Polishing pad conditioning apparatus for wafer planarization process

• US 5,216,843 A
• Filed: 09/24/1992
• Issued: 06/08/1993
• Est. Priority Date: 09/24/1992
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Intel Corporation
• Inventors: Blanchard, Loren R., Prince, Matthew J., Breivogel, Joseph R.
• Primary Examiner(s): Kisliuk, Bruce M.
• Assistant Examiner(s): MORGAN, EILEEN P
• Application Number:
  US07/950,812
• Time in Patent Office: 257 Days
• Field of Search: 51/129, 51/131.1, 51/131.3, 51/131.4, 51/131.5, 51/236, 51/237 R, 51/240 T, 51/317, 51/323, 51/324, 51/325, 51/292, 51/263, 51/5 D , 51/209 DL, 51/277
• US Class Current: 451/285
• CPC Class Codes: B24B 37/26 characterised by the shape of the lapping pad surface, e.g. grooved
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.

Claims

1. An apparatus for polishing a thin film formed on a semiconductor substrate, said apparatus comprising:

rotatable table;

means for rotating said table;

a pad covering said table, said pad having an upper surface into which have been formed a plurality of preformed grooves, said preformed grooves facilitating the polishing process by creating a corresponding plurality of point contacts at the pad/substrate interface;

means for depositing an abrasive slurry on said upper surface of said pad;

means for forcibly pressing said substrate against said pad such that rotational movement of said table relative to said substrate together with said slurry results in planarization of said thin film; and

means for providing a plurality of microchannel grooves into said upper surface of said pad while polishing said substrate wherein said microchannel grooves aid in facilitating said polishing process by channeling said slurry between said substrate and said pad.

2. The apparatus of claim 1 wherein said plurality of preformed grooves are substantially circumferential grooves.

3. The apparatus of claim 1 wherein said plurality of microchannel grooves are substantially radial grooves.

4. The apparatus of claim 1 wherein said plurality of preformed grooves are circumferential grooves, and wherein said plurality of said microchannel grooves are radial grooves.

5. The apparatus of claim 4 wherein there are approximately 2-32 of said preformed grooves per radial inch in said surface of said pad.

6. The apparatus of claim 4 wherein said plurality of microchannel grooves are approximately 40 microns deep.

7. The apparatus of claim 4 wherein said microchannel providing means comprises:

a diamond holder block having a plurality of threaded diamond-tipped shanks embedded into a substantially planar bottom surface of said block such that said diamond tips protrude from said surface of said block;

a conditioner arm having one end coupled to said block and the other end coupled to means for pivoting said conditioner arm about a pivot point such that said diamond holder block sweeps in a radial direction across a predetermined portion of said pad.

8. The apparatus of claim 7 wherein said microchannel providing means sweeps across said predetermined portion of said pad at a rate of approximately seven times per revolution of said pad.

9. The apparatus of claim 7 wherein said conditioner arm is coupled to said diamond holder block by a ball and socket joint.

10. The apparatus of claim 7 wherein said means for pivoting said conditioner arm is a variable speed osillating motor.

11. In a semiconductor substrate polishing apparatus of the type which includes a rotatable table covered with a pad onto which is deposited an abrasive slurry, a means for rotating said table and a means for pressing said substrate against the surface of said pad such that the rotational movement of said table relative to said substrate in the presence of said slurry results in planarization of a thin film formed on said semiconductor substrate, an improvement for increasing and stabilizing the polishing rate which comprises:

means for generating a plurality of grooves in said pad while polishing said substrate wherein said grooves aid in facilitating said polishing process by channeling slurry between said substrate and said pad.

12. The improvement of claim 11 wherein a plurality of substantially circumferential grooves are formed in said pad prior to polishing.

13. The improvement of claim 12 wherein said means for providing a plurality of grooves during polishing produces grooves which are substantially radial in direction.

14. The improvement of claim 13 wherein said preformed substantially circumferential grooves are approximately 6-10 times deeper than said radial grooves formed by said groove generating means.

15. The improvement of claim 13 wherein said radial grooves and said circumferential grooves have triangular cross-sectional shapes.

16. An apparatus for polishing a surface of a material, said apparatus comprising:

rotatable table;

means for rotating said table;

a pad covering said table, said pad having an upper surface into which have been formed a plurality of preformed grooves, said preformed grooves facilitating the polishing process by creating a corresponding plurality of point contacts at the pad/material interface;

means for depositing an abrasive slurry on said upper surface of said pad;

means for forcibly pressing said material against said pad such that rotational movement of said table relative to said material together with said slurry results in planarization of said material; and

means for providing a plurality of microchannel grooves into said upper surface of said pad while polishing said material wherein said microchannel grooves aid in facilitating said polishing process by channeling said slurry between material and said pad.