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Method of fabricating image sensor dies and the like for use in assembling arrays

  • US 5,219,796 A
  • Filed: 11/04/1991
  • Issued: 06/15/1993
  • Est. Priority Date: 11/04/1991
  • Status: Expired due to Term
First Claim
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1. A method of fabricating a high resolution image sensor die from a <

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    silicon wafer to form a precision face at each end of said die to enable said die to be abutted end-to-end with other like dies to form a longer array without image loss or distortion at the ends where said dies are abutted, comprising the steps of;

    a) forming a first groove in one side of said wafer delineating where the die is to be separated from said wafer with the wall of said first groove next to the die being relatively wide and parallel to the <

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    crystalline plane of said wafer;

    b) forming a second groove in the opposite side of said wafer opposite said first groove with the axis of said second groove parallel to the axis of said first groove; and

    c) sawing said wafer along said first groove with one edge of the cut made by sawing being nominally centered on said relatively wide wall of said first groove with said relatively wide wall allowing for misalignment of the cut made by sawing while providing a remaining wall section to prevent development of fractures in the die along the cut.

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