Method for the preparation of electronic and electro-optical components and circuits using conductive polymers

• US 5,213,983 A
• Filed: 12/20/1990
• Issued: 05/25/1993
• Est. Priority Date: 01/04/1990
• Status: Expired due to Fees

• Current Assignee: Neste Oy (Neste Corporation)
• Original Assignee: Neste Oy (Neste Corporation)
• Inventors: Inganas, Olle, Gustafsson, Goran, Sundberg, Mats
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): HORTON, KENNETH
• Application Number:
  US07/630,527
• Time in Patent Office: 887 Days
• Field of Search: 437/1, 437/974, 437/86, 437/163, 148/DIG. 12, 148/DIG. 139, 148/DIG. 140, 357/8, 357/71, 264/272.17, 252/182.13, 252/182.23, 252/182.32
• US Class Current: 438/82
• CPC Class Codes: H01B 1/127 comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
• CPC Class Codes: H10K 10/23 Schottky diodes
• CPC Class Codes: H10K 10/46 Field-effect transistors, e.g. organic thin-film transistors [OTFT] H10K10/43 takes precedence
• CPC Class Codes: H10K 10/462 Insulated gate field-effect transistors [IGFETs]
• CPC Class Codes: H10K 10/464 Lateral top-gate IGFETs comprising only a single gate
• CPC Class Codes: H10K 10/466 Lateral bottom-gate IGFETs comprising only a single gate
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes
• CPC Class Codes: H10K 85/111 comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
• CPC Class Codes: H10K 85/113 Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 148/14 Schottky barrier contacts

Abstract

The invention relates to a method for the preparation of electronic and electro-optical components and circuits based on conducting polymers. One or more boundary surfaces in the component between a conducting polymer and another material are formed by melting of the conducting polymer.

Claims

1. Method for the preparation of electronic and electro-optical components and circuits, which comprises melting a meltable conducting polymer in contact with at least one substrate surface of a material other than the conducting polymer to form a boundary surface between the conducting polymer and said other material.

2. Method according to claim 1 wherein a boundary surface between said conducting polymer and said other material which is a metal is formed by pressing the surfaces of the conducting polymer and the metal against each other under sufficient heat to melt the polymer, whereby the polymer and the metal become fixed to each other.

3. Method according to claim 1 wherein the other material is an insulating material and the boundary surface is formed by pressing the polymer and insulating material against each other under sufficient heat to melt the polymer in such manner that the polymer and insulator become fixed to each other.

4. Method according to claim 1 wherein the other material is a semiconductor and the boundary surface is formed by pressing the conducting polymer and semiconductor together under sufficient heat to melt the polymer whereby the conducting polymer becomes fixed to the semiconductor.

5. Method according to claim 2 wherein the metal provides ohmic contact with the contacting polymer.

6. Method according to claim 2 wherein the metal is Au, Cr, Ti, In or Pt.

7. Method according to claim 3 wherein the insulator is an inorganic or polymeric insulator.

8. Method according to claim 4 wherein the semiconductor is Si, an amorphous silicon hydride (a-Si;

H), GaAs, CuInSe or a polymer semiconducting polymer.

9. Method according to claim 1 wherein the conducting polymer is a meltable poly(3-octylthiophene), poly(3-alkylthiophene), poly(alkylthiophene vinyl) or polyalkylpyrrolidine.