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Semiconductor device having a pad array carrier package

DC
  • US 5,216,278 A
  • Filed: 03/02/1992
  • Issued: 06/01/1993
  • Est. Priority Date: 12/04/1990
  • Status: Expired due to Term
First Claim
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1. A semiconductor device having a pad array carrier package comprising:

  • a carrier substrate having a die attach surface opposite a package mounting surface;

    an electronic component mounted on the die attach surface;

    a plurality of bonding pads arrayed on a face of the electronic component;

    a plurality of vias in the carrier substrate, each via located at a predetermined distance from a selected bonding pad on the electronic component, wherein the predetermined distance is variable and is chosen to minimize signal impedance through the via;

    a plurality of package leads overlying the die attach surface and extending from the die attach surface through the vias to terminal solder pads on the package mounting surface which are displaced away from the vias;

    a plurality of solder balls which are displaced away from the vias and joined to the terminal solder pads;

    electrical connections between the bonding pads on the electronic component and the package leads on the die attach surface; and

    protection means overlying at least the electronic component and the electrical connections.

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