On chip noise tolerant temperature sensing circuit

• US 5,213,416 A
• Filed: 12/13/1991
• Issued: 05/25/1993
• Est. Priority Date: 12/13/1991
• Status: Expired due to Fees

• Current Assignee: Unisys Corporation
• Original Assignee: Unisys Corporation
• Inventors: Neely, Andrew, Fussell, Richard L.
• Primary Examiner(s): Cuchlinski, Jr., William A.
• Assistant Examiner(s): BENNETT, GEORGE B
• Application Number:
  US07/806,514
• Time in Patent Office: 529 Days
• Field of Search: 374/172, 374/173, 374/175, 374/178, 307/310, 307/315
• US Class Current: 374/178
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence

Abstract

A novel on-chip temperature sensing circuit includes a differential voltage source which comprises a plurality of branches each of which is provided with temperature sensitive transistor means. The differential output from the differential voltage source is coupled to the inputs of a high gain differential amplifier and the outputs from the high gain differential amplifier are connected to a second stage differential amplifer and one of the branches of the second stage differential amplifier is coupled to a high gain transistor amplifier which is connected to an output pin on the semiconductor chip so that the signal at the output pin is a noise tolerant voltage indication of the temperature of said semiconductor chip which may be monitored during actual online operations. A hysteresis feedback may be coupled between one of the outputs of the differential amplifiers to provide a hysteresis feedback loop and rapid switching of the second differential amplifier.

Claims

1. An on-chip temperature sensing circuit for semiconductor devices, comprising:

a differential voltage source (DVS) having first and second branches,

each of said branches having thermal sensitive transistor means therein connected in series with a current source,

said thermal sensitive transistor means in said first and second branches comprising a base-collector transistor in said first branch of said DVS and a base-emitter transistor in said second branch of said DVS having different voltage output rates of change with temperature at their branch output nodes,

amplifier means coupled to the output nodes of said first and second branches of said DVS,

means for generating an on-chip voltage signal at an output electrode of said chip which is tolerant to switching noise and provides a voltage signal indicative of the temperature of said chip.

4. An on-chip temperature sensing circuit as set forth in claim 1

wherein the voltage rate of change with temperature of said base-collector transistor is greater than the voltage rate of change with temperature across the base-emitter transistor.

5. An on-chip temperature sensing circuit as set forth in claim 4 wherein said thermal sensitive transistor means comprises a parallel stack of transistors in at least one branch of DVS in series with one of said thermal sensitive transistors.

10. An on-chip temperature sensing circuit as set forth in claim 1 which further includes feedback coupling means connected between one output branch of said amplifier means and the voltage supply to said branches of said DVS for generating a hysteresis switching output from said amplifier means.

2. An on-chip temperature sensing circuit for semiconductor devices, comprising:

a differential voltage source (DVS) having first and second branches,

each of said branches having thermal sensitive transistor means therein connected in series with a current source,

said thermal sensitive transistor means in said first and second branches having different voltage output rates of change with temperature at their branch output nodes,

amplifier means coupled to the output nodes of said first and second branches of said DVS,

said amplifier means comprises a first and a second differential amplifier connected in series,

each said differential amplifier having a first and a second output branch coupled in series with a current source,

said second differential amplifier having one of its output branches coupled to provide a high gain output,

means for generating an on-chip voltage signal at an output electrode of said chip which is tolerant to switching noise and provides a voltage signal indicative of the temperature of said chip.

3. An on-chip temperature sensing circuit as set forth in claim 2 wherein said first differential amplifier comprises a Darlington pair differential amplifier.

6. An on-chip temperature sensing circuit as set forth in claim 2 wherein said thermal sensitive transistor means comprises series connected stacks of transistors in said branches of said DVS.

7. An on-chip temperature sensing circuit as set forth in claim 2 which further includes feedback coupling means connected between one output branch of one said differential amplifier and the base of the transistor amplifier in a branch of the other differential amplifier for generating a hysteresis switching output from said amplifier means.

8. An on-chip temperature sensing circuit as set forth in claim 7 wherein said amplifier means comprises a differential amplifier having at least one pair of output branches coupled to the output of said first and second branches of said DVS.

9. An on-chip temperature sensing circuit as set forth in claim 8 in which further includes feedback coupling means connected between one output branch of said differential amplifier means and the branches of said DVS,

said feedback coupling means being connected directly to the base of the transistor in the top of one of the series stacks of transistors in a branch of said DVS, and

said feedback coupling means being connected through a low value resistor to the collectors of the transistors in the top of the series stacks of transistors in the branches of said DVS.

11. An on-chip temperature sensing circuit as set forth in claim 2 wherein said thermal sensitive transistors in said branches of said DVS comprise series stacks of transistors having their base and collector electrodes interconnected to form series stacks of transistor diodes.

12. An on-chip temperature sensing circuit as set forth in claim 11 which further includes feedback coupling means connected between one output branch of said amplifier means and the voltage supplied to the collector of the first transistor in said series stack of transistors in said branches of said DVS.

13. An on-chip temperature sensing circuit for semiconductor devices, comprising:

a differential voltage source (DVS) comprising a plurality of branches,

each of said branches of said DVS having thermal transistor means therein which provide different voltage rate of change outputs with temperature,

a first stage differential amplifier coupled to the output of said DVS branches and providing a differential voltage output,

a second stage differential amplifier coupled to the output of said first stage differential amplifier for providing an output signal which is tolerant to switching noise and is indicative of the temperature of said semiconductor device, and

each of said branches of said DVS being provided with a plurality of transistors,

said output of said plurality of transistors in said branches being coupled to the input of said first stage differential amplifier to provide said output proportional to changes in temperature of said semiconductor device,

said first stage and said second stage differential amplifier each having two branches and at least one of the output branches of said first stage differential amplifier being coupled to an input of said second stage amplifier means to provide hysteresis feedback.

14. An on-chip temperature sensing circuit as set forth in claim 13 wherein said first stage differential amplifier comprises a Darlington pair transistor differential amplifier having two output branches.

15. An on-chip temperature sensing circuit as set forth in claim 14 wherein said second stage differential amplifier comprises a differential amplifier having two branches and at least one of the output branches of said first stage differential amplifier is coupled to the input of said second stage amplifier means to provide hysteresis feedback.

16. An on-chip temperature sensing circuit as set forth in claim 13 wherein the output of said second stage amplifier means is coupled to the base of one of the thermal transistor means in one of the branches of said DVS to provide a hysteresis feedback loop signal and feedback for on-off switching.

17. An on-chip temperature sensing circuit as set forth in claim 13 wherein the output of said second branch of said first stage differential amplifier is in digital form indicative of a predetermined threshold temperature switching point of said second differential stage amplifier.