Method of mounting silicon wafers on metallic mounting surfaces
First Claim
Patent Images
1. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),comprising the steps ofapplying a metallization (11) to at least one major surface of said semiconductor wafer (10);
- andsoldering the thus-metallized major surface directly to said metallic mounting surface of said valve body (20).
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Accused Products
Abstract
A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.
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Citations
8 Claims
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1. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),
comprising the steps of applying a metallization (11) to at least one major surface of said semiconductor wafer (10); - and
soldering the thus-metallized major surface directly to said metallic mounting surface of said valve body (20). - View Dependent Claims (2, 3)
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4. Method of mounting a semiconductor wafer (10) on a metallic mounting surface of a valve body (20),
comprising the steps of applying a metallization (11) to at least one major surface of said semiconductor wafer (10); -
soldering the thus-metallized major surface to a mounting surface of an intermediate element (25'"'"'); and securing said intermediate element (25'"'"') to said valve body (20). - View Dependent Claims (5, 6, 7, 8)
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Specification