition as in claim 17 wherein said alcohol is selected from a benzyl, pr and secondary alcohol.

24. A composition as in claim 23 wherein said alcohol contains from 1 to 2 alcohol groups.

25. A composition as in claim 23 wherein said alcohol is selected from benzyl alcohol, 1-decanol, 2-decanol, ethylene glycol, propylene glycol, 1,4-benzenedimethanol, 1,6-hexanediol, 2,2-dimethyl-1, 3-propanediol, 2,5-hexanediol, 1,4-cyclohexanediol, polyvinyl alcohol, and phenoxy resins.

26. A composition as in claim 17 wherein said amide is selected from benzamide, N-butylbenzamide, or N-methyl-N-butylbenzamide.

27. A composition as in claim 17 wherein said imide is selected from succinimide, phthalimide, tetrahydrophthalimide, oxy-diphthalimide, or hexafluoroisopropylidene-diphthalimide.

28. A composition as in claim 17 wherein said oxime is selected from 5-dodecylsalicylaldoxime or 5-nonyl-2-hydroxyacetophenoxime.

29. A composition as in claim 17 wherein said phenol is selected from catechol, 4-t-butylphenol, 4-nitrophenol, bisphenol A, bisphenol S, 1,5-dihydroxyanthraquinone, resole resins, or novolac resins.

30. A composition as in claim 17 wherein said sulfonamide is selected from benzenesulfonamide or p-toluenesulfonamide.

31. A composition as in claim 17 wherein said cure modifier is an amide-alcohol containing amide and alcohol functionality.

32. A composition as in claim 31 wherein said amide-alcohol has the structural formula

33. A composition as in claim 32 wherein said amide-alcohol is selected from one wherein in said structural formula R₂ is the group --CR₃ R₄ --CR₅ R₆ --, and R₃, R₄, R₅ and R₆ may be the same or different, and may represent hydrogen, alkyl, or hydroxyalkyl groups.

34. A composition as in claim 32 wherein said amide-alcohol is selected from one wherein in said structural formula R₂ is selected from --CH₂ CH₂ --, --C(CH₃)₂ CH₂ --, --C(CH₂ CH₃)(CH₂ OH)CH₂ --, --C(CH₂ OH)₂ CH₂ --, --CH(CH₂ CH₃)CH₂ --, --CH₂ CH(CH₃)--, --CH₂ CH(CH₂ CH₃)--, --CH₂ CH₂ CH₂ --, --CH₂ CH₂ CH₂ CH₂ --.

35. A composition as in claim 32 wherein said amide-alcohol is selected from one wherein said structural formula

R₁ =1,2-substituted-benzene, R₂ =--CH₂ CH₂ --, m=1, and n=2;

R₁ =1,2-substituted-benzene, R₂ =--C(CH₃)₂ CH₂ --, m=1, and n=2;

R₁ =1,3-Substituted-benzene, R₂ =--CH₂ CH₂ --, m=1, and n=2;

R₁ =1,3-substituted-benzene, R₂ =--C(CH₃)₂ CH₂ --, m=1, and n=2;

R₁ =1,4-substituted-benzene, R₂ =--CH₂ CH₂ --, m=1, and n=2;

R₁ =1,4-substituted-benzene, R₂ =--C(CH₃)₂ CH₂ --, m=1, and n=2;

R₁ =phenyl, R₂ =--CH₂ CH₂ --, m=1, and n=1;

R₁ =phenyl, R₂ =--C(CH₃)₂ CH₂ --, m=1, and n=1;

R₁ =--CH₂ CH₂ CH₂ CH₂ --, R₂ =--CH₂ CH₂ --, m=0, and n=2;

R₁ =1,3-substituted-benzene, R₂ =--CH₂ CH₂ --, m=0, and n=1;

or

R₁ =phenyl, R₂ =--CH₂ CH₂ --, m=0, and n=1.

37. A composition as in claim 31 wherein said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

38. A composition as in claim 33 wherein said amide-alcohol is present in an amount of from about 1 to about 50 parts per hundred parts by weight of total epoxy resin, said metal carboxylate salt is selected from sodium benzoate, sodium acetate or calcium benzoate present in an amount of from about 1 to about 10 parts per hundred parts by weight of total epoxy resin, and said epoxy resin is selected from bisphenol A based epoxy resins or their brominated derivatives, epoxy novolacs, triglycidyl p-aminophenol, or tetraglycidyl methylenedianiline.

