Bridge electrodes for microelectromechanical devices

• US 5,216,490 A
• Filed: 08/03/1990
• Issued: 06/01/1993
• Est. Priority Date: 01/13/1988
• Status: Expired due to Term

• Current Assignee: Charles Stark Draper Laboratory Incorporated
• Original Assignee: Charles Stark Draper Laboratory Incorporated
• Inventors: Bernstein, Jonathan J., Greiff, Paul
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): BOWERS, COURTNEY
• Application Number:
  US07/562,581
• Time in Patent Office: 1,033 Days
• Field of Search: 357/25, 357/26, 357/65, 357/53, 357/52, 338/4
• US Class Current: 73/514.35
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends

Abstract

A bridge electrode structure and method of fabrication thereof is provided that is adapted to provide electrically isolated metal bridges over the active portions of a monolithic micromechanical transducer. The bridge electrode of the invention is also adapted to operate in facing relationship with one or more buried electrodes, providing top-to-bottom symmetry for balanced application of forces, or motion detection when used in conjunction with transducer elements. The transducer, typically a gyroscope or an accelerometer, includes a semiconductor substrate and active elements etched out of the substrate, the active elements including flexure-supported transducer plates. The bridge electrodes are anchored at opposing points on the substrate'"'"'s surface to metal layers used to facilitate their electro-forming. The central portions of the bridge are electroplated over an insulating spacer, such as a photoresist layer.

Claims

1. A bridge electrode assembly formed by a photolithographic process on a substrate, and for use in conjunction with a microelectromechanical transducer that includes a transducer element, said assembly comprising:

an electrode extending as a bridge from a first point to a second point on a surface of said substrate, and over at least a portion of said transducer element;

a conductor in electrical contact with said bridge electrode operative to provide electrical connection to said bridge electrode;

a buried electrode within said substrate, said buried electrode extending under at least a portion of said transducer element, and confronting said bridge electrode; and

a conductor in electrical contact with said buried electrode, for providing electrical connection to said buried electrode, and for providing at least one of balanced application of forces and symmetry for symmetrical motion detection to said transducer element when paired and utilized with said bridge electrode.

2. The bridge electrode assembly of claim 1, further comprising a shielding electrode photolithographically formed between said bridge electrode and said transducer element and extending from said substrate surface over a portion of said transducer element less than the portion over which said bridge electrode extends.

3. The bridge electrode assembly of claim 1 wherein said bridge electrode is fabricated including a conductor selected from the group consisting of polysilicon, gold and nickel.

4. Apparatus for detection of motion of a micromechanical transducer element included in a microelectromechanical transducer formed in a substrate comprising:

an electrode extending as a bridge from a first point to a second point on a surface of said substrate, and over a portion of said transducer;

a conductor in electrical contact with said bridge electrode operative to provide electrical connection to said bridge electrode;

a buried electrode within said substrate, said buried electrode extending under at least a portion of said transducer element, and confronting said bridge electrode; and

a conductor in electrical contact with said buried electrode, for providing electrical connection to said buried electrode, and for providing at least one of balanced application of forces and symmetry for symmetrical motion detection to said transducer element when paired and utilized with said bridge electrode.

5. The apparatus of claim 4, further comprising an electrical shielding electrode disposed between said bridge electrode and a portion of said transducer element.

6. Apparatus for application of force to a micromechanical transducer element included in a microelectromechanical transducer formed in a substrate comprising:

an electrode extending as a bridge from a first point to a second point on a surface of said substrate, and over a portion of said transducer;

a conductor in electrical contact with said bridge electrode operative to provide electrical connection to said bridge electrode;

a buried electrode within said substrate, said buried electrode extending under at least a portion of said transducer element, and confronting said bridge electrode; and

a conductor in electrical contact with said buried electrode, for providing electrical connection to said buried electrode, and for providing at least one of balanced application of forces and symmetry for symmetrical motion detection to said transducer element when paired and utilized with said bridge electrode.

7. The apparatus of claim 6, further comprising electrical shielding electrode disposed between said bridge electrode and a portion of said transducer element.

8. A bridge electrode assembly formed by a photolithographic process on a substrate, for use in conjunction with a microelectromechanical transducer that includes a transducer element, said assembly comprising:

an electrode extending as a bridge from a first point to a second point on a surface of said substrate, and over at least a portion of said transducer element;

a conductor in electrical contact with said bridge electrode, for providing electrical connection to said bridge electrode; and

a shielding electrode disposed between said bridge electrode and said transducer element, and extending from said substrate surface over a portion of said transducer element less than the portion over which said bridge electrode extends.

9. A bridge electrode assembly formed by a photolithographic process on a substrate, for use in conjunction with a microelectromechanical transducer that includes a transducer element, said assembly comprising:

an electrode extending as a bridge from a first point to a second point on a surface of said substrate, and over at least a portion of said transducer element;

a conductor in electrical contact with said bridge electrode, for providing electrical connection to said bridge electrode;

a buried electrode within said substrate, said buried electrode extending under at least a portion of said transducer element, and confronting said bridge electrode;

a conductor in electrical contact with said buried electrode, for providing electrical connection to said buried electrode, for providing at least one of balanced application of forces and symmetry for symmetrical motion detection to said transducer element when paired and utilized with said bridge electrode; and

a shielding electrode disposed between said bridge electrode and said transducer element, and extending from said substrate surface over a portion of said transducer element less than the portion over which said bridge electrode extends.

10. A bridge electrode assembly for use in conjunction with a microelectromechanical transducer that includes a transducer element, said assembly comprising:

a substrate in which is formed said transducer including a transducer element;

at least one multi-layered bridge electrode extending from a first point to a second point on a surface of said substrate, and disposed over at least a portion of said transducer element, said multi-layered bridge electrode comprising a plurality of bonded layers, each layer of said bonded, multi-layered bridge electrode comprising one of a plurality of metals; and

a conductor in electrical contact with said multi-layered bridge electrode, for providing electrical connection to said multi-layered bridge electrode wherein said assembly further includes a shield layer extending from said substrate surface over a portion of said transducer element for forming a shielding electrode between said bridge electrode and said transducer element.

11. The bridge electrode assembly of claim 10 wherein said plurality of metals are selected from the group consisting of a titanium-tungsten alloy, gold, titanium, vanadium, silver, palladium, copper, and nickel.

12. The bridge electrode assembly of claim 10 further including a buried electrode within said substrate, said buried electrode extending under at least a portion of said transducer element, and confronting said bridge electrode, and for providing at least one of balanced application of forces and symmetry for symmetrical motion detection to said transducer element when paired and utilized with said bridge electrode.