Microchannel cooling of face down bonded chips

• US 5,218,515 A
• Filed: 03/13/1992
• Issued: 06/08/1993
• Est. Priority Date: 03/13/1992
• Status: Expired due to Term

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: United States Department of Energy
• Inventors: Bernhardt, Anthony F.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/850,634
• Time in Patent Office: 452 Days
• Field of Search: 174/16.3, 165/80.4, 165/185, 357/81, 357/82, 361/381, 361/382, 361/385-389, 361/392, 361/394, 361/412
• US Class Current: 361/689
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Claims

1. An apparatus comprising:

a circuit board;

an integrated circuit chip having a first major side facing the circuit board, and a second major side;

an integrated circuit on the chip, having a plurality of bond sites on the first major side of the chip;

means for connecting the plurality of bond sites on the first major side of the chip to the circuit board;

a microchannel structure essentially permanently coupled with the second major side of the chip providing a coolant flow path in heat flow communication with the chip;

a removable coolant delivery manifold for delivering coolant to the microchannel structure; and

a seal between the coolant delivery manifold and the microchannel structure.

2. The apparatus of claim 1, wherein the microchannel structure comprises a grooved substrate bonded to the second major side of the integrated circuit chip, and a cover manifold over the grooved substrate providing a coolant flow path to the grooved substrate.

3. The apparatus of claim 1, wherein the microchannel structure comprises a plurality of grooves in the second major side of the integrated circuit chip, and a cover manifold over the plurality of grooves providing a coolant flow path to the plurality of grooves.

4. The apparatus of claim 1, wherein the circuit board comprises a substrate having a thin film interconnect structure, the thin film interconnect structure including a plurality of bond sites coupled to the means for connecting.

5. The apparatus of claim 1, wherein the means for connecting comprise controlled-collapse bonds.

6. The apparatus of claim 1, wherein the seal comprises a compressible elastomer.

7. An apparatus comprising:

a circuit board having a first major side, and a plurality of chip interconnects having bond sites accessible at the first major side;

a plurality of integrated circuit modules mounted on the first major side of the circuit board, the integrated circuit modules including

an integrated circuit having a plurality of bond sites on a first major side of the module,

a plurality of grooves in a second major side of the module, and

a cover manifold, having a first opening and a second opening, and bonded on the second major side of the module over the grooves to provide a coolant path from the first opening to the second opening through the plurality of grooves; and

a coolant supply manifold providing a coolant path to cover manifolds of at least a subset of the plurality of integrated circuit modules;

a seal between the coolant supply manifold and the subset of the plurality of integrated circuit modules; and

means for connecting the plurality of bond sites on the integrated circuit modules to the bond sites of the chip interconnects on the circuit board.

8. The apparatus of claim 7, wherein the means for connecting provides for removable bonding to the circuit board so that integrated circuit modules may be selectively replaced.

9. The apparatus of claim 7, wherein the means for connecting comprise controlled-collapse bonds.

10. The apparatus of claim 7, wherein the seal comprises a compressible elastomer.

11. The apparatus of claim 7, wherein the integrated circuit modules comprise an integrated circuit chip, and the grooves are formed in a microchannel structure essentially permanently coupled with the chip.

12. The apparatus of claim 11, wherein the microchannel structure comprises a grooved substrate bonded to the integrated circuit chip.

13. The apparatus of claim 11, wherein the microchannel structure comprises a plurality of grooves formed in the integrated circuit chip.

14. The apparatus of claim 7, wherein the coolant supply manifold includes:

a supply vessel having a plurality of ports for mating with the first openings on the cover manifolds of the integrated circuit modules on the circuit board; and

a return vessel having a plurality of ports for mating with the second openings on the cover manifolds of the integrated circuit modules on the circuit board.

15. An apparatus comprising:

a stack of circuit boards having first and second major surfaces, and side surfaces, circuit boards in the stack including respective pluralities of chip interconnects having bond sites accessible at the first major surfaces, and respective pluralities of contact sites on the second major surfaces in electrical communication with the chip interconnects;

a plurality of integrated circuit modules mounted on the first major surface of a given circuit board in the stack in electrical communication with the bond sites of respective pluralities of chip interconnects, wherein the integrated circuit modules comprise

an integrated circuit having a plurality of bond sites on a first major side of the module facing the given circuit board, and

a microchannel structure in heat flow communication with the integrated circuit;

a plurality of perimeter wall members, mounted near perimeters of respective circuit boards in the stack, and spacing adjacent circuit boards in the stack apart;

a coolant supply manifold between the given circuit board and an adjacent circuit board in the stack providing a coolant path from a side of the stack to microchannel structures of integrated circuit modules on the given circuit board; and

a seal between the coolant supply manifold and the plurality of integrated circuit modules on the given circuit board.

16. The apparatus of claim 15, further including:

a first plurality of thin film board interconnects on the perimeter wall members, for interconnecting chip interconnects on circuit boards in the stack with contact sites on the second major surfaces of adjacent circuit boards.

17. The apparatus of claim 15, including removable bonds between the integrated circuit modules and the given circuit board so that the integrated circuit modules may be selectively replaced.

18. The apparatus of claim 17, wherein the removable bonds comprise controlled-collapse bonds.

19. The apparatus of claim 15, wherein the seal comprises a compressible elastomer.

20. The apparatus of claim 15, wherein the integrated circuit modules comprise an integrated circuit chip, having an integrated circuit on a first major surface, and the microchannel structure comprise a grooved substrate essentially permanently coupled with a second major surface of the chip.

21. The apparatus of claim 15, wherein the integrated circuit modules comprise an integrated circuit chip, having an integrated circuit on a first major surface, and the microchannel structure comprises a plurality of grooves in a second major surface of the chip.

22. The apparatus of claim 15, wherein the microchannel structure comprises:

a substrate having plurality of grooves, and

a cover manifold, having a first opening and a second opening, and bonded over the grooves near the second major surface of the module to provide a coolant path from the first opening to the second opening through the plurality of grooves.

23. The apparatus of claim 15, wherein the coolant supply manifold includes:

a supply vessel having a plurality of ports for mating with the microchannel structures on at least a subset of the plurality of integrated circuit modules on the given circuit board; and

a return vessel having a plurality of ports for mating with the microchannel structures on at least the subset of the plurality of integrated circuit modules on the given circuit board.