39. A composition as in claim 35 wherein said amide-alcohol is present in an amount of from about 1 to about 20 parts per hundred parts by weight of total epoxy resin, said metal carboxylate salt is selected from sodium benzoate, sodium acetate or calcium benzoate present in an amount of from about 2 to about 8 parts per hundred parts by weight of total epoxy resin, and said epoxy resin is selected from bisphenol A based epoxy resins or their brominated derivatives.

40. A composition as in claim 17 wherein said cure modifier contains phenolic functionality, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

41. A composition as in claim 29 wherein said cure modifier is present in an amount of from about 1 to about 50 parts per hundred parts by weight of total epoxy resin, said metal carboxylate salt is selected from sodium benzoate, sodium acetate, or calcium benzoate and is present in an amount of from about 1 to about 10 parts per hundred parts by weight of total epoxy resin, and said epoxy resin is selected from bisphenol A based epoxy resins or their brominated derivatives, epoxy novolacs, triglycidyl p-aminophenol, or tetraglycidyl methylenedianiline.

42. A composition as in claim 17 wherein said cure modifier contains imide functionality, said metal carboxylate salt is selected from a Grou pIA alkali metal salt or clacium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

43. A composition as in claim 27 wherein said cure modifier is present in an amount of from about 1 to about 50 parts per hundred parts by weight of total epoxy resin, said metal carboxylate salt comprises sodium benzoate, sodium acetate, or calcium benzoate present in an amount of from about 1 to about 10 parts per hundred parts by weight of total epoxy resin, and said epoxy resin is selected from bisphenol A based epoxy resins or their brominated derivatives, epoxy novolacs, triglycidyl p-aminophenol, or tetraglycidyl methylenedianiline.

44. A composition as in claim 17 wherein said alcohol is monofunctional or difunctional and is selected from a benzyl, primary, or secondary alcohol, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

45. A composition as in claim 17 wherein said cure modifier is selected from an amide or a sulfonamide, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

46. A composition as in claim 16 wherein said cure modifier is selected from a quaternary ammonium or a phosphonium compound, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

47. A composition as in claim 16 wherein said cure modifier contains ether functionality, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

48. A composition as in claim 16 wherein said cure modifier contains cyanate ester functionality, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

49. A composition as in claim 16 wherein said cure modifier is selected from a sulfone or a sulfoxide, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

50. A composition as in claim 16 wherein said cure modifier contains lactone functionality, said metal carboxylate salt is selected from a Group IA alkali metal salt or calcium salt and is derived from a carboxylic acid containing 1 carboxyl group, and said epoxy resin comprises a glycidyl resin.

15. A composition as in claim said cure modifier is present in an amount of from about 1 to about 20 parts per hundred parts by weight of total epoxy resin.

36. A composition as in claim 53 wherein said cyanate ester is selected from the poly-cyanate esters of bisphenol A, tetramethylbisphenol F, thiodiphenol, hexafluorobisphenol A, bisphenol E, dicyclopentadienephenol condensates or their partially trimerized blends.

51. A process for curing a heat-curable epoxy resin composition that is free of cure-effective amounts of an amine, carboxylic anhydride, or carboxylic acid in the acid form, comprising mixing together

(a) at least one polyepoxide;

(b) from about 0.1 to about 50 parts of a metal carboxylate salt curing agent per hundred parts by weight of total epoxy resin, said metal carboxylate salt being selected from a Group IA or Group IIA metal and being derived from a carboxylic acid containing from 1 to 4 carboxyl groups, wherein said metal carboxylate salt is substantially soluble in said epoxy resin composition at the cure temperature of said composition; and

(c) from about 1 to about 100 parts of a cure modifier per hundred parts by weight of total epoxy resin, said cure modifier containing polar functionality, being soluble in said epoxy resin composition at said cure temperature and having sufficient solvating strength as to increase the solubility of said metal carboxylate salt in said epoxy resin to curing effective levels at said cure temperature; and

heating said composition to a curing temperature of at least about 100°

C.