Lead inspection method using a plane of light for producing reflected lead images
First Claim
Patent Images
1. A lead inspection method comprising:
- providing a semiconductor package having a plurality of leads along at least one side of the package;
illuminating a portion of each lead with a plane of light wherein an incidence angle is formed between the plane of light and each lead, the plane of light producing a reflected lead image for the portion of each lead;
simultaneously detecting each reflected lead image;
determining a position for each reflected lead image;
determining an amount of variation between a position of each reflected lead image and a predetermined image position by using a vision system having a solid state camera; and
using the amount of variation and the incidence angle for determining a distance each lead is displaced from a predetermined coplanar position.
7 Assignments
0 Petitions
Accused Products
Abstract
Light (19) is projected at an incidence angle (29) onto a plurality of leads (12, 13). The light (19) is simultaneously reflected from each of the plurality of leads (12, 13). The light that is simultaneously reflected (24, 26) from each lead (12, 13) is detected. A cotangent function of the incidence angle (29) is utilized to detect an amount of displacement (32) of at least one of the plurality of leads.
-
Citations
13 Claims
-
1. A lead inspection method comprising:
-
providing a semiconductor package having a plurality of leads along at least one side of the package; illuminating a portion of each lead with a plane of light wherein an incidence angle is formed between the plane of light and each lead, the plane of light producing a reflected lead image for the portion of each lead; simultaneously detecting each reflected lead image; determining a position for each reflected lead image; determining an amount of variation between a position of each reflected lead image and a predetermined image position by using a vision system having a solid state camera; and using the amount of variation and the incidence angle for determining a distance each lead is displaced from a predetermined coplanar position. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method of inspecting leads of a semiconductor package comprising;
-
providing a semiconductor package having a plurality of leads; projecting a plane of light onto the plurality of leads thereby producing a reflected lead image of each lead of the plurality of leads wherein an incidence angle is formed between the plane of light and the plurality of leads; simultaneously detecting a position of the reflected lead image of each lead; determining an amount of variation between each lead reflected image and a predetermined reflected position; and determining a distance each lead is displaced by using the amount of variation and the incidence angle. - View Dependent Claims (7, 8, 9)
-
-
10. A lead inspection method comprising:
-
projecting light onto a plurality of leads wherein the light forms an incidence angle; detecting reflected light that is simultaneously reflected from the plurality of leads; calculating a distance of displacement for at least one lead of the plurality of leads by using a cotangent of the incidence angle. - View Dependent Claims (11, 12, 13)
-
Specification