Optimized integral heat pipe and electronic circuit module arrangement

• US 5,216,580 A
• Filed: 01/14/1992
• Issued: 06/01/1993
• Est. Priority Date: 01/14/1992
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Schulte, John, Davidson, Howard L., Ettehadieh, Ehsan
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/820,569
• Time in Patent Office: 504 Days
• Field of Search: 174/15.2, 62/418, 361/385, 361/382, 357/82, 165/80.4, 165/80.5, 165/104.23, 165/104.26, 165/104.33
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 2013/005 Thermal joints
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.

Claims

1. An optimized integral heat pipe and electronic circuit assembly comprising:

a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface;

heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements;

a layer of titanium adhered to and extending substantially over the top surface of said multichip module;

a layer of high-purity copper adhered to and extending substantially over said layer of titanium;

a thermal wick adhered to and extending substantially over said layer of high-purity copper, said thermal wick drawing said working fluid to a heated region of said multichip circuit module.

2. The assembly as set forth in claim 1, wherein said thermal wick comprises sintered copper.

3. The assembly as set forth in claim 1, wherein said thermally conductive multichip module comprises aluminum oxide.

4. The assembly as set forth in claim 1, wherein said thermally conductive multichip module comprises aluminum nitride.

5. An optimized integral heat pipe and electronic circuit assembly comprising:

a thermally conductive multichip circuit module having top and bottom surfaces and a periphery, said multichip circuit module including a multiplicity of heat producing electronic circuit elements mounted to said bottom surface, said multichip module comprising diamond;

heat pipe means hermetically coupled to and enclosing the top surface of said multichip circuit module, said heat pipe means enclosing a working fluid for generating an evaporated working fluid vapor when said heat pipe means receives heat produced by said heat producing electronic circuit elements;

a primer layer adhered to and extending substantially over the top surface of said multichip module;

a thermal wick adhered to and extending substantially over said primer layer, said thermal wick drawing said working fluid to a heated region of said multichip circuit module;

wherein said thermal wick comprises sintered copper.