Microchannel cooling of face down bonded chips
First Claim
1. An apparatus comprising:
- a circuit board;
an integrated circuit chip having a first major side facing the circuit board, and a second major side;
an integrated circuit on the chip, having a plurality of bond sites on the first major side of the chip;
means for connecting the plurality of bond sites on the first major side of the chip to the circuit board;
a microchannel structure essentially permanently coupled with the second major side of the chip providing a coolant flow path in heat flow communication with the chip;
a removable coolant delivery manifold for delivering coolant to the microchannel structure; and
a seal between the coolant delivery manifold and the microchannel structure.
5 Assignments
0 Petitions
Accused Products
Abstract
Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.
180 Citations
23 Claims
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1. An apparatus comprising:
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a circuit board; an integrated circuit chip having a first major side facing the circuit board, and a second major side; an integrated circuit on the chip, having a plurality of bond sites on the first major side of the chip; means for connecting the plurality of bond sites on the first major side of the chip to the circuit board; a microchannel structure essentially permanently coupled with the second major side of the chip providing a coolant flow path in heat flow communication with the chip; a removable coolant delivery manifold for delivering coolant to the microchannel structure; and a seal between the coolant delivery manifold and the microchannel structure. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus comprising:
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a circuit board having a first major side, and a plurality of chip interconnects having bond sites accessible at the first major side; a plurality of integrated circuit modules mounted on the first major side of the circuit board, the integrated circuit modules including an integrated circuit having a plurality of bond sites on a first major side of the module, a plurality of grooves in a second major side of the module, and a cover manifold, having a first opening and a second opening, and bonded on the second major side of the module over the grooves to provide a coolant path from the first opening to the second opening through the plurality of grooves; and a coolant supply manifold providing a coolant path to cover manifolds of at least a subset of the plurality of integrated circuit modules; a seal between the coolant supply manifold and the subset of the plurality of integrated circuit modules; and means for connecting the plurality of bond sites on the integrated circuit modules to the bond sites of the chip interconnects on the circuit board. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. An apparatus comprising:
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a stack of circuit boards having first and second major surfaces, and side surfaces, circuit boards in the stack including respective pluralities of chip interconnects having bond sites accessible at the first major surfaces, and respective pluralities of contact sites on the second major surfaces in electrical communication with the chip interconnects; a plurality of integrated circuit modules mounted on the first major surface of a given circuit board in the stack in electrical communication with the bond sites of respective pluralities of chip interconnects, wherein the integrated circuit modules comprise an integrated circuit having a plurality of bond sites on a first major side of the module facing the given circuit board, and a microchannel structure in heat flow communication with the integrated circuit; a plurality of perimeter wall members, mounted near perimeters of respective circuit boards in the stack, and spacing adjacent circuit boards in the stack apart; a coolant supply manifold between the given circuit board and an adjacent circuit board in the stack providing a coolant path from a side of the stack to microchannel structures of integrated circuit modules on the given circuit board; and a seal between the coolant supply manifold and the plurality of integrated circuit modules on the given circuit board. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification